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• Material engineering in filamentary ReRAM devices for neuromorphic applications
  Motivation, Goal and Task of the Dissertation: Modern day electronic devices face a multitude of new challenges as the requirements for computing speed, energy-efficiency and scalability continue to increase. The limitations of scaling according to Moore's law…
  datacite Kempen, Tim 2025 置信度 0.66 Hochschulschriftmemory ; ReRAM ; neuromorphic ; nanotechnology ; artificial synapse
• Scanning Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review
  In this review, automatic defect inspection algorithms that analyze Scanning Electron Microscopy (SEM) images for Semiconductor Manufacturing (SM) are identified, categorized, and discussed. This is a topic of critical importance for the SM industry as the con…
  datacite Dehaerne, Enrique, Dey, Bappaditya, Blanco, Victor, Davis, Jesse 2024 置信度 0.66 Image and Video Processing (eess.IV)FOS: Electrical engineering, electronic engineering, information engineeringI.4.9
• Optimization and characterization of n- and p-type DSSCs: A road toward feasible tandem DSSCs
  Together, coal, gas, and oil possess the largest footprint of greenhouse gases on this planet. These fossil resources are mainly used to generate heat and electricity. Subsequently, the energy sector has proven hazardous to our planet's sensitive ecosystem and…
  datacite Fröhlich (Name At Birth Schol), Peter R. 2025 置信度 0.66 PhotophysicsDye-sensitized solar cellPhotovoltaicPhotochemistryMultiexciton generation
• Global Intelligent Power Module (IPM) Market 2024 To 2033
  Intelligent Power Module (IPM) Market Size, Trends and Insights By Power Device (Insulated-Gate Bipolar Transistor (IGBT), Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), Others), By Current Rating (Up to 100A, 101A to 600A, Above 600A), By Voltage…
  datacite Sirsat, Nitin 2024 置信度 0.66 Intelligent Power Module (IPM) MarketIntelligent Power Module (IPM) Market SizeIntelligent Power Module (IPM) Market ShareIntelligent Power Module (IPM) Market TrendsIntelligent Power Module (IPM) Market Report
• Global Intelligent Power Module (IPM) Market 2024 To 2033
  Intelligent Power Module (IPM) Market Size, Trends and Insights By Power Device (Insulated-Gate Bipolar Transistor (IGBT), Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), Others), By Current Rating (Up to 100A, 101A to 600A, Above 600A), By Voltage…
  datacite Sirsat, Nitin 2024 置信度 0.66 Intelligent Power Module (IPM) MarketIntelligent Power Module (IPM) Market SizeIntelligent Power Module (IPM) Market ShareIntelligent Power Module (IPM) Market TrendsIntelligent Power Module (IPM) Market Report
• Global Indium Phosphide Wafer Market 2024 To 2033
  Indium Phosphide Wafer Market Size, Trends and Insights By Type (N-Type Indium Phosphide Wafers, P-Type Indium Phosphide Wafers), By Device (Photonic Integrated Circuits (PICs), High-Speed Electronic Devices, Optical Components, RF (Radio Frequency) Devices, O…
  datacite Sirsat, Nitin 2024 置信度 0.66 Indium Phosphide Wafer MarketIndium Phosphide Wafer Market SizeIndium Phosphide Wafer Market ShareIndium Phosphide Wafer Market TrendsIndium Phosphide Wafer Market Report
• Global Indium Phosphide Wafer Market 2024 To 2033
  Indium Phosphide Wafer Market Size, Trends and Insights By Type (N-Type Indium Phosphide Wafers, P-Type Indium Phosphide Wafers), By Device (Photonic Integrated Circuits (PICs), High-Speed Electronic Devices, Optical Components, RF (Radio Frequency) Devices, O…
  datacite Sirsat, Nitin 2024 置信度 0.66 Indium Phosphide Wafer MarketIndium Phosphide Wafer Market SizeIndium Phosphide Wafer Market ShareIndium Phosphide Wafer Market TrendsIndium Phosphide Wafer Market Report
• Global Semiconductor Chip Design Market 2024 To 2033
  Semiconductor Chip Design Market Size, Trends and Insights By Component Type (Microprocessors, Microcontrollers, Digital Signal Processors (DSPs), Others), By Design Type (Custom ICs, Semi-Custom ICs, Standard Cell-Based ICs, Gate Array-Based ICs), By Applicat…
  datacite Sirsat, Nitin 2024 置信度 0.66 Semiconductor Chip Design MarketSemiconductor Chip Design Market SizeSemiconductor Chip Design Market ShareSemiconductor Chip Design Market TrendsSemiconductor Chip Design Market Report
• Global Semiconductor Chip Design Market 2024 To 2033
  Semiconductor Chip Design Market Size, Trends and Insights By Component Type (Microprocessors, Microcontrollers, Digital Signal Processors (DSPs), Others), By Design Type (Custom ICs, Semi-Custom ICs, Standard Cell-Based ICs, Gate Array-Based ICs), By Applicat…
  datacite Sirsat, Nitin 2024 置信度 0.66 Semiconductor Chip Design MarketSemiconductor Chip Design Market SizeSemiconductor Chip Design Market ShareSemiconductor Chip Design Market TrendsSemiconductor Chip Design Market Report
• Global Advanced Semiconductor Packaging Market 2024 To 2033
  Advanced Semiconductor Packaging Market Size, Trends and Insights By Type (Flip-Chip Packaging, Fan-Out Packaging, 3D Integrated Circuit (IC) Packaging, 2.5D Integrated Circuit (IC) Packaging, Others), By Application (Consumer Electronics, Automotive, Industri…
  datacite Sirsat, Nitin 2023 置信度 0.66 Advanced Semiconductor Packaging MarketAdvanced Semiconductor Packaging Market SizeAdvanced Semiconductor Packaging Market ShareAdvanced Semiconductor Packaging Market TrendsAdvanced Semiconductor Packaging Market Report
• Global Advanced Semiconductor Packaging Market 2024 To 2033
  Advanced Semiconductor Packaging Market Size, Trends and Insights By Type (Flip-Chip Packaging, Fan-Out Packaging, 3D Integrated Circuit (IC) Packaging, 2.5D Integrated Circuit (IC) Packaging, Others), By Application (Consumer Electronics, Automotive, Industri…
  datacite Sirsat, Nitin 2023 置信度 0.66 Advanced Semiconductor Packaging MarketAdvanced Semiconductor Packaging Market SizeAdvanced Semiconductor Packaging Market ShareAdvanced Semiconductor Packaging Market TrendsAdvanced Semiconductor Packaging Market Report
• First generation 4H-SiC LGAD production and its performance evaluation
  This contribution will delve into the design and performance of the newly produced Silicon Carbide Low Gain Avalanche Detectors (4H-SiC LGADs) and provide a comprehensive summary of their measured characteristics. This includes an analysis of the detector's pe…
  datacite Novotný, Radek, Chochol, Jan, Kafka, Vladimír, Klimsza, Adam 等 2025 置信度 0.66 Instrumentation and Detectors (physics.ins-det)FOS: Physical sciences
• Development of spin-qubit devices based on ZnSe/ZnMgSe heterostructures
  Electrostatically defined quantum dots (EDQDs) are a promising platform for a successful implementation of universal quantum computing utilizing millions of qubits. After single and two qubit gate fidelities above the quantum error correction threshold were de…
  datacite Khamphasithivong, Felix 2024 置信度 0.66 HochschulschriftZnSe ; molecular-beam-epitaxy ; Molekularstrahlepitaxie ; ohmic contacts ; Ohmsche Kontakte ; shadow wall epitaxy ; Schattenmaskenepitaxy
• Global 3D Laser Cutting Robot Market 2025 To 2034
  3D Laser Cutting Robot Market Size, Trends and Insights By Type (Fiber, CO2, Nd (Neodymium-doped Yttrium Aluminum Garnet), Other), By Application (Automotive, Aerospace & Defence, Consumer Electronics, Medical Devices, Industrial Manufacturing, Others), By End…
  datacite Sirsat, Nitin 2024 置信度 0.66 3D Laser Cutting Robot Market3D Laser Cutting Robot Market Size3D Laser Cutting Robot Market Share3D Laser Cutting Robot Market Trends3D Laser Cutting Robot Market Report
• Global 3D Laser Cutting Robot Market 2025 To 2034
  3D Laser Cutting Robot Market Size, Trends and Insights By Type (Fiber, CO2, Nd (Neodymium-doped Yttrium Aluminum Garnet), Other), By Application (Automotive, Aerospace & Defence, Consumer Electronics, Medical Devices, Industrial Manufacturing, Others), By End…
  datacite Sirsat, Nitin 2024 置信度 0.66 3D Laser Cutting Robot Market3D Laser Cutting Robot Market Size3D Laser Cutting Robot Market Share3D Laser Cutting Robot Market Trends3D Laser Cutting Robot Market Report
• Predictive simulations of the dynamical response of mesoscopic devices
  As the complexity of mesoscopic quantum devices increases, simulations are becoming an invaluable tool for understanding their behavior. This is especially true for the superconductor-semiconductor heterostructures used to build Majorana-based topological qubi…
  datacite Boutin, Samuel, Karzig, Torsten, Dandachi, Tareq El, Mishmash, Ryan V. 等 2025 置信度 0.66 Mesoscale and Nanoscale Physics (cond-mat.mes-hall)Quantum Physics (quant-ph)FOS: Physical sciencesFOS: Physical sciences
• Global High Voltage Solid State Transformer Market 2025 To 2034
  High Voltage Solid State Transformer Market Size, Trends and Insights By Type (Power Transformer, Distribution Transformer, Traction Transformer), By Stage (One Stage SST, Two Stage SST, Three Stage SST), By Application (Power Generation, Power Grid, Electric …
  datacite Sirsat, Nitin 2024 置信度 0.66 High Voltage Solid State Transformer MarketHigh Voltage Solid State Transformer Market SizeHigh Voltage Solid State Transformer Market TrendsHigh Voltage Solid State Transformer Market ReportHigh Voltage Solid State Transformer Market Research
• Global High Voltage Solid State Transformer Market 2025 To 2034
  High Voltage Solid State Transformer Market Size, Trends and Insights By Type (Power Transformer, Distribution Transformer, Traction Transformer), By Stage (One Stage SST, Two Stage SST, Three Stage SST), By Application (Power Generation, Power Grid, Electric …
  datacite Sirsat, Nitin 2024 置信度 0.66 High Voltage Solid State Transformer MarketHigh Voltage Solid State Transformer Market SizeHigh Voltage Solid State Transformer Market TrendsHigh Voltage Solid State Transformer Market ReportHigh Voltage Solid State Transformer Market Research
• 2D materials technology for RF integrated electronics
  Flexible electronics is a promising field of research, whose potential has been explored in recent years. The technological benefits that a fully developed flexible electronics industry can bring are enormous, ranging from small, connected and lightweight wear…
  datacite Reato, Eros 2025 置信度 0.66 HochschulschriftTMDC ; MoS2 ; flexible electronics ; radio-frequency ; integration
• Modeling the spatio-temporal evolution of oxygen vacancies in valence change memory cells
  Valence change memory is a promising type of non-volatile memory for next-generation applications. Compared to contemporary NAND Flash, valence change memory cells exhibit advantages such as lower power consumption and faster operating speeds. In addition, dev…
  datacite Chen, Ching-Jung 2024 置信度 0.66 Hochschulschriftvalence change memory ; cycle-to-cycle variability ; KMC model ; anisotropy
• Semiconductor Supply Chain “Eco System” Overview (video)
  At the end of 2023 the semiconductor market had increased from $532 Billion in 2023 to $611 B mid-year 2024. This growth is viewed positively in the light of the recent Covid pandemic and ongoing supply chain disruptions. Since disruptions (all kinds) in the s…
  datacite Dr. Kitty Pearsall 2024 置信度 0.66
• Semiconductor Supply Chain “Eco System” Overview (video)
  At the end of 2023 the semiconductor market had increased from $532 Billion in 2023 to $611 B mid-year 2024. This growth is viewed positively in the light of the recent Covid pandemic and ongoing supply chain disruptions. Since disruptions (all kinds) in the s…
  datacite Dr. Kitty Pearsall 2024 置信度 0.66
• US Semiconductor Adhesives Market 2024 To 2033
  US Semiconductor Adhesives Market Size, Trends and Insights By Application (Die Attach Adhesives, Surface Mount Adhesives, Wafer Bonding Adhesives, Encapsulation and Potting Adhesives), By Product Type (Electrically Conductive Adhesives, Thermally Conductive A…
  datacite Sirsat, Nitin 2025 置信度 0.66 US Semiconductor Adhesives MarketUS Semiconductor Adhesives Market SizeUS Semiconductor Adhesives Market ShareUS Semiconductor Adhesives Market TrendsUS Semiconductor Adhesives Market Report
• US Semiconductor Adhesives Market 2024 To 2033
  US Semiconductor Adhesives Market Size, Trends and Insights By Application (Die Attach Adhesives, Surface Mount Adhesives, Wafer Bonding Adhesives, Encapsulation and Potting Adhesives), By Product Type (Electrically Conductive Adhesives, Thermally Conductive A…
  datacite Sirsat, Nitin 2025 置信度 0.66 US Semiconductor Adhesives MarketUS Semiconductor Adhesives Market SizeUS Semiconductor Adhesives Market ShareUS Semiconductor Adhesives Market TrendsUS Semiconductor Adhesives Market Report
• Self-driving AMADAP laboratory: Accelerating the discovery and optimization of emerging perovskite photovoltaics
  The development of new solar materials for emerging perovskite photovoltaics poses intricate multi-objective optimization challenges in a large high-dimensional composition and parameter space, with in some cases, millions of potential candidates to be explore…
  datacite Zhang, Jiyun, Wu, Jianchang, Stroyuk, Oleksandr, Raievska, Oleksandra 等 2024 置信度 0.66 670
• The diode-assisted gate-commutated thyristor : current interruption capability and feasibility assessment for a medium-voltage direct current hybrid circuit breaker application; 1. Auflage
  This dissertation investigates the feasibility of employing the Diode-Assisted Gate-Commutated Thyristor (DAGCT) in a medium-voltage direct current hybrid circuit breaker. The DAGCT is a GCT-based power semiconductor device designed for handling high short-cir…
  datacite Warmuz, Julia 2024 置信度 0.66 621.3DAGCTGCTIGCTMVDC
• Modeling and simulation of bilayer area-dependent valence change memory devices
  The development of future semiconductor devices brings major challenges. Moore's famous law has predicted the miniaturization for decades. However, current technologies are reaching their physical limits. Further, the increasing number of computer technologies…
  datacite Sommer, Nils 2024 置信度 0.66 621.3
• Semiconductor Innovations to Continue and Go Beyond Moore’s Law in the Era of AI
  ISCAS 2024 Keynote
  datacite Hemanth Jagannathan 2024 置信度 0.66
• Moore with Less: Ultra-Low Energy Neuromorphic Circuits and Systems for Large-Scale Distributed AI Slides
  ISCAS 2024 Keynote
  datacite Gert Cauwenberghs 2024 置信度 0.66
• Towards Chips that Rewire Themselves? …How Novel Material-System Co-Design Can Enable Them Slides
  ISCAS 2024 Keynote
  datacite Aaron Thean 2024 置信度 0.66
• Moore with Less: Ultra-Low Energy Neuromorphic Circuits and Systems for Large-Scale Distributed AI Video
  ISCAS 2024 Keynote
  datacite Gert Cauwenberghs 2024 置信度 0.66
• Towards Chips that Rewire Themselves? …How Novel Material-System Co-Design Can Enable Them Video
  ISCAS 2024 Keynote
  datacite Aaron Thean 2024 置信度 0.66
• Novel Detection Scheme for Temporal and Spectral X-Ray Optical Analysis: Study of Triple-Cation Perovskites
  Multimodal x-ray microscopy is key to assessing the property-functionality relationships of semiconductor devices with the utmost sensitivity and spatial resolution. Here, we report on a novel setup—the “Analyzer of X-ray excited Optical Luminescence Offering …
  datacite Ossig, Christina, Strelow, Christian, Flügge, Jan, Patjens, Svenja 等 2024 置信度 0.66 530
• Parameter-Efficient Quantized Mixture-of-Experts Meets Vision-Language Instruction Tuning for Semiconductor Electron Micrograph Analysis
  Semiconductors, crucial to modern electronics, are generally under-researched in foundational models. It highlights the need for research to enhance the semiconductor device technology portfolio and aid in high-end device fabrication. In this paper, we introdu…
  datacite Srinivas, Sakhinana Sagar, Ravuru, Chidaksh, Sannidhi, Geethan, Runkana, Venkataramana 2024 置信度 0.66 Machine Learning (cs.LG)Artificial Intelligence (cs.AI)Computer Vision and Pattern Recognition (cs.CV)FOS: Computer and information sciencesFOS: Computer and information sciences
• Composition dependence of intrinsic surface states and Fermi-level pinning at ternary Al x Ga1− x N m -plane surfaces
  Growth on nonpolar group III-nitride semiconductor surfaces has been suggested to be a remedy for avoiding detrimental polarization effects. However, the presence of intrinsic surface states within the fundamental bandgap at nonpolar surfaces leads to a Fermi-…
  datacite Freter, Lars, Lymperakis, Liverios, Schnedler, Michael, Eisele, Holger 等 2024 置信度 0.66 530
• Addressing Class Imbalance and Data Limitations in Advanced Node Semiconductor Defect Inspection: A Generative Approach for SEM Images
  Precision in identifying nanometer-scale device-killer defects is crucial in both semiconductor research and development as well as in production processes. The effectiveness of existing ML-based approaches in this context is largely limited by the scarcity of…
  datacite Dey, Bappaditya, De Ridder, Vic, Blanco, Victor, Halder, Sandip 等 2024 置信度 0.66 Computer Vision and Pattern Recognition (cs.CV)Image and Video Processing (eess.IV)FOS: Computer and information sciencesFOS: Computer and information sciencesFOS: Electrical engineering, electronic engineering, information engineering
• Toward Wireless System and Circuit Co-Design for the Internet of Self-Adaptive Things
  The deployment of a growing number of devices in Internet of Things (IoT) networks implies that uninterrupted and seamless adaptation of wireless communication parameters (e.g., carrier frequency, bandwidth and modulation) will become essential. To utilize wir…
  datacite Das, Diptashree, Abdi, Mohammad, Liu, Minghan, Onabajo, Marvin 等 2024 置信度 0.66 Systems and Control (eess.SY)FOS: Electrical engineering, electronic engineering, information engineeringFOS: Electrical engineering, electronic engineering, information engineering
• Characterisation and simulation of stitched CMOS strip sensors
  In high-energy physics, there is a need to investigate alternative silicon sensor concepts that offer cost-efficient, large-area coverage. Sensors based on CMOS imaging technology present such a silicon sensor concept for tracking detectors.The CMOS Strips pro…
  datacite Davis, Naomi, Arling, Jan-Hendrik, Baselga, Marta, Diehl, Leena 等 2024 置信度 0.66 530
• Simulations and Performance Studies of a MAPS in 65 nm CMOS Imaging Technology
  Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF, granting a high signa…
  datacite Simancas, A., Braach, Justus, Buschmann, E., Chauhan, Ankur 等 2024 置信度 0.66 530
• Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond
  The continuous scaling of semiconductor-based technologies to micron and sub-micron regimes has resulted in higher device density and lower power dissipation. Many physical phenomena such as self-heating or current leakage become significant at such scales, an…
  datacite Garsi, Marwa, Stöhr, Rainer, Denisenko, Andrej, Shagieva, Farida 等 2021 置信度 0.66 Applied Physics (physics.app-ph)Mesoscale and Nanoscale Physics (cond-mat.mes-hall)Quantum Physics (quant-ph)FOS: Physical sciencesFOS: Physical sciences
• Toward Self-Driven Autonomous Material and Device Acceleration Platforms (AMADAP) for Emerging Photovoltaics Technologies
  In the ever-increasing renewable-energy demand scenario, developing new photovoltaic technologies is important, even in the presence of established terawatt-scale silicon technology. Emerging photovoltaic technologies play a crucial role in diversifying materi…
  datacite Zhang, Jiyun, Hauch, Jens, Brabec, Christoph 2024 置信度 0.66 540
• Qualcomm Analysis
  Company Overview Qualcomm Inc. (QCOM) is a global leader in the development and supply of advanced semiconductor and wireless technology solutions primarily for the mobile, automotive, and Internet of Things (IoT) end markets. Founded in 1985 by seven former L…
  datacite Wang, Linda 2023 置信度 0.66
• Multi-fiber array-based photometry system for multi-regional functional mapping in the mouse brain
  Mesoscopic functional brain mapping is essential to better understanding of various brain functions and dysfunctions. However, accessing distributed neural circuits in mammalian brain regions remains a significant challenge. While fiber photometry is a versati…
  preprints 2025 置信度 0.74
• Optimizing Photon Capture: Advancements in AMCP Technology for Enhanced Timing and Photon Detection Efficiency
  preprints 2024 置信度 0.74
• Single Organic Electrochemical Neuron Capable of Anticoincidence Detection
  preprints 2024 置信度 0.74
• Cross-architecture Tuning of Silicon and SiGe-based Quantum Devices Using Machine Learning
  preprints 2024 置信度 0.74
• AlGaN/AlN heterostructures: an emerging platform for nonlinear integrated photonics
  preprints 2024 置信度 0.74
• Periodicity as a Universal Measurand Enabling Traceable Nanoscale Dimensional Metrology
  Abstract The proliferation of nanotechnology faces a critical bottleneck: the lack of comparable and reliable nanoscale dimensional measurements across diverse instruments and laboratories that undermines reproducibility and innovation in nanoscale materials, …
  preprints 2026 置信度 0.74
• Universal control of four singlet-triplet qubits
  preprints 2024 置信度 0.74
• A Portfolio of Electrochemically Exfoliated Two-Dimensional Materials: From Crystals and Simulations to Electronic Inks and Circuits
  preprints 2024 置信度 0.74
• An SRAM-based fully-integrated analog closed-loop in-memory computing accelerator
  preprints 2024 置信度 0.74
• Ultrabroadband Integrated Electro-Optic Frequency Comb in Lithium Tantalate
  preprints 2024 置信度 0.74
• Analysis and control of untemplated DNA polymerase activity for guided synthesis of kilobase-scale DNA sequences
  preprints 2024 置信度 0.74
• A modular and flexible open source cell incubator system for mobile and stationary use
  preprints 2024 置信度 0.74
• Cryo-Near-Field Photovoltage Microscopy of Heavy-Fermion Twisted Symmetric Trilayer Graphene
  preprints 2024 置信度 0.74
• All hard X-ray transient grating spectroscopy
  preprints 2024 置信度 0.74
• Continuous Sulfur Sorption in Supercritical Water by Carbon-supported Zinc Oxide Materials
  preprints 2024 置信度 0.74
• The Competitiveness of Value Chains in the Telecommunications Equipment Industry: Analysis and Policy Implications
  preprints 2023 置信度 0.74
• After the Pandemic: Growth in the IT Industry after COVID-19
  preprints 2022 置信度 0.74
• Photocatalytic C(sp3)–C(sp3) cross-coupling of carboxylic acids and alkyl halides using a nickel complex and carbon nitride
  preprints 2024 置信度 0.74
• Longevity of Implantable Silicon-ICs for Emerging Neural Applications: Evaluation of Bare Die and PDMS-Coated ICs After Accelerated Aging and Implantation Studies
  Silicon integrated circuits (ICs) are central to the next-generation miniature active neural implants, whether packaged in soft polymers for flexible bioelectronics or implanted as bare die for neural probes. These emerging applications bring the IC closer to …
  preprints 2024 置信度 0.74
• Phosphorylation enables allosteric control of a viral condensate
  preprints 2025 置信度 0.74
• A scaleable inducible knockout system for studying essential gene function in the malaria parasite
  preprints 2024 置信度 0.74
• Synthetic protein binders reveal a cryptic regulatory pocket on Aurora A for selective allosteric inhibition
  preprints 2025 置信度 0.74
• Post-COVID Inflation & the Monetary Policy Dilemma: An Agent-Based Scenario Analysis
  preprints 2023 置信度 0.74
• New and Heightened Public-Private Quid Pro Quos: Leveraging Public Support to Enhance Private Technical Disclosure
  preprints 2022 置信度 0.74
• Recent Developments at DG Competition: 2019/2020
  preprints 2020 置信度 0.74
• 'European Digital Sovereignty': Successfully Navigating Between the 'Brussels Effect' and Europe’s Quest for Strategic Autonomy
  preprints 2020 置信度 0.74
• A New World Post COVID-19: Lessons for Business, the Finance Industry and Policy Makers
  Pandemics are disruptive events that have profound consequences for society and the economy. This volume aims to present an analysis of the economic impact of COVID-19 and its likely consequences for our future. This is achieved by drawing from the expertise o…
  preprints 2020 置信度 0.74
• p-n Junctions
  crossref Kazuya Masu, Shuhei Amakawa 2024-10-30T16:11:16Z 置信度 0.70
• An efficient in-memory carry select adder realization using resistive switching crossbar array with Ti-doped VO2 -based selector device
  crossref U. Dilna, S.N. Prasad 2023-12-01T18:48:02Z 置信度 0.70
• Moore’s Law Based Scaling Challenges and Their Device Physics Based Reviews
  crossref Nabil Shovon Ashraf 2024-06-18T15:17:26Z 置信度 0.70
• Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers
  crossref 2024-03-08T18:58:55Z 置信度 0.70
• Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers
  crossref 2024-06-20T17:47:30Z 置信度 0.70
• Research on a Device for Fluorescence Imaging Detection of Nucleic
  crossref Luyang Duanmu, Yuanhua Yu 2024-12-12T19:06:30Z 置信度 0.70
• Application of Residual Neural Network Towards Semiconductor Device Modeling
  crossref D. Bavi, S. Khandelwal 2025-02-18T13:18:49Z 置信度 0.70
• Waves in Periodic Structures
  crossref Kazuya Masu, Shuhei Amakawa 2024-10-30T16:11:16Z 置信度 0.70
• Carrier Dynamics in Semiconductors
  crossref Kazuya Masu, Shuhei Amakawa 2024-10-30T16:11:16Z 置信度 0.70
• Moving Mesh Method for Semiconductor Device Simulations
  crossref Dan Wu, Chijie Zhuang, Bo Lin, Qingyuan Shi 2024-07-16T17:19:37Z 置信度 0.70
• Thermal Diffusivity Determination of a Semiconductor Device
  crossref Corina Ruxandra Mitulescu, Bogdan Mihailescu, Mihai Brânzei, Paul Svasta 2024-07-26T17:28:39Z 置信度 0.70
• Extending the Functionality of the Universal Learning Platform: The Third Hybrid Operation Circuit and Device Characterization Board
  crossref Alexandru Mihai Antonescu 2024-10-31T17:33:03Z 置信度 0.70
• Semiconductor Device Manufacturing Technologies
  crossref Amal Banerjee 2023-10-16T16:03:16Z 置信度 0.70
• Upwind Block-Centered Multistep Differences for Semiconductor Device Problem with Heat and Magnetic Influences
  crossref Yirang Yuan, Changfeng Li, Yunxin Liu, Tongjun Sun 2024-03-06T13:17:13Z 置信度 0.70
• Physics of Semiconductors in Equilibrium
  crossref Kazuya Masu, Shuhei Amakawa 2024-10-30T16:11:16Z 置信度 0.70
• Compound Semiconductor Device and IC
  crossref Min-Hwa Chi, Ying-Kun Liu, Long Qin 2023-11-27T16:03:01Z 置信度 0.70
• Optimizing Aluminium/Silicon Temperature Gradient Zone Melting Process for Power Device Periphery
  crossref Amélie Audebert, Benjamin Morillon, Brice Le Borgne, Gaël Gautier 2024-10-31T17:33:03Z 置信度 0.70
• A Unified Semiconductor-Device-Physics-Based Ballistic Model for the Threshold Voltage of Modern Multiple-Gate Metal-Oxide-Semiconductor Field-Effect-Transistors
  Based on the minimum conduction band edge caused by the minimum channel potential resulting from the quasi-3D scaling theory and the 3D density of state (DOS) accompanied by the Fermi–Dirac distribution function on the source and drain sides, a unified semicon…
  crossref Te-Kuang Chiang 2024-12-13T05:55:45Z 置信度 0.70
• High responsivity and external quantum efficiency of polyoxometalate interlayered Schottky type photodiode device
  crossref Ali Akbar Hussaini, Mutahire Tok, Yasemin Torlak, Esma Yenel 等 2023-12-29T18:12:09Z 置信度 0.70
• Epoxy Molding Compound Bleeding Reduction on Surface Mount Semiconductor Device
  Epoxy Molding Compound (EMC) bleed consists of a transparent layer of resin which mainly could occur during molding injection at material packing stage. Resin bleeds on exposed pad of a Surface Mount Device (SMD) can significantly impact the solderability perf…
  crossref Federico Leone, Fulvio Viviani, Hidetoshi Seki, Masami Ishii 2024-03-11T11:35:52Z 置信度 0.70
• Semiconductor device-based optical frequency comb generation
  crossref Prince M. Anandarajah, Aleksandra Kaszubowska-Anandarajah 2024-12-02T15:31:34Z 置信度 0.70
• 5 Metal-Oxide-Semiconductor Field-Effect Transistors
  crossref 2024-04-22T10:20:51Z 置信度 0.70
• Active Thermal Control for Power Semiconductor using Peltier-Device
  crossref Masamichi Yamaguchi, Hiroki Watanabe, Jun-Ichi Itoh, Kyo-Beum Lee 2025-02-10T18:28:30Z 置信度 0.70
• Power Semiconductor Device Humidity Reliability Study
  This paper aims to study the aging mechanism of power semiconductor devices in high humidity environments, propose anti-humidity optimization design methods, and explore the humidity reliability of these devices in-depth. The reliability of the devices can be …
  crossref Jiale Wang 2024-09-21T02:49:45Z 置信度 0.70
• Amorphous TeO2 as p-type oxide semiconductor for device applications
  Electronic devices would benefit from a low-cost amorphous, dopable, bipolar oxide semiconductor. However, p-type oxides are quite rare, largely due to self-compensation by native defects. Our simulations find that the amorphous phase of TeO2 is chemically ord…
  crossref John Robertson, Xuewei Zhang, Qingzhong Gui, Yuzheng Guo 2024-05-20T12:44:10Z 置信度 0.70
• Wave Propagation in Piezoelectric Semiconductor Microbeams Based on Modified Strain Gradient Theory
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