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• Addressing advanced packaging challenges with digital lithography technology
  crossref Thomas L. Laidig 2026-04-08T22:05:38Z 置信度 0.70
• How Texas Instrument’s DLP technology drives advanced packaging forward
  crossref Jeff Marsh 2026-04-08T22:05:49Z 置信度 0.70
• Materials for Flexible Electronics
  crossref Weifeng Liu 2026-08-25T19:17:23Z 置信度 0.70
• Materials for Solder Interconnects
  crossref Hongwen Zhang 2026-08-25T19:17:23Z 置信度 0.70
• Mechanical Characterization of Sintered Silver Paste via Nanoindentation for Advanced Packaging in Power Electronics
  crossref Qihang Zong, Chenshan Gao, Fred Ouyang, Huaiyu Ye 2026-06-10T19:59:01Z 置信度 0.70
• Distributed Chiplet Architecture and Stacked Wafer Arrays: Paths to Exascale Computing
  crossref Dubravko Miljković 2026-07-08T19:41:48Z 置信度 0.70
• Effects of Poor Workload Partitioning on System Performance for Chiplet-Based Systems
  The emergence of chiplet-based architectures represents a paradigm shift in post-Moore’s Law computing systems, offering substantial cost and yield advantages through functional disaggregation. However, the heterogeneity of inter-chiplet communication introduc…
  crossref Peter Mbua, Forcha Peter, Christophe Bobda 2026-02-09T00:12:46Z 置信度 0.70
• Effects of Poor Workload Partitioning on System Performance for Chiplet-Based Systems
  The emergence of chiplet-based architectures represents a paradigm shift in post-Moore’s Law computing systems, offering substantial cost and yield advantages through functional disaggregation. However, the heterogeneity of inter-chiplet communication introduc…
  crossref Peter Mbua, Forcha Peter, Christophe Bobda 2026-02-28T01:08:33Z 置信度 0.70
• Link Quality Aware Pathfinding for Chiplet Interconnects
  crossref Aaron Yen, Jooyeon Jeong, Puneet Gupta 2026-06-17T19:37:15Z 置信度 0.70
• From Via to Singulation: Laser Technologies Driving Glass-Based Advanced Packaging
  crossref Nils Anspach, Jannis Heinz, Daniel Dunker, Norbert Ambrosius 等 2026-06-10T19:59:01Z 置信度 0.70
• AI-Driven Chiplet-First Network-on-Chip and Network-on-Interposer Co-Design for Universal Chiplet Interconnect Express-Based 2.5D Edge Artificial Intelligence Accelerators
  crossref Shyamala Devi J, Adinath M, S.Niresh Kumar, Sulochana S 等 2026-08-10T19:09:33Z 置信度 0.70
• Effect of Moisture on the Reliability of Advanced Packaging
  crossref Hyunmin Park, Wonbin Kim, Yoon-Gu Lee, Yoon Lee 等 2026-06-10T19:59:01Z 置信度 0.70
• Advances in Structural Separation Technologies for Multilayer Packaging Recycling
  ABSTRACT Multilayer materials have become an essential part of modern packaging design. They are engineered to merge different materials into a single, lightweight structure. However, their recycling is challenging because the layers are strongly bonded and ch…
  crossref Aditya Chauhan, Andrea Fiorati, Luigi De Nardo 2026-06-08T08:57:33Z 置信度 0.70
• G2C: A Chiplet-Aware Computation Graph Mapping Methodology for Efficient Edge AI
  crossref Peter Mbua, Peter Forcha, Christophe Bobda 2026-01-27T19:28:45Z 置信度 0.70
• High-Resolution 3D Printed Microelectronics Platform for Advanced Packaging Applications
  crossref Darragh R. Walsh, Sophie C.E. Suijdendorp, Peter Rensing, Jeroen A.H.P. Sol 等 2026-06-10T19:59:01Z 置信度 0.70
• Implementing a Dual RISC-V System-on-Chip Chiplet with Advanced Interface Bus
  crossref Luis Eduardo Mendes, Fabio Benevenuti, Antonio Carlos S. Beck, Jose Rodrigo Azambuja 等 2026-03-31T19:50:57Z 置信度 0.70
• Chiplet-NAS: Chiplet-aware Neural Architecture Search for Efficient AI Inference on 2.5D Integration
  crossref Cheng Guo, Pragnya Sudershan Nalla, Nikhil Kumar Cherukuri, Rui Xue 等 2026-03-10T19:51:15Z 置信度 0.70
• Advanced Packaging
  crossref John Lau, Kuo-Ning Chiang 2026-05-31T18:46:51Z 置信度 0.70
• Enhanced electromigration resistance by nanotwinned Cu-Ag Interconnects for advanced packaging
  crossref Fan-Yi Ouyang, Peng-Hsiang Hsu, Yung-Pei Lin 2026-06-10T19:59:01Z 置信度 0.70
• Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
  This paper presents a mechanical simulation of image sensor packages, with a particular emphasis on accurately modeling the cure shrinkage and viscoelasticity. Image sensors have a wide application in mobile phones, autonomous vehicles, and medical imaging. Th…
  crossref Ning Liu, Shahram Seyedmohammadi, Howard Yun, Matthew Tsai 2026-02-27T21:05:17Z 置信度 0.70
• Multi-Range Communication for Chiplet-Based Systems
  crossref Arvin Delavari, Amirtha Chandrasekaran, Boris Vaisband 2026-06-18T14:17:19Z 置信度 0.70
• Diamond Integration for Electronics Cooling
  crossref Samuel Graham, Martin Kuball 2026-06-05T07:42:48Z 置信度 0.70
• Enabling Next-Gen AI Technology with Innovation in Advanced Packaging
  The advent of artificial intelligence in the last several years has created an insatiable need for compute, and industry has been advancing at rapid pace to manufacture hardware which can meet this ever-increasing demand. At the heart of all the AI advancement…
  crossref Manish Dubey 2026-07-16T07:33:34Z 置信度 0.70
• Addressing Electroplating Challenges in Advanced Packaging Using Modern Methods
  crossref Andreas Möller, Alexander Gaiduk 2026-06-02T20:03:17Z 置信度 0.70
• An Overview -Advanced Packaging for Solid State Light Emitting Diode (SSLED) Lighting
  Implementation of advanced packaging concepts in SSLED lighting has the potential to make a significant impact on worldwide energy and environmental concerns. In US Department of Energy studies (ref 1), it has been estimated that, on average, 2.1 quads of ener…
  crossref Rajen Chanchani 2026-06-26T16:33:49Z 置信度 0.70
• Integrated Framework for Multi-Die Semiconductor Interconnect Systems: Hierarchical Signal Management Methodology and Coordinated Tessellation Architecture for Heterogeneous Chiplet Integration
  VERSION 2 NOTE: Metadata correction only. Author contact email updated: mananlimbad@gmail.com . Scientific content, data, and conclusions unchanged. The progressive scaling limitations of monolithic semiconductor dies have driven the semiconductor industry tow…
  crossref Manan Limbad 2026-03-16T09:13:05Z 置信度 0.70
• New Advanced Packaging Architecture: CoWoP (Chip on Wafer on Platform PCB)
  crossref Terry Hsu, HueiChi Yang, Ming-Han Zhuang, Sam Lin 等 2026-06-10T19:59:01Z 置信度 0.70
• Forum 3: Powering the Future of AI, HPC, and Chiplet Architectures: From Dies to Package and Rack
  crossref 2026-03-03T20:50:24Z 置信度 0.70
• Front Matter
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Overview for Overlay Metrology Challenges and Solutions in Advanced Packaging
  crossref Roie Volkovich, Nimrod Bar-Yaakov, Yoav Grauer 2026-02-24T20:55:10Z 置信度 0.70
• Reliability Challenges for Advanced Packaging
  crossref Christopher Bailey 2025-06-10T17:48:39Z 置信度 0.70
• Back Matter
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
  crossref Shuye Zhang, Guoli Sun 2025-06-05T05:32:46Z 置信度 0.70
• ADVANCED TECHNOLOGIES FOR EFFICIENT PACKAGING PROCESSES
  Packaging operations are undergoing a fundamental transformation thanks to advanced digitalization, automation, and materials science. This allows manufacturers to achieve sustainability goals while increasing mass customization, reducing waste, and delivering…
  crossref Mitesh Sachdeva, Dr. Sudha Vengurlekar 2025-06-30T03:32:07Z 置信度 0.70
• Residue Free TaN Etch Method for MIM Capacitor in Advanced Packaging
  crossref Hexin Zhou, Yun Xiao, Xiaohui Ren, Yushan Chi 2026-02-24T20:55:10Z 置信度 0.70
• Chiplet Solutions to Enable AI Scaling
  Chiplet technology is driving sustainable AI scaling by offering lower cost and accelerating the development of new, bespoke hardware. This talk explores the evolving chiplet ecosystem for high-speed connectivity, underwritten by dense die-to-die interfaces. F…
  crossref Tony Chan Carusone 2025-07-07T15:54:42Z 置信度 0.70
• Advanced Techniques for Short Defect Repair to Improve Yield in Packaging Architectures
  crossref Adam Ginsburg, Dmitri Burshtyn 2025-11-10T18:45:25Z 置信度 0.70
• P2P-Chiplet: Partition and Placement Co-Optimization for Multi-Chiplet Architecture
  crossref Qidie Wu, Jiangyuan Gu, Xuguang Yuan, Shaojun Wei 等 2025-11-20T18:39:34Z 置信度 0.70
• Integrated Optical and Electrical Connectivity in Advanced Packaging: The Role of Glass Substrates
  crossref Lucas W. Yeary, Lars Brusberg, Jason R. Grenier 2025-07-18T17:42:42Z 置信度 0.70
• Advanced Packaging – A must for the Next-Gen AI and HPC Hardware and not Only!
  crossref M.Bilal Hachemi 2025-11-10T18:45:25Z 置信度 0.70
• Multi-Stepped Solder Resist Patterning Technology for Advanced Packaging
  crossref Meiten Koh, Raimu Kasuga, Yuji Toyoda 2025-05-21T17:36:38Z 置信度 0.70
• Bevel Engineering in Advanced Packaging
  crossref Keechan Kim, Moty Keovisai 2025-07-16T17:36:44Z 置信度 0.70
• Dose Effects and Mitigation in 28nm FD-SOI Advanced Interface Bus Chiplet Interconnect
  crossref Antoine Rouget, Fady Abouzeid, Adrian Evans, Victor Malherbe 等 2025-08-19T18:07:28Z 置信度 0.70
• Ultra-Precise Dispensing for High-Resolution Redistribution Layers and 3D Interconnects in Advanced Packaging Applications
  crossref Filip Granek, Piotr Kowalczewski 2025-11-10T18:45:25Z 置信度 0.70
• Tunable Graphene Based Terahertz Bandstop Filter for Semiconductor Packaging Applications
  crossref G. Challa Ram, B. R. Sanjeeva Reddy, Douglas H Werner 2026-03-03T20:50:33Z 置信度 0.70
• Molding process simulation of substrates
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• AI Market Today and Beyond: Transforming the Future of Advanced Packaging
  Fan-out packaging is a versatile semiconductor packaging technology that provides optimized form factor, high signal integrity at high frequencies, high I/O density and low thermal resistance. Fan-out can be utilized for various 2.5D and 3D multi-chip integrat…
  crossref Gabriela Pereira 2025-12-17T20:31:23Z 置信度 0.70
• Arizona State University: A Leader in Advanced Packaging R&D
  The CHIPS Act renewed domestic focus on semiconductor technology, including advanced packaging that is critical for chiplets and future scaling. Arizona State University’s core facilities, industry partnerships, course offerings, and workforce development prog…
  crossref Jason Conrad 2026-01-27T14:01:36Z 置信度 0.70
• AI Market Today and Beyond: Transforming the Future of Advanced Packaging
  Fan-out packaging is a versatile semiconductor packaging technology that provides optimized form factor, high signal integrity at high frequencies, high I/O density and low thermal resistance. Fan-out can be utilized for various 2.5D and 3D multi-chip integrat…
  crossref Gabriela Pereira 2026-01-27T14:01:12Z 置信度 0.70
• CVD in Semiconductor Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:03Z 置信度 0.70
• Simulation of Signal Integration and Power Integration in Advanced Packaging Circuit Design
  crossref Shu-Chin Huang, Sung-Mao Wu 2025-05-21T17:36:38Z 置信度 0.70
• Message from the General Chair: “ Advanced Electronics Packaging Technology for Digital Twin”
  crossref 2025-12-23T18:29:57Z 置信度 0.70
• Advanced Short Defect Repair Technique for Enhancing Yield in Packaging Architectures
  crossref Adam Ginsburg, Oded Mor, Guy Levi, Guy Amrani 2025-05-21T17:36:38Z 置信度 0.70
• Towards Future Microsystems: Dynamic Validation and Simulation in Chiplet Architectures
  This paper presents an in-depth exploration of dynamic simulation methodologies and validation techniques for microsystems instantiated within chiplet architectures. As the demand for modular and scalable electronic systems grows, chiplet-based designs have em…
  crossref Shailesh Chouhan, Jerker Delsing, Cristina Paniagua 2025-10-26T13:36:37Z 置信度 0.70
• Study of Improved Active Disturbance Rejection Control Strategy for Advanced Packaging Motion Platforms
  crossref KangJie Zhang, ZiTing Guo 2025-09-17T17:29:31Z 置信度 0.70
• A UCIe Optical I/O Retimer Chiplet for AI Scale-up
  crossref Vladimir Stojanovic 2025-09-17T17:29:07Z 置信度 0.70
• 2.5D Cryogenic Packaging for Advanced Quantum Processors
  crossref Norhanani Binte Jaafar, Li Hongyu, Ya-Ching Tseng, Yong Chyn Ng 等 2026-02-24T20:55:10Z 置信度 0.70
• Novel Ultrasonic Flip Chip Bonding Approach Utilizing Electroplated Aluminium Pillars for Advanced Packaging
  crossref Imants Cirulis, Silvia Braun, Klaus Vogel, Christian Hofmann 等 2026-02-24T20:55:10Z 置信度 0.70
• Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
  crossref Fong-Rong Bai, Cheng-Yuan Lu, Chien-Min Lin, Ruey-Beei Wu 2026-03-03T20:50:33Z 置信度 0.70
• Scalable Detachable Fiber Connectivity for Seamless Integration With Advanced Semiconductor Packaging
  This presentation will highlight Teramount's technological advances in wafer-level optics and integration workflows into standard semiconductor foundry and outsourced semiconductor assembly and tests (OSATs) processes. Full-text article not available; see vide…
  crossref Hesham Taha 2025-07-07T15:54:49Z 置信度 0.70
• Chiplet Architectures: Enabling Scalable Integration for the AI Era
  Abstract Chiplets and heterogeneous integration technologies, including advanced packaging, have emerged as a foundational strategy for sustaining the growth of datacenter and edge AI applications. These modular designs are not just a workaround, they represen…
  crossref Raja Swaminathan 2025-12-02T07:57:39Z 置信度 0.70
• Advanced Stco for Next-Gen Automotive Systems
  crossref Andy Heinig, Fabian Hopsch 2026-02-24T20:55:10Z 置信度 0.70
• Accelerating Design Innovation : Signal Integrity Prediction for Advanced FOCoS Packaging
  crossref Cheng-Yu Tsai, Ming-Fong Jhong, Hung-Chun Kuo, Chen-Chao Wang 2025-12-16T18:30:06Z 置信度 0.70
• Chiplet Interconnect Test and Repair
  crossref Po-Yao Chuang, Cheng-Wen Wu, Erik Jan Marinissen 2025-11-03T18:42:34Z 置信度 0.70
• Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect
  crossref Yasuhiro Morikawa 2024-05-22T17:32:27Z 置信度 0.70
• Chiplet Technology: Revolutionizing Semiconductor Design- A Review
  This article explores the transformative journey of semiconductor design from monolithic structures to the cutting-edge era of chiplets. Chiplets, modular components offering specific functionalities, have emerged as a catalyst, reshaping the global semiconduc…
  crossref Vivek Gujar 2024-02-13T11:42:47Z 置信度 0.70
• Characterization of Microwave Proximity Effects Between SiC-Based Inductors and Advanced Packaging
  crossref Yuan Tao, Wenzhou Ruan 2024-09-25T17:27:24Z 置信度 0.70
• Application of Pradovera’s Algorithm for Adaptive Frequency Sampling in Electromagnetic Simulation
  crossref Shilpa T N, Rakesh Sinha 2025-05-12T13:42:25Z 置信度 0.70
• Advanced Packaging Dielectric for 5G
  The packaging requirements for high frequency applications and heterogeneous integration have brought well established dielectric materials to their limits. While there is a demand for increased technical performance, mainly low dielectric constant and low die…
  crossref Pawel Miskiewicz, Greg Larbig, Noboru Satake, Jens Pradella 等 2025-01-08T15:47:48Z 置信度 0.70
• Applying Hybrid Numerical Simulation of Capillary Underfill Flow to Advanced Packaging Technologies in Fine Pitch Multi-Chip Modules
  crossref Chien-Ting Wu, Wei-Yu Lin, Ching-Kai Chou, Zi-Hsuan Wei 等 2025-01-02T19:17:35Z 置信度 0.70
• Design of Packaging of Power DMOS Transistor
  crossref P. Príbytný, M. Amira, J. Marek, A. Chvála 2025-01-27T18:36:11Z 置信度 0.70
• High-Performance Reed-Solomon Decoder for Chiplet Interconnection
  crossref Songting Li, Yong Wang, Hao Wang, Changlei Feng 2024-07-24T17:48:49Z 置信度 0.70
• Fine Pitch Flip Chip Bonding for Heterogeneous Chiplet Integration
  crossref Hermann Oppermann, Charles-Alix Manier, Juliane Fröhlich, Martin Schneider-Ramelow 2024-08-22T17:38:42Z 置信度 0.70
• Convergence of Academic Excellence, Industry Innovation, and Government Investment to Propel Advanced Packaging at ASU
  ASU is a comprehensive public research university, measured not by whom it excludes, but by whom it includes and how they succeed; advancing research and discovery of public value; and assuming fundamental responsibility for the economic, social, cultural and …
  crossref Zachary Holman 2025-01-30T16:37:36Z 置信度 0.70
• Metal Thickness Measurement with PULSE^™ Technology for Advanced Packaging Process Control
  crossref Sanghyun Bae, Dae-Seo Park, Junghwan Kim, Hwanpil Park 等 2025-03-11T17:30:44Z 置信度 0.70
• Intelligent packaging and health
  crossref Milad Tavassoli 2024-04-22T13:37:01Z 置信度 0.70
• Huygens’ Surface Modeling using RWG Basis Function for Radiated Emission Prediction
  crossref Samipendu Das, Harikiran Muniganti, Dipanjan Gope 2025-05-12T13:42:25Z 置信度 0.70
• Food packaging
  crossref 2024-05-24T13:16:19Z 置信度 0.70
• Advanced Solder Dispensing Process Evaluation for Miniaturization and 3D Assembly (IMPACT 2024)
  crossref Chih-Yen Chen, Yoyo Chen, Bins Huang 2025-01-02T19:17:35Z 置信度 0.70
• UCIeA Signal Integrity system analysis with Embeded bridge (EMIB) for 3DIC AI Chip
  crossref Shantanu Swami, Manjunath Jayasimha 2025-05-12T17:42:25Z 置信度 0.70
• OpenSource Heterogeneous Chiplet-based Computing Architectures
  crossref Adrian Evans, César Fuguet, Davy Million 2025-04-09T13:21:20Z 置信度 0.70
• Modeling of Eye Diagram for Jitter Estimation in Presence of Ground Bounce
  crossref Anuj Kumar, Jai Narayan Tripathi 2025-05-12T17:42:25Z 置信度 0.70
• Ultra-low Loss Build-up Film Dielectric for Advanced Packaging
  This paper introduces a novel low-loss film dielectric material and describes the performance of the material. As the demand for faster, smaller, and more energy-efficient electronic devices continues to surge, the IC substrates must have the capability of mee…
  crossref Yuya Suzuki, Mami Nosaka, Kazutaka Nakada, Kazuyoshi Yoneda 2025-02-17T16:20:44Z 置信度 0.70
• Polyvinyl Alcohol–Red Cabbage Nanofibers as pH-Responsive Freshness Sensors for Advanced Food Packaging Technology
  crossref 2024-10-17T02:08:57Z 置信度 0.70
• National advanced packaging manufacturing program materials and substrates (DOC)
  crossref 2024-03-12T17:11:41Z 置信度 0.70
• Compact Low-Loss Diplexer with Stacked 2D and 3D Structures Using 3D Glass-Based Advanced Packaging Technology
  A compact low loss diplexer is introduced by using stacked 2D and 3D structures through 3D advanced packaging and through glass vias (TGV). An inductor is designed by using stacked 2D and 3D structures to reduce the coupling effect between adjacent 2D inductor…
  crossref Qi Zhang, Yazi Cao, Gaofen Wang 2024-06-27T11:08:21Z 置信度 0.70
• Rapid 3D X-Ray Wafer-Level Inspection of Interconnects in Advanced Packaging
  ABSTRACT To satisfy the ongoing need for improved product performance, the semiconductor industry has begun to utilize complex 3D IC packages, where chips are stacked on top of each other and are linked electrically by high-density interconnects. To enable eve…
  crossref Johannes Ruoff, Matthew Andrew, Susan Candell, Tom Case 等 2025-12-01T20:27:31Z 置信度 0.70
• Photonic Chiplet Integration on Optical Interposer: Can Hybrid Bonding Realize Passive Optical Coupling?
  crossref How Yuan Hwang, Peter O’Brien 2024-08-09T17:18:24Z 置信度 0.70
• 4 Tb/s Optical Compute Interconnect Chiplet for XPU-to-XPU Connectivity
  crossref Saeed Fathololoumi 2024-09-12T13:41:57Z 置信度 0.70
• Integrated Optical I/O Chiplet
  INTEL DEMONSTRATES FIRST FULLY INTEGRATED OPTICAL I/O CHIPLET
  crossref 2025-02-04T16:18:42Z 置信度 0.70
• Advanced IC packaging design for material inspection
  crossref Navid Asadizanjani, Chengjie Xi, Mark Tehranipoor 2024-02-02T09:07:46Z 置信度 0.70
• Revitalizing U.S. Semiconductor Manufacturing: The Strategic Impact of the CHIPS Act on Advanced Packaging and Fabrication Technologies
  crossref Shubham Rajendra Ekatpure 2024-08-28T06:45:09Z 置信度 0.70
• This is Not Your Fathers Advanced Semiconductor Packaging…An EDA Perspective
  Abstract not available for This is Not Your Fathers Advanced Semiconductor Packaging…An EDA Perspective
  crossref John Park 2025-01-08T13:35:01Z 置信度 0.70
• GNN-SP: Fast S-Parameter Estimation of Chiplet Interconnect via Graph Neural Network
  crossref Lihao Liu, Yunhui Li, Beisi Lu, Li Shang 等 2024-08-26T17:31:14Z 置信度 0.70
• Plasma Descum on Advanced Packaging Development
  crossref Jen-Kuang Fang, Peng Yang, Shang-Hong Liu, Feng-Tsung Cheng 等 2025-01-02T19:17:35Z 置信度 0.70
• Optimizing Chiplet Disaggregation with Package Technology
  As the chiplet concept is making its way into products, some are declaring a “chiplet revolution” in the semiconductor industry. The term revolution is used because of the paradigm shift from large, monolithic “System on Chips (SoC’s) to thoughtful disaggregat…
  crossref Trent Uehling, Julian Pontes, Carl Culshaw, Karl Leiss 2025-02-17T16:19:53Z 置信度 0.70
• Novel Copper Foam/Indium Composite Thermal Interface Materials for Advanced Flip Chip Ball Grid Array Packaging
  crossref Jing Wen, Jinyang Su, Canwen Wang, Siyuan Lu 等 2024-09-23T17:24:29Z 置信度 0.70
• Electron beam probing for advanced IC packaging assurance
  crossref Navid Asadizanjani, Chengjie Xi, Mark Tehranipoor 2024-02-02T09:07:47Z 置信度 0.70
• P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications
  Flexible hybrid microelectronics systems are being introduced for wearables, implants, drug delivery, human-machine interfaces, rapid diagnostics and more. These novel medical devices rely on leading-edge thin and flexible microelectronics. Semiconductor-on-Po…
  crossref Doug Hackler, Ed Prack 2025-01-30T21:37:31Z 置信度 0.70
• The Ideal Switch® with Advanced Glass Packaging
  There has been a lot of work done over the past decade showing the advantages of using glass-based packaging for many microelectronics applications. Much of this work has been motivated by advantages provided by the material properties of glass. As an insulato…
  crossref Aric Shorey, Jeff Baloun, Mark Walker 2025-02-17T16:20:40Z 置信度 0.70