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• New technologies for advanced high density 3D packaging by using TSV process
  crossref Paul Kettner, Bioh Kim, Stefan Pargfrieder, Swen Zhu 2008-08-28T03:26:33Z 置信度 0.70
• Signal Integrity Analysis of Chiplet Channel with Interposer Trace and Hybrid Bonding Pad
  crossref Haeseok Suh, Jiwon Yoon, Taesoo Kim, Hyunjun An 等 2026-01-22T20:59:20Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2007-10-04T19:35:49Z 置信度 0.70
• Chiplet-GAN: Chiplet-Based Accelerator Design for Scalable Generative Adversarial Network Inference [Feature]
  crossref Yuechen Chen, Ahmed Louri, Fabrizio Lombardi, Shanshan Liu 2024-08-19T17:36:35Z 置信度 0.70
• Physical Vapor Deposition in Advanced Semiconductor Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:05Z 置信度 0.70
• Alignment and overlay characterization for 3D integration and advanced packaging
  crossref H. W. van Zeijl, P.M. Sarro 2010-02-19T18:39:20Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2008-07-18T14:12:20Z 置信度 0.70
• Advanced Substrates: A Materials and Processing Perspective
  crossref Bernd K. Appelt 2016-11-18T08:37:52Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2007-10-04T19:35:52Z 置信度 0.70
• Surface Activated Bonding --- High Density Packaging Solution for Advanced Microelectronic System
  crossref Zhonghua Xu, T. Suga 2006-01-05T09:52:38Z 置信度 0.70
• Advanced Packaging Metrology and Lithography That Overcomes FOWLP/FOPLP Die Placement Error
  ABSTRACT As the semiconductor roadmap continues to drive the cost of front-end manufacturing higher in the quest for ever-increasing functionality, manufacturers are looking to the back-end to provide a low cost solution for the final devices. One such solutio…
  crossref Keith Best, Mike Marshall 2025-12-01T20:29:52Z 置信度 0.70
• Necessity and Feasibility of Operating Patent Assets in Advanced Packaging Industry
  crossref Jikuan Li 2020-09-23T00:18:11Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2007-10-04T15:35:53Z 置信度 0.70
• "Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium
  crossref 2014-11-15T09:19:57Z 置信度 0.70
• Heterogeneous Integration and Wafer-Level Packaging of MEMS
  crossref Masayoshi Esashi, Shuji Tanaka 2017-12-20T11:01:03Z 置信度 0.70
• IEEE Transactions on Electronics Packaging Manufacturing table of contents
  crossref 2007-10-04T15:35:53Z 置信度 0.70
• Nanocomposites in Packaging: A Groundbreaking Review and a Vision for the Future
  crossref Sukanchan Palit, Chaudhery Mustansar Hussain 2018-11-05T04:24:10Z 置信度 0.70
• Advanced Packaging Solution to Hermetically Packaging Microelectronic Devices
  crossref Cai Liang, Pierino Zappella 2021-06-22T20:02:56Z 置信度 0.70
• Chitosan-Based Nanocomposites in Food Packaging
  crossref Ritu Hooda, Bhawna Batra, Vijay Kalra, Joginder Singh Rana 等 2018-11-05T04:24:10Z 置信度 0.70
• Demonstration of an Optical Packaged Substrate with Embedded Silicon Photonic Transceiver for High Performance Chiplet Packaging
  crossref Fumi Nakamura, Akihiro Noriki, Kenta Suzuki, Satoshi Suda 等 2026-06-17T19:37:15Z 置信度 0.70
• Thin film resistors and capacitors for advanced packaging
  crossref R.R. Kola, M.Y. Lau, S. Duenas, H.Y. Kumagai 等 2002-11-22T15:21:11Z 置信度 0.70
• Foreword
  crossref 2011-03-08T09:44:47Z 置信度 0.70
• 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
  crossref 2019-12-27T11:41:52Z 置信度 0.70
• Organic Printed Circuit Board Materials and Processes
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Front cover
  crossref 2011-12-22T16:55:18Z 置信度 0.70
• Simulation and Reliability Assessment of Advanced Packaging
  crossref 2024-06-03T07:50:18Z 置信度 0.70
• 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
  crossref 2020-02-04T09:09:59Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2009-05-27T11:29:29Z 置信度 0.70
• Advanced RF Packaging Technology Trends, From WLP and 3D Integration to 5G and Mmwave Applications
  ABSTRACT In the last few years, radio frequency (RF) applications have driven the advanced electronics packaging market to encompass different sectors. With products such as Automotive Radar, High-End Smartphones or WiGig devices, the RF packaging market is ex…
  crossref Stéphane Elisabeth 2025-12-01T20:31:15Z 置信度 0.70
• Advanced MEMS Packaging-Explore the New Continent, Optics and Bio Business. Packaging for Microfluidic Devices and Systems.
  crossref Zhen YANG, Ryutaro MAEDA 2011-07-13T04:35:16Z 置信度 0.70
• Metal wafer bonding for 3D interconnects and advanced packaging
  crossref V. Dragoi, E. Pabo, T. Wagenleitner, C. Flotgen 等 2013-03-20T18:49:25Z 置信度 0.70
• Copyright
  crossref 2011-03-08T09:44:47Z 置信度 0.70
• 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
  crossref 2020-02-06T16:58:17Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2008-07-18T18:29:19Z 置信度 0.70
• 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
  crossref 2020-02-04T04:21:05Z 置信度 0.70
• Cover
  crossref 2011-03-08T09:44:47Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-05-05T16:36:46Z 置信度 0.70
• Copyright page
  crossref 2011-12-22T21:55:18Z 置信度 0.70
• Sponsors
  crossref 2011-03-08T04:44:47Z 置信度 0.70
• 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
  crossref 2020-02-05T23:01:35Z 置信度 0.70
• 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
  crossref 2020-01-03T01:29:49Z 置信度 0.70
• TH3C: Advanced Packaging
  crossref 2011-06-07T09:30:06Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2009-08-07T15:50:22Z 置信度 0.70
• IEEE Transactions on Components and Packaging Technology table of contents
  crossref 2007-10-04T15:35:49Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
  crossref 2010-08-09T22:11:51Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-12-09T18:04:52Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-07-18T14:53:58Z 置信度 0.70
• Advanced underfill materials
  crossref Qiaohong Huang, Tadashi Takano, Rose Guino, Ruihua Li 2013-03-20T14:49:25Z 置信度 0.70
• IEEE Transactions on Components and Packaging Technology table of contents
  crossref 2007-10-04T19:35:53Z 置信度 0.70
• Etching Techniques and Applications in Advanced IC Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T05:58:59Z 置信度 0.70
• The Challenge in Packaging and Assembling the Advanced Power Amplifiers
  crossref Cai Liang, Jeff Burger 2017-03-10T05:42:38Z 置信度 0.70
• Foreword Wafer Level Packaging: More of Many
  crossref Luu T. Nguyen 2008-02-11T20:20:18Z 置信度 0.70
• Re-Shoring Advanced Semiconductor Packaging
  The semiconductor industry and the U.S. government are engaged in ambitious plans to expand domestic semiconductor manufacturing capacity. Previous CSET research has found that the CHIPS for America Act incentives, if carefully targeted and augmented by adequa…
  crossref John VerWey 2022-06-10T14:09:47Z 置信度 0.70
• Session 10: Advanced packaging II
  crossref 2010-01-20T20:56:12Z 置信度 0.70
• Processing Technologies
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Cost Considerations
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Advanced Topics and Future Trends in MCM Technology
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Reliability Considerations
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Bio-based Materials for Food Packaging
  crossref 2018-11-05T04:24:10Z 置信度 0.70
• Silicon photonic chiplet-based CPU/GPU system design
  crossref Chengeng Li 2024-12-29T23:04:05Z 置信度 0.70
• Ceramic Substrates
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Novel Photo-Imageable Materials for Advanced Packaging
  ABSTRACT As advanced packaging technologies evolve, the importance of the redistribution layer (RDL) is growing. The RDL in an advanced packaging works not only for making bond pad location or expanding the interconnection area beyond die size, but also for co…
  crossref Hikaru Mizuno 2025-12-01T20:34:30Z 置信度 0.70
• Challenges in Developing Three-dimensional Chiplet Integration Technologies at the IBM T.J. Watson Research Center
  crossref Katsuyuki Sakuma 2023-08-31T23:00:09Z 置信度 0.70
• Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
  crossref 2012-11-20T15:47:34Z 置信度 0.70
• Reliability Considerations
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Test chips for advanced packaging
  crossref Wolfgang Reinert, Dirk Kahler 2011-01-28T20:08:37Z 置信度 0.70
• On Task Mapping in Multi-chiplet Based Many-core Systems to Optimize Inter- and Intra-chiplet Communications_supp1-3500354.pdf
  crossref Xiaohang Wang 2024-11-19T13:39:52Z 置信度 0.70
• Thermal Considerations
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Fan-Out Wafer/Panel-Level Packaging
  crossref John H. Lau 2021-05-17T11:02:26Z 置信度 0.70
• Biodegradable Films for Food Packaging
  crossref Haniyeh Rostamzad 2020-08-24T15:24:51Z 置信度 0.70
• TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
  crossref Yubo Hou, Furen Zhuang, Partha Pratim Kundu, Sezin Ata Kircali 等 2026-02-24T20:55:10Z 置信度 0.70
• Hardware Architecture of the Universal High-Speed Interconnection Chiplet for Chiplet Integration
  crossref Songting Li, Yong Wang, Changlei Feng, Hao Wang 2024-08-01T13:32:49Z 置信度 0.70
• Thermal Stress Analysis and Key Influencing Factors for the EMIB in Chiplet Packaging
  crossref Yan Zhou, Jun Wang 2025-03-04T18:45:09Z 置信度 0.70
• Session 1 Advanced packaging
  crossref Michitaka Kimura, Len Schaper 2009-01-28T16:20:19Z 置信度 0.70
• Effective Plasma Treatment for Advanced Wafer-Level Packaging
  ABSTRACT One way for most integrated-circuit (IC) manufacturers to extend Moore's law and preserve their edge on their circuits' small sizes, low costs, and high performance is to incorporate newer advanced chip-packaging technologies into their production pro…
  crossref Al Bousetta 2025-12-01T20:34:53Z 置信度 0.70
• Selective Copper Metallization for Advanced Packaging
  ABSTRACT Interconnects are one of the most difficult steps in the manufacturing process, particularly at advanced process nodes with more metal layers to connect, both internally and externally. The Cu damascene process is widely applied in BEOL of IC industry…
  crossref Rashid Mavliev, Robert Rhoades 2025-12-01T20:35:55Z 置信度 0.70
• Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
  During the fabrications of 2.5D and 3D advanced packages, the needs for intermediate thinning and planarization processes persistently exit. This paper highlights the attributes of successful implementations, i.e., increased performances and yields for these p…
  crossref Frank Wei 2015-11-19T14:31:33Z 置信度 0.70
• Process Control Challenges in Advanced Packaging
  ABSTRACT Artificial intelligence (AI) workloads—from large-language-model training to real-time inference—are driving unprecedented demand for compute density, memory bandwidth, and energy-efficient data movement. As performance scaling through traditional mon…
  crossref Vinayak Pandey 2026-05-13T02:09:43Z 置信度 0.70
• 3D IC Integration and 3D IC Packaging
  crossref John H. Lau 2021-05-17T11:02:26Z 置信度 0.70
• Advanced IC Packaging Markets and Trends
  ABSTRACT The worldwide IC packaging industry is going through rapid changes, bringing on advanced packaging methods at an increasing pace. This paper examines the IC packaging industry over the next five years and looks at the interplay of advanced packaging m…
  crossref Sandra Winkler, Steve Berry 2025-12-01T20:26:32Z 置信度 0.70
• Packaging materials for 2.5/3D technology
  crossref B. Schmaltz 2013-05-08T17:32:12Z 置信度 0.70
• Requirements for wafer level packaging materials
  crossref C. Melasincic 2013-05-08T17:32:12Z 置信度 0.70
• Multi-physics coupling reliability enhancement for interconnections of chiplet-based 2.5D packaging with multi-objective optimization through multi-parameter collaboration
  crossref Jie Wu, Guibin Liu, Guangyao Chen, Wanli Cai 等 2026-06-29T19:55:15Z 置信度 0.70
• Enabling Advanced Packaging by Bonding Technology
  ABSTRACT As advanced packaging introduces more challenges to the heterogeneous integration of complex devices, bonding technology requires special attention, to enable advanced packaging. This paper discusses the various bonding applications, such as on-substr…
  crossref Ami Eitan 2026-05-13T02:09:43Z 置信度 0.70
• Automotive Multichip Modules
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
  crossref 2011-09-12T19:15:48Z 置信度 0.70
• Thermal Interface Materials in Electronic Packaging
  crossref Xingcun Colin Tong 2011-01-04T23:06:02Z 置信度 0.70
• Advanced active packaging technologies for modified atmosphere packaging and controlled release applications
  crossref Angel T. Basbasan, Pattarin Leelaphiwat, Vanee Chonhenchob 2026-05-08T08:51:15Z 置信度 0.70
• Design and Verification of Silicon Bridge in 2.5d Advanced Package Based on Universal Chiplet Interconnect Express (Ucie)
  crossref Yuxuan Fan, Yunyan Zhou, Qidong Wang, Bo Lei 等 2024-11-12T09:38:16Z 置信度 0.70
• International Journal of Advanced Packaging Technology
  crossref 2021-04-23T12:04:19Z 置信度 0.70
• Mechanical Design Considerations
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Advanced Interconnect and Packaging
  crossref 2023-03-10T07:37:24Z 置信度 0.70
• Characterization of copper diffusion in advanced packaging
  crossref Xiaodong Zhang 2014-12-23T01:59:05Z 置信度 0.70
• Electronic Package Assembly
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Advanced Electronic Packaging
  crossref William D. Brown 2010-02-04T21:10:39Z 置信度 0.70
• Testing and Qualification
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Cross-Scale Reliability Simulation of Chiplet Devices Based on Sub-Modeling Approach
  crossref Taohan Wang, Hanwen Feng, Jiaqi Li, Shang Wang 等 2024-09-23T17:24:29Z 置信度 0.70
• Advanced packaging for SiC power modules
  crossref Lisheng Wang 2024-06-03T13:48:15Z 置信度 0.70
• About the Editor
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Mechanical Design Considerations
  crossref 2010-02-04T21:10:39Z 置信度 0.70