半导体与先进封装 · 全部实体（第 49 / 100 页）

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• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2009-02-19T22:09:56Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Advanced Packaging table of contents
  crossref 2011-06-08T12:59:20Z 置信度 0.70
• Special section on microsystems design and packaging (Forward)
  crossref 2005-04-21T20:22:11Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2010-03-03T15:57:35Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-08-13T19:37:37Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• An advanced approach to power module packaging
  crossref B. Ozmat, C.S. Korman, R. Fillion 2002-11-07T20:06:37Z 置信度 0.70
• Advanced Assembly Process Dvelopment for Ultra Fine Pitch Wafer Level Packaging
  ABSTRACT The 2003 ITRS roadmap identifies the need for peripheral I/O flip chip direct chip attach at 30μm pitch in 2007 and 20μm pitch in 2009. Area array flip chip packaging is expected to reach 90-100μm pitch in 2010. The drivers for such a reduction in pit…
  crossref Sungmin Suh, Daniel Baldwin 2025-12-01T20:31:48Z 置信度 0.70
• Title page
  crossref 2017-03-10T08:56:12Z 置信度 0.70
• Committee
  crossref 2011-03-08T09:44:47Z 置信度 0.70
• WSPC Series in Advanced Integration and Packaging
  crossref 2017-06-21T05:18:00Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2009-05-27T11:29:29Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-08-13T19:37:37Z 置信度 0.70
• Advanced Packaging Metrology And Lithography That Overcomes FOWLP/FOPLP Die Placement Error
  crossref Keith Best, Mike Marshall 2018-12-14T00:57:48Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Components and Packaging Technology table of contents
  crossref 2011-06-08T12:59:20Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2007-10-04T15:35:49Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2011-01-07T14:04:02Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2011-06-08T12:59:20Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2009-08-07T15:50:22Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Components and Packaging Technology table of contents
  crossref 2008-07-18T14:29:19Z 置信度 0.70
• Antenna Design for 60 GHz Packaging Applications
  crossref Duixian Liu 2009-02-26T11:46:28Z 置信度 0.70
• Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
  crossref B. Wunderle, R. Dudek, D. Vogel, B. Michel 2006-08-08T18:44:03Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2010-08-09T22:11:51Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2007-10-04T19:35:49Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2007-11-08T00:19:13Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-02-11T20:20:18Z 置信度 0.70
• Investigation on fatigue life of solder joints for 2.5D packaging structures
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Application of Green Packaging Material with a Necessary Analysis on the Packaging Design
  Green packaging has become an international trend This article analyzes the necessity of the packaging design by using the green packaging material on the ground of the present situation of the polluted environment by the waste of packaging material, the devel…
  crossref He Zi Ouyang 2014-06-23T09:51:04Z 置信度 0.70
• Smart Network Interconnect for Chiplet - based Vehicular System?s Security
  crossref Avani Dave, Krunal Dave 2024-10-07T12:18:37Z 置信度 0.70
• Three-dimensional packaging structure for 3D-NoC
  crossref Kikuo Wada, Shigekazu Hino, Nobuyuki Yamasaki 2014-01-31T17:34:54Z 置信度 0.70
• What's Happening in China Advanced Semiconductor Packaging Landscape?
  crossref Santosh Kumar 2017-09-15T21:15:16Z 置信度 0.70
• Advanced Wire Bonding Technology: Materials, Methods, and Testing
  crossref Harry K. Charles 2016-11-18T03:37:52Z 置信度 0.70
• Microsprings for High-Density Flip-Chip Packaging
  crossref Eugene M. Chow, Christopher L. Chua 2017-12-20T11:01:03Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• Advanced Wire Bonding Technology: Materials, Methods, and Testing
  crossref Harry K. Charles 2008-12-16T13:54:29Z 置信度 0.70
• Advanced polymers for advanced RF packaging applications
  crossref Madhavan Swaminathan, Nevin Altunyurt, Seunghyun Hwang 2025-08-27T18:22:35Z 置信度 0.70
• Copper Electrodeposition for Advanced Packaging and Hybrid Bonding
  crossref Bryan Buckalew 2024-05-31T16:11:25Z 置信度 0.70
• Universal Chiplet Interconnect Express Г (UCIeГ)
  Align Industry around an open platform to enable chiplet based solutions. Enables construction of SoCs that exceed maximum reticle size -Package becomes new System-on-a-Chip (SoC) with same dies (Scale Up) -Reduces time-to-solution (e.g., enables die reuse) -L…
  crossref Vik Chaudhry 2024-02-28T11:57:55Z 置信度 0.70
• Industry session III: Reflections on three decades of packaging and electrical analysis
  crossref Tim Michalka 2017-04-06T23:33:30Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2008-02-06T17:38:54Z 置信度 0.70
• Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration
  crossref Vikas Dubey, Dirk Wünsch, Knut Gottfried, Robert Kinner 等 2024-03-18T18:54:03Z 置信度 0.70
• Progress on thermally conductive adhesive for electronic packaging
  crossref Xibing Zhan, Tianpeng Jin, Junying Zhang, Jue Cheng 2011-12-22T16:55:18Z 置信度 0.70
• Resolving Stripping, Etching, and Cleaning Challenges for Shrinking Dimensions from BEOL to Advanced Packaging
  crossref J. Daviot 2019-03-18T21:29:08Z 置信度 0.70
• IEEE Transactions on Advanced Packaging table of contents
  crossref 2008-02-07T15:18:39Z 置信度 0.70
• Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
  crossref Akihiro Horibe, Chinami Marushima, Takahito Watanabe, Atom Watanabe 等 2026-06-17T19:37:15Z 置信度 0.70
• Advanced substrate technology for ball grid array in electronic packaging
  crossref Y.P. Wang, T.D. Her 2002-11-11T10:54:58Z 置信度 0.70
• A novel thick film materials technology offering high performance packaging solutions
  crossref P. Barnwell 2002-11-22T15:21:11Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2008-02-06T17:38:54Z 置信度 0.70
• Hybrid Bonding
  crossref John H. Lau 2021-05-17T11:02:26Z 置信度 0.70
• Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging
  Advanced 2.5D/3D wafer-level fan-out packaging technologies have been studied widely in literature and industry in recent years. Miniaturization, reduction in manufacturing costs, improvement in performance, and lower power consumption using packaging technolo…
  crossref Karan Bhangaonkar, Santosh Sankarasubramanian 2024-09-30T16:57:19Z 置信度 0.70
• Dicing advanced materials for microelectronics
  crossref A.T. Cheung 2005-05-24T10:52:03Z 置信度 0.70
• Tutorial I: Influence of IC packaging technology on ESD robustness of components
  crossref Elyse Rosenbaum 2017-04-07T03:33:30Z 置信度 0.70
• IEEE Transactions on Advanced Packaging table of contents
  crossref 2007-10-04T19:35:59Z 置信度 0.70
• Chip size BGA packaging for high performance memory
  crossref V. Solberg 2002-11-13T14:55:33Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2011-06-08T12:59:20Z 置信度 0.70
• Title page
  crossref 2011-03-08T04:44:47Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• Metal Inter-Diffusion and Eutectic Wafer Bonding Processes for Advanced MEMS Packaging
  ABSTRACT Until recently, the most commonly used methods for wafer level packaging of high volume MEMS sensors such as pressure sensors, accelerometers and gyroscopes either involved glass frit and anodic bonding. Anodic bonding requires the uses of a glass sub…
  crossref Sumant Sood, Robert Hergert, Oliver Treichel 2025-12-01T20:28:19Z 置信度 0.70
• IEEE Transactions on Advanced Packaging table of contents
  crossref 2007-10-04T19:36:10Z 置信度 0.70
• IEEE Transactions on Advanced Packaging table of contents
  crossref 2007-10-04T19:36:23Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2008-07-18T18:53:58Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing - Table of contents
  crossref 2007-06-01T20:11:11Z 置信度 0.70
• 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
  crossref 2020-02-05T21:26:08Z 置信度 0.70
• Opto-Electronic Packaging
  crossref Ulrich H. P. Fischer 2013-01-17T12:58:11Z 置信度 0.70
• Micro-scale 2D chiplet position control: a formal approach to policy design
  crossref Ion Matei, Johan de Kleer, Christoforos Somarakis, Anne Plochowietz 等 2021-01-13T07:27:32Z 置信度 0.70
• High-Density Packaging for Mobile Terminals
  crossref S.K. Pienimaa, N.I. Martin 2004-10-04T18:46:30Z 置信度 0.70
• Advanced Packaging Lithography and Inspection Solutions for Next Generation FOWLP-FOPLP Processing
  ABSTRACT For more than 50 years the semiconductor industry has pursued Moore’s law, continuously improving device performance, reducing cost, and scaling transistor geometries down to where advanced CMOS has reached beyond the 10nm technology node. The commens…
  crossref Keith Best, Gurvinder Singh, Roger McCleary 2025-12-01T20:30:44Z 置信度 0.70
• Innovation in Food Packaging
  crossref 2014-03-11T23:09:05Z 置信度 0.70
• Advanced Semiconductor IC Packaging
  ABSTRACT Recent advances in semiconductor IC packaging, e.g., flip chip technology, fan-in wafer-level packaging, fan-out wafer-level packaging, 3D IC integration, 2.5D IC integration, TSV-less interposers, Cu-Cu hybrid bonding, and embedded 3D hybrid integrat…
  crossref John H. Lau 2025-12-01T20:24:00Z 置信度 0.70
• Colamination technology for electronic packaging applications
  crossref S.E. Leach, C.N. Ernsberger 2002-11-22T15:21:11Z 置信度 0.70
• Thermal Design and Management of Electronics
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Non-Formaldehyde based electroless Cu deposition for Advanced Packaging
  crossref Anshuma Pathak, Georg Friedrich, Thorsten Teutsch 2021-02-09T12:39:01Z 置信度 0.70
• 2010 International Symposium on Advanced Packaging Materials: Microtech (APM)
  crossref 2020-02-04T08:08:11Z 置信度 0.70
• Contents
  crossref 2011-12-22T16:55:18Z 置信度 0.70
• Materials for Advanced Packaging
  crossref 2016-11-18T03:37:52Z 置信度 0.70
• 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2024-03-19T18:14:38Z 置信度 0.70
• 2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2026-03-03T20:51:22Z 置信度 0.70
• Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
  crossref Dongkai Shangguan 2026-08-25T19:17:23Z 置信度 0.70
• Advanced Substrates: A Materials and Processing Perspective
  crossref Bernd Appelt 2008-12-16T08:54:29Z 置信度 0.70
• Foreword Three-Dimensional Packaging
  crossref C.E. Bauer, S.W.R. Lee 2005-08-10T14:46:24Z 置信度 0.70
• Advanced packaging for future demands
  crossref Sascha Lohse, Michael Wolff, Alexander Wollanke, Sebastian Quednau 2017-08-09T16:03:47Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2007-10-04T19:35:52Z 置信度 0.70
• Packaging of the S-1 advanced architecture processor
  crossref W Bryson 2021-04-03T02:39:52Z 置信度 0.70
• Advanced Print Circuit Board Materials
  crossref Gary Brist, Gary Long 2008-12-16T13:54:29Z 置信度 0.70
• Modified Atmosphere Packaging
  crossref 2020-12-22T21:16:02Z 置信度 0.70
• Testing and Reliability in Advanced Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:35Z 置信度 0.70
• Onshore Advanced Packaging as a Service with Turnkey Solution
  ABSTRACT As transistor scaling slows, system-level performance gains are increasingly delivered through heterogeneous integration and shorter interconnects. Advanced packaging has therefore become the innovation throttle: it determines achievable bandwidth and…
  crossref David Box, Liang Wang 2026-05-13T02:09:43Z 置信度 0.70
• 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2021-12-27T21:14:38Z 置信度 0.70
• Bumping technology for advanced packages
  crossref Shinichi Wakabayashi 2010-02-16T17:07:06Z 置信度 0.70
• Materials for Advanced Packaging
  crossref 2008-12-16T08:54:29Z 置信度 0.70
• Advanced Packaging Solutions for Shelf Life Management of Fresh Food
  crossref Alaa Alaizoki 2023-04-26T09:55:17Z 置信度 0.70
• Substrate and Interposer Materials for Semiconductor Packaging and Heterogeneous Integration
  crossref Tarak A. Railkar 2026-08-25T19:17:23Z 置信度 0.70
• A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration
  crossref Rakshith Saligram, Ankit Kaul, Muhannad S Bakir, Arijit Raychowdhury 2021-02-13T02:20:24Z 置信度 0.70
• Advanced packaging technologies for fully exploiting attributes of WBG power electronics
  crossref Zhenxian Liang 2015-10-13T12:52:35Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2008-07-18T18:29:19Z 置信度 0.70