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• Advanced Optical Metrology Using on Quality Monitoring of Carrier Wafer in Advanced Packaging
  crossref Ting-Wei Chen, Wen-Yi Lin, Kan-Ju Yang, Kai-Cheng Chen 等 2025-12-16T18:30:06Z 置信度 0.70
• Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and Beyond
  In this paper, we investigate Statistical Bit Error Rate (BER) analysis for low-loss short-reach chiplet interface and high-loss long-reach serial interface. We used jitter filtering to account for the residue jitter not tracked by a forwarded clock system and…
  crossref Shenggao Li, Maher Amer 2025-12-20T00:51:08Z 置信度 0.70
• AI-Driven Optimization of Chiplet Architectures Using Reinforcement Learning
  crossref Hussien AbdelRaouf, Mohamed I. Ibrahem 2025-10-14T17:38:32Z 置信度 0.70
• Invited: Chiplet-Based Integration - Scale-Down and Scale-Out
  crossref Boris Vaisband 2025-03-13T18:22:31Z 置信度 0.70
• Introduction to IC Packaging Development and Assembly Processes
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:04Z 置信度 0.70
• Driving Efficiency in Advanced Packaging: TGV Tool Concepts and Supply Chain Impacts
  crossref Richard Noack, Daniel Dunker, Roman Ostholt, Rafael Santos 等 2025-05-21T17:36:38Z 置信度 0.70
• Quantum Computing, Wearables, and Next-Gen IC Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:58Z 置信度 0.70
• Influences of Electronic Materials Properties on Packaging Reliability
  crossref Chong Leong Gan, Chen Yu Huang 2025-07-21T02:29:15Z 置信度 0.70
• Advanced Post Overlay Compensation for Enhanced Lithography Overlay Accuracy for Next-Generation AICS Packaging
  crossref John Chang, Keith Best, Xin Song, Timothy Chang 2025-05-21T17:36:38Z 置信度 0.70
• Extending Board Level Reliability(BLR) of a Wafer Level Fanout 4D Digital Radar Chiplet Package
  Adoption of Fanout Wafer Level Packages (FO-WLP) for automotive Radar chips became common with the introduction of 76GHz to 80GHz systems almost 10 years ago. Early systems using small 36mm2 packages had partitioning separating the transmit and receive functio…
  crossref Linda Bal, Tom Dolbear 2026-01-27T14:01:21Z 置信度 0.70
• Mechanical Reliability of Compressible Microinterconnects in Replaceable Integrated Chiplet Assembly
  crossref Liu Chu, Jiajia Shi, Robin Braun 2025-01-06T19:37:42Z 置信度 0.70
• Socionext Unveils <b>Chiplet Ecosystem</b>
  crossref 2026-02-26T15:32:57Z 置信度 0.70
• A Reuse-oriented chiplet Partition Method
  crossref Yin Gao, Long Chen, Letian Huang, Zhi Zheng 等 2025-09-24T17:42:08Z 置信度 0.70
• G2C: A Chiplet-Aware Computation Graph Mapping Methodology for Efficient Edge AI
  crossref Peter Mbua, Peter Forcha, Christophe Bobda 2025-10-09T15:46:39Z 置信度 0.70
• Mechanical response of solder joints under drop impact loads
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Development of Acid Copper Plating Chemicals for Advanced Packaging with TSV and TGV
  crossref Nobuaki Nagano, Shota Suzuki, Ryo Aizawa, Yusuke Suga 等 2025-05-21T17:36:38Z 置信度 0.70
• Review on warpage mechanisms and control of packaging substrates for large-scale chiplet integration
  crossref Shanjun Ding, Jingyi Zhao, Xiaomeng Wu, Peng Sun 等 2025-11-25T04:15:03Z 置信度 0.70
• “Addressing Next-Generation IC Substrate Challenges: MKS Advanced Laser Drilling of Resonac Material for High-Density Packaging”
  crossref Geoff Lott, Nomoto Shuji, Martin Orrick, Weiming Cheng 2025-12-16T18:30:06Z 置信度 0.70
• Garblet: Multi-party Computation for Protecting Chiplet-based Systems
  crossref Mohammad Hashemi, Shahin Tajik, Fatemeh Ganji 2025-06-10T17:48:39Z 置信度 0.70
• Cost-Effective Wafer Level Micro Bumping Solution for Advanced Packaging
  crossref Mani Siva P A, Yam Lip Huei, Senthil Kumar B, Zhang Rui Fen 等 2026-02-24T20:55:10Z 置信度 0.70
• Test, Debug, and Repair for Chiplet-Based Designs
  crossref Anshuman Chandra, Esteban Garita-Rodriguez, Pradipta Ghosh 2025-06-10T13:48:39Z 置信度 0.70
• Enabling Efficient AI and HPC through Specialization and Advanced Packaging
  crossref J. Shalf 2026-01-30T21:00:04Z 置信度 0.70
• Ultra-Thin Chiplet Embedding in Glass-Core Package Redistribution Layers
  crossref Hyunggyu Park, Muhannad S. Bakir 2025-06-26T17:40:11Z 置信度 0.70
• Fraunhofer IAF Expands Chiplet Capabilities
  INSTITUTE TO EXPAND SEMICONDUCTOR RESEARCH INFRASTRUCTURE
  crossref 2025-02-10T14:24:56Z 置信度 0.70
• Demonstration of QRcode as traceability sipID in the advanced packaging process and the transparent substrates supply chains
  crossref Fu-Gow Tarntair, Chungmin Fu, Shaowei Hsueh, Hsueh-Li Liu 2025-12-16T18:30:06Z 置信度 0.70
• Substrate and Printed Circuits Board (PCB) for Memory Device Packaging
  crossref Chong Leong Gan, Chen Yu Huang 2025-07-21T02:29:51Z 置信度 0.70
• Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging
  crossref Ravi Parthasarathy, B. Senthil Kumar, Zhang Rui Fen, Zhang Han Wen 等 2026-02-24T20:55:10Z 置信度 0.70
• Design, Fabrication, and Operation Challenges of Advanced Power Packaging Technology for EV Power Modules
  crossref Sourish S. Sinha, Pouria Zaghari, Tzu-Hsuan Cheng, Jong E. Ryu 等 2025-04-23T17:51:56Z 置信度 0.70
• Epoxy Molding Compounds in Mechanical and Thermal Stress in Packaging Reliability
  crossref Chong Leong Gan, Chen Yu Huang 2025-07-21T02:29:14Z 置信度 0.70
• Revitalizing Advanced Packaging in America
  crossref Pavanbabu Arjunamahanthi, Himanandhan Reddy Kottur, Navid Asadizanjani, Charles Woychik 2025-03-05T18:42:00Z 置信度 0.70
• B3.3 - Advanced Glass Packaging with Integrated Stress Relief Structures for MEMS Pressure Sensors
  crossref M. Bertke, S. Schudak 2025-07-03T14:06:14Z 置信度 0.70
• Applications of White Light Interferometry in Advanced Packaging: Metrology and Quality Assurance
  How White Light Interferometer profiler helps: ▪ Monitoring ▪ Controlling ▪ Optimizing Advanced Packaging 1. Die/Wafer stacking optimization 2. Through Silicon Via control 3. Bump control 4. Redistribution Layer quality
  crossref Ravi Chintala, Daphne Mariaravi, Samuel Lesko 2025-01-30T21:34:23Z 置信度 0.70
• A Lightweight 3D D2D Interface for Active Interposer Chiplet Systems
  crossref Zheng Yang, Yafei Liu, Xiangyu Li, Shouyi Yin 2025-02-06T13:34:22Z 置信度 0.70
• 2024 International Conference on Electronics Packaging (ICEP)
  crossref 2024-05-28T17:36:26Z 置信度 0.70
• Prepreg-based FCBGA for Advanced Packaging Substrate
  crossref Byoung-Phil Kang, Ken Lee, Jaesung Kim, Jong-Yun Lee 2024-05-07T17:23:10Z 置信度 0.70
• Glass via Drilling for Semiconductor Packaging in Panels: Using Advanced Motion Control Strategies to Address Production Scaling Challenges
  &lt;b&gt;Laser drilling vertical, high-aspect-ratio vias in glass semiconductor interposer substrates creates process scaling challenges. This presentation outlines how to address these challenges using advanced motion control strategies to combine high-dynami…
  crossref Bryan Germann 2025-03-21T18:34:27Z 置信度 0.70
• The Applications of Simulation and Artificial Intelligence in Advanced Packaging
  crossref Yan Li, WooPoung Kim 2024-10-01T17:23:18Z 置信度 0.70
• Application of Advanced Work Packaging in Structural Steel Installation: Optimization of Construction Execution of a Mining Project in Southeast Asia
  Abstract Advanced Work Packaging (AWP), introduced in 2011 by the Construction Industry Institute as a project management strategy designed to improve outcomes in construction projects, was adopted in a mining project in Southeast Asia. This study presents the…
  crossref P. Flores, C. D. Ramos, C. S. Rey 2024-11-04T00:02:10Z 置信度 0.70
• Retracted: Enabling Adaptable Mixed-Signal Circuits Using Advanced Packaging Techniques
  crossref Ramakant Upadhyay, Ajay Kumar Upadhyay, Sanjeev Kumar Mandal 2024-03-21T14:10:41Z 置信度 0.70
• Mature Defect-Free Micro Processing for Advanced IC Substrates
  crossref Nils Anspach, Roman Ostholt, Richard Noack, Rafael Santos 2025-01-02T19:17:35Z 置信度 0.70
• Impact of Ground Bounce on Logic-High: A Case Study of CMOS Inverter
  crossref Anuj Kumar, Jai Narayan Tripathi 2025-05-12T17:42:25Z 置信度 0.70
• Advancements in metrology for advanced semiconductor packaging
  crossref Wei-Hsin Chein, Gaurav Pandey, Surajit Das, Liang-Chia Chen 2024-06-18T19:26:42Z 置信度 0.70
• LBDR: A load-balanced deadlock-free routing strategy for chiplet systems
  crossref Zhipeng Cao, Zhiquan Wan, Peijie Li, Qinrang Liu 等 2024-01-10T23:25:19Z 置信度 0.70
• Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates
  crossref Richard Noack, Nils Anspach, Roman Ostholt, Daniel Dunker 等 2024-10-15T17:19:58Z 置信度 0.70
• 2024 International Conference on Electronics Packaging (ICEP)
  crossref 2024-06-30T22:20:43Z 置信度 0.70
• Advanced Packaging Techniques—A Mini-Review of 3D Printing Potential
  Packaging and packaging technology constitute a pivotal industry deeply intertwined with our daily lives and prevalent in various settings, including grocery stores, supermarkets, restaurants, and pharmacies. The industry is constantly evolving thanks to techn…
  crossref Anna Witek-Krowiak, Daniel Szopa, Beata Anwajler 2024-06-19T04:21:28Z 置信度 0.70
• Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
  ABSTRACT As computing chips evolve to offer enhanced functionalities, packages like SiP, fcBGA, PoP, and 2.5D have become more intricate, incorporating larger die sizes, increased bump counts, and lower standoff heights. These advancements have posed challenge…
  crossref Ravi Parthasarathy, Patrick Lawrence, Evan Griffith 2025-12-01T19:33:06Z 置信度 0.70
• Residual Stress Control Based on Electroplated Metal Grain Characteristics in Panel-Level Glass Advanced Packaging
  crossref Gangli Yang, Liyi Li, Liu Chang, Wending Yang 等 2024-09-23T17:24:29Z 置信度 0.70
• Advanced Viafill Reliability Using Direct Metallization Technology (IMPACT 2024)
  crossref Carmichael Gugliotti, Albert Tseng, Roger Bernards, Kesheng Feng 等 2025-01-02T19:17:35Z 置信度 0.70
• Machine Learning based Netlisting for Hand-drawn Circuit Schematics with Subcircuits for High-Speed Applications
  crossref Anuj Mathur, Ramachandra Achar 2025-05-12T17:42:25Z 置信度 0.70
• Development Status of Laser-Induced Peel-Off Transfer Technology for Advanced Semiconductors
  crossref Satoshi Enzaki, Koichi Kazama, Yuichiro Tsuda, Tatsuya Okada 等 2024-05-28T17:36:26Z 置信度 0.70
• CPElide: Efficient Multi-Chiplet GPU Implicit Synchronization
  crossref Preyesh Dalmia, Rajesh Shashi Kumar, Matthew D. Sinclair 2024-12-03T13:51:51Z 置信度 0.70
• The Advanced DC Circuit Model for Hybrid bonding in Dual Damascene Structures
  crossref Seon Woo Kim, Jong Kyung Park 2025-01-02T19:17:35Z 置信度 0.70
• Influence Factors of Joule Heating in Microbump in Advanced Packaging Technology
  crossref Yifan Yao, Yuxuan An, K.N. Tu, Yingxia Liu 2024-09-23T17:24:29Z 置信度 0.70
• New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405
  crossref Erik Jan Marinissen, Adrian Evans, Po-Yao Chuang, Martin Keim 等 2024-06-26T17:54:49Z 置信度 0.70
• Signal Integrity Analysis of Ultra-scaled Copper-Graphene Heterogeneous Interconnect Structure
  crossref Suyash Kushwaha, Devarshi Das, Sourajeet Roy, Rohit Sharma 2025-05-12T17:42:25Z 置信度 0.70
• Furthering Moore’s Law Integration Benefits in the Chiplet Era
  crossref Rob Munoz 2023-08-07T18:03:25Z 置信度 0.70
• Advanced PCI Express Receiver Channel Signal Quality Validation for AI Server
  crossref Dian-Ying Wu, Denis Chen, Green Chen 2025-01-02T19:17:35Z 置信度 0.70
• Advanced Au-Au Direct Bonding for Enhanced Thermal Management in Heterogeneous Integration
  crossref Tao Shou, Lu Cheng, Chengxin Zhang, Yuejin Guo 2024-09-23T17:24:29Z 置信度 0.70
• Signal-Integrity Assurance in HBM Links with Temperature-Dependent Interconnections
  crossref Ju-Ching Chien, Chien-Min Lin, Ruey-Beei Wu 2025-05-12T17:42:25Z 置信度 0.70
• Accelerating Thermal Analysis of Chiplet Designs by Embedding FANTASTIC BCI-ROMs in CFD models
  crossref Byron Blackmore 2024-10-14T17:22:35Z 置信度 0.70
• Retraction Notice: Enabling Adaptable Mixed-Signal Circuits Using Advanced Packaging Techniques
  crossref Ramakant Upadhyay, Ajay Kumar Upadhyay, Sanjeev Kumar Mandal 2025-09-03T17:48:17Z 置信度 0.70
• 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
  crossref 2024-07-12T17:34:42Z 置信度 0.70
• OLAP on Modern Chiplet-Based Processors
  Chiplet-based CPUs, which combine multiple independent dies on a single package, allow hardware to scale to higher CPU core counts at the cost of more memory heterogeneity and performance variability. This introduces challenges when existing query engines are …
  crossref Alessandro Fogli, Bo Zhao, Peter Pietzuch, Maximilian Bandle 等 2024-08-30T12:23:36Z 置信度 0.70
• Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration
  crossref Steffen Bickel, Sebastian Quednau, Olav Birlem, Juliana Panchenko 等 2024-06-26T17:53:19Z 置信度 0.70
• Novel Low Loss Polymer for Advanced IC Packaging
  IC-Substrate and Printed Circuit Board (PCB) are high-performing specialty components that consist of organic and inorganic materials. As 5G/6G wireless technology expands through the whole industry, IC-Substrate and PCB designs require low loss dielectric mat…
  crossref Hikaru Mizuno, Takeru Kameyama, Yuutoku Yamashita, Kenta Nishino 等 2025-01-30T21:37:35Z 置信度 0.70
• A Wireless Data and Power Transfer-Enabled MCU for Shape-Configurable Chiplet-Based Computers
  crossref Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai 2024-12-27T19:09:25Z 置信度 0.70
• Biohydrogen and Biobutanol Production from Spent Coffee and Tea Waste Using Clostridium beijerinckii
  The growing advocacy for greener climates, coupled with increasing global energy demand driven by urbanization and population growth, highlights the need for sustainable solutions. Repurposing food wastes as substrates offers a promising approach to enhancing …
  crossref Stephen Abiola Akinola, Beenish Saba, Ann Christy, Katrina Cornish 等 2025-03-31T02:50:16Z 置信度 0.70
• Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques
  crossref Aleksa Deric, Kyle Mitard, Shahin Tajik, Daniel Holcomb 2024-11-29T18:49:50Z 置信度 0.70
• Ph.D. Project Investigating Chiplet Interfaces for Efficient Near-Sensor Computing in Visual On-Device Intelligence
  crossref Peter Mbua, Christophe Bobda 2024-09-03T17:21:13Z 置信度 0.70
• IEEE Std P3405: New Standard-under-Development for Chiplet Interconnect Test and Repair
  crossref Erik Jan Marinissen, Vineet Pancholi, Po-Yao Chuang, Martin Keim 2024-05-29T17:24:14Z 置信度 0.70
• Broadband Photodetectors and Imagers in Stretchable Electronics Packaging (Adv. Mater. 20/2024)
  crossref Teppei Araki, Kou Li, Daichi Suzuki, Takaaki Abe 等 2024-05-16T02:45:55Z 置信度 0.70
• Augmenting barrier efficiency in clay‐based starch composite films for enhanced packaging sustainability
  Abstract The pervasive utilization of plastic as a cost‐effective packaging material for food has led to environmental concerns, primarily due to its non‐biodegradable nature and the ensuing release of carbon dioxide gas that contributes to global warming. In …
  crossref Priyanka Kumari, Neeraj Kumari, Chandra Mohan, Mysoon M. Al‐Ansari 等 2024-05-31T05:56:26Z 置信度 0.70
• Signal Integrity Analysis With Compliance Test of USB4.0 Gen3 with Reference Channels &amp; IBIS-AMI Models
  crossref Varun Agarwal, Amit Jangale 2025-05-12T17:42:25Z 置信度 0.70
• Intelligent Packaging
  crossref 2024-04-22T13:37:34Z 置信度 0.70
• CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure
  crossref Sangpyo Kim, Jongmin Kim, Jaeyoung Choi, Jung Ho Ahn 2024-11-05T13:29:44Z 置信度 0.70
• Intelligent packaging of fruits and vegetables
  crossref Maria del Rosario Moreira 2024-04-22T13:36:02Z 置信度 0.70
• Additive Manufacturing Based Dissolvable Chip Packaging for Sustainable E‐Waste Reduction
  Abstract Electronics have contributed to the advancement of healthcare, wellness, security, and mobility, resulting in a higher standard of living. However, these ever‐accelerating advancements and widespread application come at the cost of a shortened product…
  crossref Dhiya Belkadi, Min Sung Kim, Carl P. Hahn, Sunehra Saleha 等 2024-05-22T02:39:16Z 置信度 0.70
• Advanced TIM Material Analysis for High Performance Package Applications
  crossref Jyun-De Jhan, Wen-Yu Teng, Liang-Yih Hung, Carl Chen 等 2024-05-28T17:36:26Z 置信度 0.70
• Advanced Electronics System for the Improvement of Concrete Factories Management
  crossref George Florea, Norocel Codreanu, Vlad Virgiliu Alexandrescu 2024-12-30T19:22:03Z 置信度 0.70
• Intelligent packaging—sensors
  crossref Tabli Ghosh, Murchana Changmai, Monika, Sushanta Bordoloi 2024-04-22T13:35:05Z 置信度 0.70
• 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2022-12-26T19:35:47Z 置信度 0.70
• Advances and Reliability Challenges in Heterogeneous Integration in Chiplet ERA: From Solder to Copper to Optical Interconnects
  crossref Zhuo-Jie Wu, Nan Xu 2024-05-22T17:32:27Z 置信度 0.70
• Fundamental requirements on MEMS packaging and reliability
  crossref K. Persson, K. Boustedt 2003-06-25T16:23:04Z 置信度 0.70
• A Theoretical Study on the Global Analysis of New Multimodal Optical Metrology for Critical Dimension (CD) Measurement and Stress Analysis in Advanced Semiconductor Packaging
  crossref Surajit Das, Wei-Hsin Chein, Yen-Hung Hung, Fu-Sheng Yang 等 2025-01-02T19:17:35Z 置信度 0.70
• A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging
  crossref Tailong Shi, Liu Chang, Gangli Yang, Dongyu Tong 等 2024-09-23T17:24:29Z 置信度 0.70
• SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators
  crossref Mohanad Odema, Luke Chen, Hyoukjun Kwon, Mohammad Abdullah Al Faruque 2024-12-03T13:51:51Z 置信度 0.70
• Factors responsible for spoilage, drawbacks of conventional packaging, and advanced packaging systems for tomatoes
  crossref Samran Khalid, Syed Ali Hassan, Hamza Javaid, Muqaddas Zahid 等 2024-01-03T11:17:32Z 置信度 0.70
• A DL-Mesh and dual check based multi-core chiplet communication mechanism
  crossref Lin Gu, Chenhao Liu, Xiao Chen 2025-02-20T12:51:16Z 置信度 0.70
• High-end Smartphone SoC Packaging Comparison - Advanced PoP Technology from Standard, Fan-Out to Flip-Chip Assembly
  Advanced packaging has become critical to realize heterogeneous integration, providing high density, increased bandwidth, and power efficiency. There are multiple ways to achieve these requirements and 2.5D and 3D technologies are becoming crucial, including H…
  crossref Rayane Mazari, Gabriela Pereira 2025-01-30T21:37:36Z 置信度 0.70
• 11 Bio-based materials in advanced packaging applications
  crossref Vishnuvarthanan Mayakrishnan, Asha Anish Madhavan 2024-08-22T18:34:38Z 置信度 0.70
• Future trends in intelligent packaging solutions
  crossref Shivshetty Nagaveni, Venkata Giridhar Poosarla 2024-04-22T13:37:13Z 置信度 0.70
• Design Technologies for Advanced Packaging
  crossref Jun Li, Yunyan Zhou, Min Miao, Wei Wang 等 2023-11-27T16:03:01Z 置信度 0.70
• Chiplet-to-Chiplet All-to-All Interconnecting Photonic Interposer Using AWGRs with 3D Ultrafast-Laser-Inscription
  We propose and demonstrate 3D photonic interposer with AWGRs designed for chiplet-to-chiplet all-to-all interconnection. 3D ultrafast laser inscription (ULI) technique achieves low loss coupling between silicon photonic chiplets through the photonic interposer…
  crossref Yiting Jin, Shun-Hung Lee, Siwei Li, Georgios Charalampous 等 2026-06-02T19:29:07Z 置信度 0.70
• A Comparative Study of Monolithic and Chiplet CPU Architectures: Performance and Yield Perspectives
  crossref Kentaro Inoue, Hiroshi Iwata, Kenichi Yamaguchi 2026-05-18T08:53:16Z 置信度 0.70
• Thin-Film Magnetic Components And Their Integration For Advanced Packaging
  crossref Pial,Mohammd Mohtasim Hamid 2026-07-31T04:30:16Z 置信度 0.70
• Advanced Metrology for Heterogeneous Chiplet Integration with High-Speed 100% Bond Overlay Measurement
  crossref Tan Pham-Duy Nguyen, Bhaskar Jyoti Krishnatreya, Frank Bögelsack, Thomas Uhrmann 等 2026-06-17T19:37:15Z 置信度 0.70
• Effects of Poor Workload Partitioning on System Performance for Chiplet-Based Systems
  The emergence of chiplet-based architectures represents a paradigm shift in post-Moore's Law computing systems, offering substantial cost and yield advantages through functional disaggregation. However, the heterogeneity of inter-chiplet communication introduc…
  crossref Peter Mbua 2026-03-09T16:27:11Z 置信度 0.70
• Advanced Packaging
  crossref Wei-Ting Kary Chien, Way Kuo 2026-07-14T18:24:27Z 置信度 0.70
• Review of "Advanced biopolymer-based edible coating technologies for food preservation and packaging."
  crossref Vishakha Makode 2026-01-05T21:10:09Z 置信度 0.70