-
crossref
Shilpa Pavithran, Elizabeth George, Alex James
2025-05-12T13:42:25Z
置信度 0.70
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Ivy Wu, Melissa Mullen, Mark McClendon, Pete Carleso 等
2024-06-06T17:21:59Z
置信度 0.70
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Srikant Bharadwaj, Tushar Krishna
2024-11-12T18:37:23Z
置信度 0.70
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Byeong-Soo Bae, Seung-Mo Kang, Hyungshin Kweon
2024-09-23T17:24:29Z
置信度 0.70
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crossref
M. Schaffert
2024-11-20T11:51:42Z
置信度 0.70
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Advanced packaging is an important technology that is now taking over from advanced processes to help the semiconductor industry continue to grow. The researcher found that the personnel in contact with the semiconductor industry chain have already had a preli…
crossref
Yuchen Ye
2024-06-18T17:51:26Z
置信度 0.70
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Brian J. Brown, Ekaterina Mikhaylichenko, Jianshe Tang, Jun Qian 等
2024-05-31T16:11:25Z
置信度 0.70
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A novel power management method was developed to predict the reliability of silicon, and the method is applicable to both multichip and System-on-Chip packages. The System-on-Chip here refers to a single die which has many functional blocks and each functional…
crossref
Eric Ouyang, Xiao Gu, Yonghyuk Jeong
2024-03-01T17:55:27Z
置信度 0.70
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Zixi Li, David Wentzlaff
2024-12-03T13:51:51Z
置信度 0.70
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Qinqin Zhang, Xiaoyu Liang, Yu Chen
2024-12-12T19:05:45Z
置信度 0.70
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Ning Chen, Lei Shen, Chang Wu
2025-01-16T18:31:30Z
置信度 0.70
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crossref
2024-11-04T13:34:13Z
置信度 0.70
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crossref
Shuang Liu, Martin Radetzki
2024-11-05T18:29:41Z
置信度 0.70
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Abstract Electrospinning is a much‐explored technique in the membrane fabrication field, particularly in active food packaging. Despite the widespread use of this technique, there remains a significant gap in the literature regarding the actual economic evalua…
crossref
Emanuela Drago, Roberta Campardelli, Patrizia Perego
2024-07-29T01:29:22Z
置信度 0.70
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Abstract Thermal insulation materials (TIMs) have been widely used over the past century. In this landscape, expandable polystyrene (EPS) is the dominant choice; however, the waste management of EPS is hampered by recycling challenges and lack of economic ince…
crossref
I‐Tseng Liu, Jhu‐Lin You, Shih‐Huang Tung, Ying‐Chih Liao
2024-02-21T09:46:00Z
置信度 0.70
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crossref
Zilin Wang, Ziqing Wang, Yunfan Shi, Qian Wang 等
2024-10-23T17:49:15Z
置信度 0.70
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crossref
Rui Cao, Huimin He, Lijun Chen, Chengyi Liao 等
2024-08-23T17:54:42Z
置信度 0.70
-
• Investment Area Thrusts should connect activities with the APPF • NAPPF will be focused on integrated process flows that can reach commercial scale • NAPPF will be focused on validating new technology specifications, compatibility with other processes, yield…
crossref
Daniel Berger
2025-01-30T21:37:40Z
置信度 0.70
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crossref
Rayeed Anando, Anuran Bhunia, Ramachandra Achar
2025-05-12T17:42:25Z
置信度 0.70
-
As the demand for high-performance computing continues to grow, the integration of more and more chiplets into a package has become increasingly necessary. In this paper, we present a wafer-scale chiplet reconstitution technology that leverages low-temperature…
crossref
Ashita Victor, Muhannad S. Bakir
2025-02-17T11:20:22Z
置信度 0.70
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crossref
Srinivasan Govindan, Srikrishnan Venkataraman, Beomseok Choi, Amit Kumar
2025-05-12T17:42:25Z
置信度 0.70
-
A digital twin is an integrated multi-physics, multiscale, probabilistic simulation of a system that uses the best available physical models, sensor updates, process history, etc., to mimic and to predict the performance of the system. In the semiconductor ind…
crossref
Yaw Obeng
2024-08-19T15:24:31Z
置信度 0.70
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crossref
YuChuen Luo, ChaoChing Ho
2025-01-02T19:17:35Z
置信度 0.70
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crossref
I‐Tseng Liu, Jhu‐Lin You, Shih‐Huang Tung, Ying‐Chih Liao
2024-04-18T05:03:12Z
置信度 0.70
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crossref
2025-05-12T17:42:25Z
置信度 0.70
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crossref
2025-05-12T17:42:25Z
置信度 0.70
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crossref
2025-05-12T17:42:25Z
置信度 0.70
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crossref
Yuya Suzuki, Yuji Toyoda
2025-01-02T19:17:35Z
置信度 0.70
-
crossref
Thambiraj Selvarathinam, Bruce Kim, Jeong H. Lee, Jong W. Park
2024-07-12T13:34:42Z
置信度 0.70
-
The automotive market for the IC (integrated circuit) packaging industry has grown significantly over the last 8 to 10 years due to its increasing need for automation, higher performance, and the more stringent reliability requirements in the vehicles. These c…
crossref
Nokibul Islam
2025-01-08T15:47:59Z
置信度 0.70
-
crossref
Frank Wei, Andrew Frederick
2025-03-11T17:30:44Z
置信度 0.70
-
As the industry has evolved to deliver heterogenous integration, chiplets, and high-density interconnect, so has Deca’s Adaptive Patterning (TM) (AP) technology. Wafer and panel fan-out, fan-out on substrate, and other embedded die interconnect technologies al…
crossref
Craig Bishop
2025-01-08T15:47:32Z
置信度 0.70
-
The industry’s increasing demand for high-performance electronic devices with better functionality, lower power consumption and higher speed is driving innovation in advanced packaging technology. Improving semiconductor chip performance and advancing package …
crossref
Lars Böttcher
2025-01-30T21:37:25Z
置信度 0.70
-
crossref
Andy Miller
2024-06-13T16:13:44Z
置信度 0.70
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crossref
Tengiz Svimonishvili, Mihai D. Rotaru, Raju Mani, Rahul Dutta
2025-03-11T17:30:44Z
置信度 0.70
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crossref
Lewis Kang, Jay Kim, Bruce Lee, Jade Park 等
2024-06-26T17:53:19Z
置信度 0.70
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crossref
John H. Lau
2024-05-23T04:01:31Z
置信度 0.70
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crossref
Chia-Hung Cho, Yi-Sha Ku, Cheng-Kang Lee, Chun-Wei Lo
2025-03-11T17:30:44Z
置信度 0.70
-
crossref
Yi Zhou, Bobi Shi, Thong Nguyen, Haofeng Sun 等
2024-05-29T17:24:38Z
置信度 0.70
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crossref
Antoine Rouget, Adrian Evans, Fady Abouzeid, Guillaume Bascoul 等
2025-12-23T18:29:27Z
置信度 0.70
-
Abstract This study offers an insight into copper interconnects subjected to diverse physical loading conditions associated with the thermal, electrical, and mechanical domains. In order to estimate primary contributions among stress, temperature and electrica…
crossref
Jui-Chang Chuang, Chang-Chun Lee
2025-01-23T13:10:23Z
置信度 0.70
-
Industry is trending towards more complex integration schemes to address cost and scalability challenges The era of 3D integration and advanced packaging is upon us, but the ecosystem is not ready • There are fundamental design, manufacturing, and enabling cha…
crossref
Pooda Tadayon
2025-05-09T17:30:06Z
置信度 0.70
-
The printing of viscous materials for advanced packaging it is growing and at the same time the requirement on the printing technology increase to print faster, better resolution, to be digital, to combine different type of materials. This industry is searchin…
crossref
Michael Zenou, Herve Javice
2025-01-08T15:48:08Z
置信度 0.70
-
crossref
Tom Rucker
2024-06-13T16:13:30Z
置信度 0.70
-
Reducing demands on a single chip by using smaller chips dedicated to specific functions.
crossref
Gregory Mone
2024-09-30T14:11:53Z
置信度 0.70
-
The era of generative AI is accompanied by an unprecedented increase in compute, memory, and bandwidth requirements of AI workloads. Chiplet architectures and advanced packaging offer a promising path to meeting these demands through much more tightly integrat…
crossref
Arvind Kumar
2025-01-30T21:37:24Z
置信度 0.70
-
crossref
Qinghua Su, Cadmus Yuan, K.N. Chiang
2024-05-28T17:36:26Z
置信度 0.70
-
crossref
John Chang, Jian Lu, Timothy Chang, Keith Best
2025-01-02T19:17:35Z
置信度 0.70
-
Advanced packaging challenges standard metrology means, notably optical profilers, by shrinking dimensions and spacings between interconnect (RDL, Bump, via). New needs such as die flatness and roughness also raise up due to the critical requirement of robust …
crossref
Samuel Lesko, Robert Cid
2025-01-08T13:34:47Z
置信度 0.70
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crossref
2023-12-14T09:46:26Z
置信度 0.70
-
Semiconductor manufacturers are continuously driving efforts to put more computing power and speed into less volume. At the same time, consumers are demanding devices with more functionality that integrate a variety of interconnected circuit types. The result …
crossref
Woo Young Han
2025-01-08T13:34:36Z
置信度 0.70
-
crossref
Yuanwei Lin
2024-05-22T17:32:27Z
置信度 0.70
-
PRESENTATION OUTLINE • Emerging Markets & Trends • Major shifts in Advanced packaging over last 5 years: Historical Perspective • Leading Advanced Packaging form factors • Supply Chain landscape / Advanced Packaging supplier Eco-system • Emerging trends in…
crossref
Vaibhav Trivedi
2025-01-08T13:34:41Z
置信度 0.70
-
crossref
Ravi Mahajan, Sairam Agraharam, Debendra Mallik, Vijaya Boddu
2024-05-31T16:11:25Z
置信度 0.70
-
crossref
Jeff Anderson, Tarek El-Ghazawi
2025-03-28T03:23:48Z
置信度 0.70
-
crossref
2024-03-26T08:10:41Z
置信度 0.70
-
crossref
Robert Patti
2024-09-16T17:34:29Z
置信度 0.70
-
crossref
Wang-Tyng Lay
2024-03-12T06:07:02Z
置信度 0.70
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ABSTRACT As microelectronic technology developments occurred in the 1980s and 1990s, it was perceived that packaging technologies became very mature and did not required new developments. Therefore, the majority of microelectronics packaging manufacturing was …
crossref
Matthew Walsh
2025-12-01T20:27:38Z
置信度 0.70
-
crossref
Congying Yan, Yong Ruan, Jiao Teng, Yu Wu 等
2024-09-23T17:24:29Z
置信度 0.70
-
Routing density is becoming in big challenge in die-to-die interconnects. In this paper, we propose use of the dual-stripline configuration for routing signals in high-density interconnects. The scheme can improve the routing density by up to 33% when compared…
crossref
Shekar Geedimatla, Jayaprakash Balachandran, Midhun Vysakham, Srinivas Venkataraman 等
2024-03-04T10:18:31Z
置信度 0.70
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Increasing the maximum cooling effect of a Peltier cooler can be achieved through materials and device design. The use of inhomogeneous, FGM (functionally graded materials) may be adopted in order to increase maximum cooling without improvement of the zT (figu…
datacite
Thiébaut, E., Goupil, C., Pesty, F., D'Angelo, Y. 等
2018
置信度 0.66
Applied Physics (physics.app-ph)Materials Science (cond-mat.mtrl-sci)FOS: Physical sciencesFOS: Physical sciences
-
We introduce a new scanning probe technique derived from scanning gate microscopy (SGM) in order to investigate thermoelectric transport in two-dimensional semiconductor devices. The thermoelectric scanning gate Microscopy (TSGM) consists in measuring the ther…
datacite
Brun, B., Martins, F., Faniel, S., Cavanna, A. 等
2018
置信度 0.66
Mesoscale and Nanoscale Physics (cond-mat.mes-hall)FOS: Physical sciencesFOS: Physical sciences
-
Graphene plasmons promise exciting nanophotonic and optoelectronic applications. Owing to their extremely short wavelengths, however, the efficient coupling of photons to graphene plasmons - critical for the development of future devices - can be challenging. …
datacite
Nikitin, A. Y., Alonso-Gonzalez, P., Hillenbrand, R.
2018
置信度 0.66
Optics (physics.optics)FOS: Physical sciencesFOS: Physical sciences
-
Group IV semiconductor alloys and heterostructures such as SiGe, GeSn, Ge/Si and SiGe:C have been widely used and under extensive research for applications in major microelectronic and photonic devices. In the growth and processing of these materials, nanomete…
datacite
Guangrui, Xia
2019
置信度 0.66
Materials Science (cond-mat.mtrl-sci)FOS: Physical sciencesFOS: Physical sciences
-
We review recent precision measurements on semiconductor tunable-barrier electron pumps operating in a ratchet mode. Seven studies on five different designs of pumps have reported measurements of the pump current with relative total uncertainties around $10^{-…
datacite
Giblin, Stephen P., Fujiwara, Akira, Yamahata, Gento, Bae, Myung-Ho 等
2019
置信度 0.66
Mesoscale and Nanoscale Physics (cond-mat.mes-hall)FOS: Physical sciencesFOS: Physical sciences
-
Design and modification of the interfaces, always a critical issue for semiconductor devices, has become the primary tool to harness the full potential of halide perovskite (HaP)-based ones. In particular the outstanding improvements in HaP solar cell performa…
datacite
Schulz, Philip, Cahen, David, Kahn, Antoine
2018
置信度 0.66
Applied Physics (physics.app-ph)Materials Science (cond-mat.mtrl-sci)FOS: Physical sciencesFOS: Physical sciences
-
Quantum dots are nanostructures made of semiconducting materials that are engineered to hold a small amount of electric charge (a few electrons) that is controlled by external gate and may hence be considered as tunable artificial atoms. A quantum dot may be c…
datacite
Zitko, Rok
2019
置信度 0.66
Strongly Correlated Electrons (cond-mat.str-el)FOS: Physical sciencesFOS: Physical sciences
-
Modern clinical diagnostics significantly rely on X-ray medical imaging detectors, which play a key role in obtaining high-quality images while ensuring patient radiation exposure adheres to the "as low as reasonably achievable" principle. The last decade has …
pubmed
Sakhatskyi K, Bartosh V, Zhou Y, Matt GJ 等
2025 Nov
置信度 0.82
-
High-operating-temperature (HOT) mid-wavelength and long-wavelength infrared photodetectors have emerged as critical enablers for eliminating bulky cryogenic cooling systems, offering transfromative potential in developing compact, energy-efficient infrared te…
pubmed
Di Y, Ba K, Wang X, Lin T 等
2025 Sep 8
置信度 0.82
-
Considering the complexities of electronics waste management to meet the requirements of digital-age technologies, this article underscores the pressing need for eco-friendly, economical, and sustainable engineering solutions. Here, it uniquely focuses on bact…
pubmed
Chaudhary V, Sonu S, Raizada P, Kaushik A
2025 Dec
置信度 0.82
-
Emerging research on 2D cadmium chalcogenide nanoplatelets (NPLs) has garnered significant interest due to their large absorption cross-section, narrow emission band, fast photoluminescence decay, high optical gain, and significant giant oscillator strength tr…
pubmed
Medda A, Ghosh S, Patra A
2025 Sep 11
置信度 0.82
-
Halide perovskites (HPs) are gaining significant attention in data storage, particularly for their application in resistive random-access memory (ReRAM) systems. Their exceptional electrical and light absorption properties position them as potentially revoluti…
pubmed
Kim H, Yang SJ, Shim YS, Moon CW
2025 Sep 10
置信度 0.82
-
Metal halide perovskites (MHPs) with striking electrical and optical properties have appeared at the forefront of semiconductor materials for photocatalytic redox reactions but still suffer from some intrinsic drawbacks such as inferior stability, severe charg…
pubmed
Guo Q, Zhang JD, Li J, Feng X
2025 Sep 1
置信度 0.82
-
This review addresses the compact modeling strategies for field-effect transistors (FETs) based on two-dimensional materials (2D-FETs), which offer excellent electrostatic control and strong scaling potential thanks to their atomically thin channels. Achieving…
pubmed
de Souza AM, Celino DR, Ragi R, Romero MA
2025 Sep 12
置信度 0.82
-
The development of an integrated circuit faces the challenge of the physical limit of Moore's Law. One of the most important "Beyond Moore" challenges is the scaling down of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) versus their increasing s…
pubmed
Chen S, An Y, Wang S, Liu H
2025 Jul 29
置信度 0.82
-
Oblique angle deposition (OAD) holds significant potential for diverse applications, including energy harvesting devices, optoelectronic sensors, and electronic devices, owing to the creation of unique nanostructures. These nanostructures are characterized by …
pubmed
Lee G, Ko R, Kang S, Kim YJ 等
2025 Jul 27
置信度 0.82
-
Metal-organic frameworks (MOFs) have emerged as highly versatile materials for the development of next-generation optical biosensors owing to their tunable porosity, large surface area, and customizable chemical functionality. Recently, MOF-based platforms hav…
pubmed
Kidanemariam A, Cho S
2025 Aug 15
置信度 0.82
-
Gallium oxide (Ga 2 O 3 )-based solar-blind ultraviolet photodetectors gained much attention for their promising prospects in new-generation solid-state optoelectronics and electronics. Catering for the demands of broadband photodetection, tunable energy-band,…
pubmed
Liu Z, Xi Z, Gu L, Yan S 等
2025 Sep 5
置信度 0.82
-
Viral infections are one of the main causes of deaths and economic losses around the globe, and effective virus detection methods are essential for epidemic prevention and control. Most existing detection methods have problems such as high false negative/posit…
pubmed
He L, Liu Z, Yang H, Li Y 等
2025 Aug 25
置信度 0.82
-
Hexagonal boron nitride (h-BN), a wide-bandgap semiconductor with excellent thermal stability, high electrical resistivity, and strong neutron absorption capacity, has attracted growing interest in the field of solid-state neutron detection. This review summar…
pubmed
Song W, Liu D, Wang F, Zhang L
2025
置信度 0.82
-
As micro-nano power devices have evolved towards high frequency, high voltage, and a high level of integration, the issue of thermal resistance at heterointerfaces has become increasingly prominent, posing a key bottleneck that limits device performance and re…
pubmed
Shen Y, Fu J, Han F, Li D 等
2025 Aug 13
置信度 0.82
-
Organic afterglow nanoparticles (OANs) represent a unique class of optical materials capable of sustaining luminescence after excitation cessation. Owing to their exceptional design flexibility, tunable optical properties, and favorable biosafety profiles, OAN…
pubmed
Chen X, Li B, Yin B, Xu D 等
2025 Jul 25
置信度 0.82
-
Lead-free halide-perovskite memristors have advanced rapidly from initial proof-of-concept junctions to centimeter-scale selector-free crossbar arrays, maintaining full compatibility with CMOS backend processes. In these highly interconnected matrices, surface…
pubmed
Heo DY, Kim H
2025 Aug 25
置信度 0.82
-
The Metaverse is a decentralized, immersive 3-dimensional virtual environment that merges the physical and virtual worlds, fundamentally transforming digital interaction and garnering widespread attention. However, its primary platforms face challenges such as…
pubmed
Zhou H, Chen X, Li J, Zhang Z 等
2025
置信度 0.82
-
Despite its great potential for solar-driven hydrogen production, including its noncorrosive nature, suitable bandgap (1.9-2.2 eV), abundance, high theoretical efficiency (15.4%), and photochemical stability, hematite photoanodes face limitations such as poor …
pubmed
Jha BK, Jang JH
2025 Sep 3
置信度 0.82
-
BackgroundThe rise of digital devices in the fourth industrial revolution has increased the demand for semiconductor safety. International Safety Certification Standards (SEMI) help prevent accidents in the semiconductor industry, but workers outside of Japan …
pubmed
Min SN, Kim S, Kim DJ, Kang C
2025 Sep
置信度 0.82
-
Electrochemical etching (ECE) has become an essential approach for nanostructuring III-nitride semiconductors, offering precise, scalable control over their physical and functional characteristics. Through ECE, bulk materials such as GaN, InN, and InGaN can be…
pubmed
Raji RK, Qamhieh N, Najar A, Awwad F 等
2025 Aug 28
置信度 0.82
-
While perhaps best known for its role in the semiconductor device industry, silicon at the nanoscale is drawing extensive attention to biotech applications such as drug delivery as a consequence of structural diversity and biomedically useful properties. In th…
pubmed
Le NT, Coffer JL
2025 Oct
置信度 0.82
-
This Review examines up-to-date advancements in the integration of biomolecules and solar energy technologies, with a particular focus on biohybrid photovoltaic systems. Biomolecules have recently garnered increasing interest as functional components in a wide…
pubmed
Fricano A, Tavormina F, Pignataro B, Vetri V 等
2025 Aug 1
置信度 0.82
-
Diamond, renowned for its exceptional electrical, physical, and chemical properties, including ultra-wide bandgap, superior hardness, high thermal conductivity, and unparalleled stability, serves as an ideal candidate for next-generation high-power and high-te…
pubmed
Lu S, Zhang X, Wang S, Li M 等
2025 Aug 4
置信度 0.82
-
Over the past decade, plasmonic semiconductors have emerged as a promising material family for diverse photocatalytic applications, spanning solar energy conversion to environmental remediation. The unique localized surface plasmon resonance (LSPR) enables the…
pubmed
Jing X, Lu N, Ben S, Du S 等
2025 Oct 1
置信度 0.82
-
Semiconductor biohybrid systems are emerging as promising strategies for enhanced carbon dioxide fixation and synthesis of organic compounds, with the potential to transcend biological limitations. However, the effects of experimental variables on the efficien…
pubmed
Li D, Tang Z, Wang C, Mao J 等
2025 Dec
置信度 0.82
-
Chemical mechanical polishing (CMP) is a critical planarization technique that combines chemical reactions and mechanical grinding. However, analyzing its underlying mechanisms at the microscopic level, particularly on the wafer surface, remains a significant …
pubmed
Hu B, Niu X, Zhou J, Dong C 等
2025 Aug 15
置信度 0.82
-
The photovoltaic (PV) efficiency of a solar cell is limited by the Shockley-Queisser limit, stemming from the mismatch between the cell's bandgap and the solar spectrum. This issue can be addressed by integrating a downconverter layer that transforms high-ener…
pubmed
Azam A, Suryawanshi MP, Liu Y, Shi J 等
2025 Aug 19
置信度 0.82
-
The exponential growth of data in the era of big data has led to a surging demand for computing power that outpaces the current pace of expansion in traditional computing architectures. Non-von Neumann architectures have emerged as a promising approach to addr…
pubmed
Zhang G, Luo Q, Yao J, Zhong S 等
2025 Sep 15
置信度 0.82
-
Titanium suboxides, denoted as Ti n O m (0 < m/n < 2), represent a typical class of non-stoichiometric compounds characterized by a wide range of structures and physicochemical properties dependent on their variable titanium-to-oxygen…
pubmed
Yu H, Sun X, Lv Z, Cao Y 等
2025 Sep 30
置信度 0.82
-
Since its experimental realization in the late 1990s, molecular electronics (ME) has received significant attention due to its unique charge transport behavior that occurs over nanoscale dimensions. The molecular junction (MJ), wherein single molecules or arra…
pubmed
Shekhawat AS, Diwan A, Srivastava T, Kumar R 等
2025 Aug 6
置信度 0.82
-
Quantum Dots (QDs) are small semiconductor nanoparticles (<10 nm) with strong, relatively stable, and tunable luminescent properties, which are increasingly applied in the sensing and detection of various analytes, including metal ions, biomarkers, explosiv…
pubmed
Loskutova A, Seitkali A, Aliyev D, Bukasov R
2025 Jul 11
置信度 0.82
-
Quantum cascade lasers (QCLs) are unipolar quantum devices based on inter-sub-band transitions. They break the electron-hole recombination mechanism in traditional semiconductor lasers, overcome the long-lasting bottleneck which is that the emission wavelength…
pubmed
Razeghi M, Bai Y, Wang F
2025 Jul 25
置信度 0.82