-
europepmc
2025
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2020
置信度 0.80
-
europepmc
2022
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2026
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2020
置信度 0.80
-
europepmc
2023
置信度 0.80
-
A detailed investigation to understand the mechanism of the resist action at a fundamental level is essential for future Extreme Ultraviolet Lithography (EUVL) resists. The photodynamics study of a newly developed hybrid nonchemically amplified 2.15%-MAPDSA-MA…
pubmed
Moura CADS, Belmonte GK, Reddy PG, Gonslaves KE 等
2018
置信度 0.82
-
europepmc
2024
置信度 0.80
-
europepmc
2025
置信度 0.80
-
europepmc
2023
置信度 0.80
-
europepmc
2022
置信度 0.80
-
europepmc
2021
置信度 0.80
-
europepmc
2021
置信度 0.80
-
europepmc
2021
置信度 0.80
-
europepmc
2025
置信度 0.80
-
europepmc
2020
置信度 0.80
-
europepmc
2020
置信度 0.80
-
europepmc
2017
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2020
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2021
置信度 0.80
-
The gate-all-around (GAA) nanosheet (NS) field-effect-transistor (FET) is poised to replace FinFET in the 3 nm CMOS technology node and beyond, marking the second seminal shift in device architecture across the extensive 60-plus-year history of MOSFET. The int…
europepmc
Miaomiao Wang
2024
置信度 0.80
-
europepmc
2022
置信度 0.80
-
europepmc
2024
置信度 0.80
-
europepmc
2021
置信度 0.80
-
europepmc
2022
置信度 0.80
-
europepmc
2021
置信度 0.80
-
europepmc
2017
置信度 0.80
-
europepmc
2024
置信度 0.80
-
crossref
Indira Seshadri
2024-04-09T17:57:11Z
置信度 0.70
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crossref
Kurt Ronse
2024-03-27T18:51:22Z
置信度 0.70
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crossref
Harry J. Levinson
2024-09-18T18:54:50Z
置信度 0.70
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crossref
2009-12-04T17:05:29Z
置信度 0.70
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crossref
2009-12-04T22:05:29Z
置信度 0.70
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crossref
Harry J. Levinson
2025-12-02T16:36:08Z
置信度 0.70
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crossref
Harry J. Levinson
2025-12-02T16:36:09Z
置信度 0.70
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crossref
Tsumoru Shintake
2024-08-26T23:58:38Z
置信度 0.70
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crossref
Harry J. Levinson
2025-12-02T16:36:10Z
置信度 0.70
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crossref
Rikuya Imai, Shinji Yamakawa, Tetsuo Harada
2024-09-24T19:17:09Z
置信度 0.70
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crossref
2018-02-09T01:06:20Z
置信度 0.70
-
crossref
2010-11-09T18:48:49Z
置信度 0.70
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crossref
2010-11-09T23:48:49Z
置信度 0.70
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crossref
2018-02-09T01:06:21Z
置信度 0.70
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crossref
Harry J. Levinson
2025-12-02T16:36:09Z
置信度 0.70
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crossref
Ko Gondaira, Toshiyuki Todoroki, Masayasu Nishizawa, Hiroki Miyai
2024-04-09T17:22:59Z
置信度 0.70
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crossref
Iason Giannopoulos, Iacopo Mochi, Michaela Vockenhuber, Yasin Ekinci 等
2024-04-09T17:58:27Z
置信度 0.70
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crossref
Ethan Maguire, Bruce Smith
2024-04-09T17:22:21Z
置信度 0.70
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crossref
Ryo Watanabe, Tomoro Ide, Shohei Sakuma, Tomohiro Suzuki
2024-08-26T23:58:32Z
置信度 0.70
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crossref
David Ruzic
2010-11-09T18:48:49Z
置信度 0.70
-
crossref
Andreas Erdmann
2021-02-23T20:16:50Z
置信度 0.70
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crossref
Christopher W. Maloney, Bruce W. Smith
2012-03-23T09:24:08Z
置信度 0.70
-
crossref
Harry J. Levinson
2020-11-09T23:59:52Z
置信度 0.70
-
Emission characteristics for laser-driven EUV lithographic plasma sources have been studied exhaustively for the last four years. While debris issues now dominate research in this area, final details are being concluded on our understanding of material spectra…
crossref
Paul D. Rockett, John A. Hunter, Glenn D. Kubiak, Kevin Krenz 等
2023-02-15T15:37:46Z
置信度 0.70
-
crossref
André Egbert, Boris Chichkov
2010-11-09T23:48:49Z
置信度 0.70
-
crossref
Anthony Yen
2016-06-17T00:53:26Z
置信度 0.70
-
crossref
Joren Severi, Gian Lorusso, Danilo De Simone, Chris A. Mack
2021-02-19T22:14:44Z
置信度 0.70
-
crossref
Bernhard Lüttgenau, Sascha Brose, Serhiy Danylyuk, Jochen Stollenwerk 等
2020-03-23T22:46:15Z
置信度 0.70
-
crossref
Harry J. Levinson
2020-11-09T23:59:53Z
置信度 0.70
-
<p>This article describes all the steps that need to be taken to develop a high volume manufacturing process for advanced EUV scanners. It covers EUV masks, EUV pellicles, EUV wafer materials such as EUV resists, underlayers,... Also the metrology needs …
crossref
Kurt Ronse
2023-10-25T12:21:38Z
置信度 0.70
-
This article describes all the steps that need to be taken to develop a high volume manufacturing process for advanced EUV scanners. It covers EUV masks, EUV pellicles, EUV wafer materials such as EUV resists, underlayers,… Also the metrology needs are covered…
crossref
Kurt Ronse
2023-10-25T08:21:35Z
置信度 0.70
-
crossref
Lianjia Wu, Michaela Vockenhuber, Yasin Ekinci, Sonia Castellanos Ortega
2019-03-26T20:23:50Z
置信度 0.70
-
The cost of fabricating state-of-the-art integrated circuits (ICs) has been increasing and it will likely be economic rather than technical factors that ultimately limit the progress of ICs toward smaller devices. It is estimated that lithography currently acc…
crossref
Andrew M. Hawryluk, Natale M. Ceglio
2023-02-15T10:36:34Z
置信度 0.70
-
crossref
Malcolm Gower
2009-12-04T17:05:29Z
置信度 0.70
-
crossref
Umi Fujimoto, Tetsuo Harada, Shinji Yamakawa, Takeo Watanabe
2024-08-26T23:58:28Z
置信度 0.70
-
crossref
Tatyana Sizyuk, Ahmed Hassanein
2014-04-17T16:38:15Z
置信度 0.70
-
crossref
Sudharshanan Raghunathan, Greg McIntyre, Germain Fenger, Obert Wood
2013-04-01T18:31:55Z
置信度 0.70
-
crossref
T. Sizyuk, A. Hassanein
2012-03-23T09:24:08Z
置信度 0.70
-
crossref
Yashdeep Khopkar, Gregory Denbeaux, Vibhu Jindal
2014-04-17T16:38:15Z
置信度 0.70
-
crossref
2010-04-21T18:08:58Z
置信度 0.70
-
A four-mirror 4x reduction ring-field system for EUV projection lithography at 13.0 nm wavelength is described.
crossref
Tanya E. Jewell
2023-02-15T10:37:07Z
置信度 0.70
-
A condenser system couples a radiation source to an imaging system. We have designed a critical illumination condenser system which meets the technical challenges of extreme ultraviolet projection lithography based on a ring field imaging system and a laser pr…
crossref
Simon J. Cohen, Lynn G. Seppala
2023-02-15T15:36:40Z
置信度 0.70
-
crossref
Martin Burkhardt, Anuja de Silva, Jennifer Church, Luciana Meli 等
2019-03-14T17:13:39Z
置信度 0.70
-
crossref
Frank Scholze, Gerhard Ulm
2010-11-09T23:48:49Z
置信度 0.70
-
crossref
Chan Hwang
2024-04-09T17:53:01Z
置信度 0.70
-
crossref
Takumi Furuya
2026-02-19T20:08:04Z
置信度 0.70
-
crossref
Kiwamu Takehisa
2024-09-24T19:17:05Z
置信度 0.70
-
crossref
Xiaolong Wang, Li-Ting Tseng, Timothee Allenet, Iacopo Mochi 等
2020-05-04T18:48:10Z
置信度 0.70
-
Abstract To support the development of advanced EUV lithography for the semiconductor industry in Taiwan, a calibration system for photodiodes’ spectral responsivity was established. The current system utilizes the synchrotron radiation light source and the me…
crossref
Yi-Chen Chuang, Cheng-Hsien Chen
2024-10-25T13:51:03Z
置信度 0.70
-
crossref
Jiahui Wang, Emily Gallagher, Darko Trivkovic, Rik Jonckheere 等
2024-04-09T17:22:57Z
置信度 0.70
-
crossref
E. Hendrickx, A. M. Goethals, A. Niroomand, R. Jonckheere 等
2008-11-20T14:53:53Z
置信度 0.70
-
crossref
Chung-Hyun Ban, In-Hwa Kang, Won-Young Choi, Hye-Keun Oh
2021-02-19T22:00:55Z
置信度 0.70
-
crossref
Michael Murphy
2025-05-28T13:58:07Z
置信度 0.70
-
crossref
M. Saib, M. Besacier, C. Constancias, P. Michallon
2010-03-18T22:10:38Z
置信度 0.70
-
crossref
Valentino Rigato
2009-12-04T22:05:29Z
置信度 0.70
-
crossref
Andreas Erdmann
2021-02-23T20:16:08Z
置信度 0.70
-
crossref
Eelco van Setten, Gerardo Bottiglieri, John McNamara, Jan van Schoot 等
2019-03-14T21:13:42Z
置信度 0.70
-
crossref
Andreas Erdmann
2021-02-23T20:17:14Z
置信度 0.70
-
Physical-optics modeling of EUVL imaging is done with accurate descriptions of the illumination. Two EUVL optical systems are described in this paper: (1) a Schwarzchild camera, illuminated with a laser-plasma source (LPS) and a simple illuminator, and (2) a r…
crossref
W. C. Sweatt, W. W. Chow
2023-02-15T15:36:50Z
置信度 0.70
-
crossref
2026-04-16T21:11:24Z
置信度 0.70
-
crossref
2026-04-16T17:56:51Z
置信度 0.70
-
Silicon power devices benefit from a mature industrial chain, but their limited bandgap, critical breakdown field, and thermal conductivity constrain efficiency and reliability under high-voltage, high-frequency, and high-temperature operation. Silicon carbide…
crossref
Jincheng Huang
2026-08-19T07:54:39Z
置信度 0.70
-
crossref
K.T. Tsen
2026-01-06T14:02:20Z
置信度 0.70
-
crossref
Jawher Makhlouf, Asmaa M Fahim, Arto Valkonen, Wajda Smirani Sta
2026-05-07T15:59:03Z
置信度 0.70
-
High-power Silicon Carbide (SiC) converters are fundamental to modern energy systems, such as HVDC transmission, but their operational reliability remains a critical challenge, this research presents an integrated computational framework designed to holistical…
crossref
Jalal Kamil
2026-05-12T08:36:48Z
置信度 0.70
-
crossref
2026-01-08T21:08:48Z
置信度 0.70
-
crossref
Yashas Satapathy, Ben J. Sekely, Tao Yang, Abraham Tishelman-Charny 等
2026-08-06T19:15:47Z
置信度 0.70