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Nujhat Tasneem, Md. Mohsinur Rahman Adnan, Md. Samzid Bin Hafiz, Quazi D.M. Khosru
2017-02-16T22:32:12Z
置信度 0.70
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Huimei Zhou, Miaomiao Wang, Jingyun Zhang, Koji Watanabe 等
2020-06-30T17:20:26Z
置信度 0.70
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Drain current vs gate voltage and drain current vs drain voltage characteristics have been derived in a ferroelectric gate-all-around carbon nanotube (CNT) transistor. An approximate analysis to derive the polarization characteristics in a cylindrical ferroele…
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Masakazu Ibata, Hiroshi Ishiwara
2011-05-20T07:55:09Z
置信度 0.70
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The impacts of three different strain configurations on both DC and RF performance of n-type silicon nanowire transistors (n-SNWTs) are investigated. It is found that the longitudinal tensile strain is the most efficient in improving the driving current and RF…
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Quanxin Yun, Jing Zhuge, Ru Huang, Runsheng Wang 等
2010-03-09T23:16:31Z
置信度 0.70
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2019-08-01T23:58:42Z
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2010-01-26T12:34:26Z
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置信度 0.70
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2019-06-12T19:52:27Z
置信度 0.70
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Hung-Bin Chen, Shih-Han Lin, Jia-Jiun Wu, Yung-Chun Wu 等
2012-09-07T15:57:32Z
置信度 0.70
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By means of the Ramo–Shockley–Pellegrini theorem, an analytical discussion on how different geometries of gate-all-around 1D ballistic transistors affect their time-dependent current and their (intrinsic) high-frequency noise spectrum is presented. In particul…
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A. BENALI, F. L. TRAVERSA, G. ALBAREDA, A. ALARCÓN 等
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2021-01-07T12:10:35Z
置信度 0.70
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Deyuan Xiao, Xi Wang, Yuehui Yu, Jing Chen 等
2009-10-26T08:06:56Z
置信度 0.70
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Abstract In this paper, a novel low power consumption device based on a dopingless gate-all-around nanowire tunnel field effect transistor (TFET) with negative capacitance (NC) effect is proposed. NC is a robust approach in solving the bottleneck issues encoun…
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2022-08-04T18:15:21Z
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2023-03-24T21:00:35Z
置信度 0.70
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crossref
2022-09-15T03:35:21Z
置信度 0.70
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The steep sub-threshold swing of a tunneling field-effect transistor (TFET) makes it one of the best candidates for low-power nanometer devices. However, the low driving capability of TFETs prevents their application in integrated circuits. In this study, an i…
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Weijie Wei, Weifeng Lü, Ying Han, Caiyun Zhang 等
2022-12-09T10:22:56Z
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2024-03-07T08:24:51Z
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2021-03-09T23:41:59Z
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2025-10-09T17:50:46Z
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We conduct an atomic-level investigation on how a Ge atom impacts on the SiGe etching rate. The plasmaless dry-etching process in ClF3 gas is considered in this study. We perform the density functional theory to model the elementary reactions of an etchant mol…
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Yu-Hao Tsai, Mingmei Wang
2021-12-07T13:21:14Z
置信度 0.70
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This article proposes an analytic charge-based model that incorporates interface trapping. The model’s applicability to all operating zones includes various interface trap charges with varying doping concentrations. Using the analytical model, the impact of in…
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2024-05-22T17:32:27Z
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europepmc
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europepmc
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The miniaturization of traditional planar Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) becomes quite challenging for very short channel devices as the formation of ultra-sharp source and drain junctions with a high process complexity is needed …
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2019-10-03T03:21:41Z
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Recently, short channel effects (SCE) and power consumption dissipation problems impose tremendous challenges that need imperative actions to be taken to deal with for field effect transistor to further scale down as semiconductor technology enters into sub-10…
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Laixiang Qin, Chunlai Li, Yiqun Wei, Ziang Xie 等
2023-06-05T15:38:36Z
置信度 0.70
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An analytical method for the synthesis of a strictly aplanatic two-mirror projection objective for extreme ultraviolet (EUV) lithography is proposed. The system satisfies Fermat’s principle and the Abbe sine condition. Explicit expressions are derived for the …
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2026-08-14T17:01:06Z
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2026-01-22T05:03:18Z
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Extreme ultraviolet (EUV) lithography has emerged as a core approach for expanding semiconductor fabrication beyond the boundaries of deep ultraviolet (DUV) patterning. Due to the ever-diminishing reduction of device size, even utilizing multiple patterning te…
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Background: A mirrorless exposure architecture for extreme-ultraviolet (EUV) and soft-x-ray lithography places a population-inverted superfluorescent gain medium immediately above the wafer and amplifies a mask-patterned seed to resist-level dose without any p…
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Technological transitions often involve long periods during which incumbent and emerging technologies coexist rather than being quickly replaced. While previous research explains why this coexistence persists, less is known about how competing technologies int…
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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This article argues that the United States–China chip war has evolved from industrial rivalry into a structural contest over the infrastructure of twenty-first-century power. At the center lies the ability to design and manufacture frontier logic semiconductor…
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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europepmc
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