半导体与先进封装 · 全部实体（第 51 / 100 页）

本页收录第 5001–5100 条，共 10000 条 · 返回 半导体与先进封装 首页

• Force Measurement with Piezo Electric Sensors in Advanced Packaging
  ABSTRACT AI, 5G, IoT, ADAS, AR/VR and other new applications is giving the semiconductor industry plenty of growth opportunities. With the adoption of these technologies the pressure is on, to increase performance. The industry is using the power advantages of…
  crossref Robert Hillinger 2025-12-01T20:35:57Z 置信度 0.70
• Semiconductor Packaging Materials Outlook
  crossref E.J. Vardaman 2006-08-08T22:44:03Z 置信度 0.70
• Selective Copper Metallization for Advanced Packaging
  crossref Rashid Mavliev, Robert Rhoades 2021-03-18T20:03:58Z 置信度 0.70
• Electrical Design Considerations
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Modeling and Simulation
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• System Integration by Advanced Electronics Packaging
  crossref Klaus-Jürgen Wolter 2012-07-16T09:52:15Z 置信度 0.70
• Applications for Silicon Micromachining in Advanced Device Packaging Schemes
  ABSTRACT Packaging of MEMS devices and the fabrication of 3Dintegrated circuit stacks are currently the focus of wideranging and intensive development activities. In a number of advanced device packaging schemes silicon micromachining processes play a pivotal …
  crossref A.A. Chambers 2025-12-01T20:26:30Z 置信度 0.70
• Advanced packaging stepper for 300mm wafer process
  crossref Chang Zhou, Zhongyu Li, Lei Zhang 2013-03-20T18:49:25Z 置信度 0.70
• The Next Generation of Advanced Packaging: Heterogeneous Integration
  ABSTRACT The semiconductor industry is continuously evolving to meet the demands of an increasingly connected and data-driven world. As traditional Moore's Law scaling becomes more challenging, the next frontier in advanced packaging is heterogeneous integrati…
  crossref Charles G. Woychik 2025-12-01T20:27:31Z 置信度 0.70
• Advanced Metallizations for Next Generation Semiconductor Packaging Technology
  crossref Bongyoung Yoo 2023-05-23T13:47:38Z 置信度 0.70
• Polymer Cap Transfer Packaging Technologies
  crossref Seonho Seok 2018-04-27T06:04:00Z 置信度 0.70
• Overview of MEMS Packaging Technologies
  crossref Seonho Seok 2018-04-27T06:04:00Z 置信度 0.70
• Thermal Analysis of Chiplet Packaging Using an Equivalent Material Modeling Approach
  crossref Wei-Fong Wang, Qinghua Su, Yu-Ting Su, Kuo-Ning Chiang 2026-05-15T02:40:02Z 置信度 0.70
• Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
  crossref Debendra Das Sharma, Gerald Pasdast, Zhiguo Qian, Kemal Aygun 2022-09-16T15:37:21Z 置信度 0.70
• Packaging Technologies for Flexible Systems
  crossref Christine Kallmayer 2011-05-19T00:05:49Z 置信度 0.70
• Force Measurement with Piezo Electric Sensors in Advanced Packaging
  crossref Robert Hillinger 2021-03-18T16:03:58Z 置信度 0.70
• Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
  crossref 2015-07-16T18:19:38Z 置信度 0.70
• Enabling 3D Heterogeneous Integration of Silicon Photonics Chiplet Through UBM-Free Au-SnAg Bonding for 2Tb/s Optical Interconnects
  crossref Shiping Chen, Dong Wang, Ming Yang, Kai Jiao 等 2025-09-17T17:29:31Z 置信度 0.70
• Advanced Flip Chip Packaging
  crossref Chong Leong, Gan, Chen-Yu, Huang 2023-04-28T13:02:12Z 置信度 0.70
• Microelectromechanical Systems and Packaging
  crossref Y. C. Lee, Ming Kong, Yadong Zhang 2016-11-18T03:37:52Z 置信度 0.70
• On Green Packaging Design in Packaging Design
  the green design appeared in the 1980 s, this paper mainly introduces the concept of green design, features, basic principles of design, and the method of green design and the development trend of green packaging in our country. From the perspective of protect…
  crossref Yue Fei Wang 2014-06-25T12:47:44Z 置信度 0.70
• Materials for Thermal Management for Advanced Semiconductor Packaging
  crossref Naarendharan Meenakshi Sundaram, Min Jong Kil, Dongkai Shangguan, Subramanian Iyer 等 2026-08-25T19:17:23Z 置信度 0.70
• ComputerAided Engineering and Design
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Materials and Processing Considerations
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• From 2D to 3D, “Chiplet Integration” Enabling the “More Moore” Trend
  crossref 2023-12-31T22:36:39Z 置信度 0.70
• Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)
  crossref 2013-04-08T15:38:26Z 置信度 0.70
• Cost Evaluation and Analysis
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
  crossref 2011-09-16T20:02:36Z 置信度 0.70
• Optical Streaming Links: A New Architecture for Chiplet to Chiplet Communication
  crossref K.E. Lee, D.L. Lepkowski, S.B. Chiah, J. Niu 等 2025-12-22T18:39:16Z 置信度 0.70
• Activity for Advanced Electronic Packaging Technology
  crossref 2011-07-13T04:36:35Z 置信度 0.70
• Low-Power K/Q-Band Digital Phased Array Chiplet
  crossref Craig Hornbuckle, Eric Mrozek, Thomas Krawczyk, Marcel Lugthart 2022-12-19T20:04:18Z 置信度 0.70
• Packaging Materials User in a New Era - Material & Packaging Solution Correspondent with Semiconductor
  crossref M. Mizuno 2006-08-08T18:44:03Z 置信度 0.70
• Testing Methods for Packaging Materials
  crossref Heera Jayan, J. A. Moses, C. Anandharamakrishnan 2018-11-05T09:24:10Z 置信度 0.70
• Integration of a CMOS LSI Chiplet into Micro Flexible Devices for Remote Electrostatic Actuation
  crossref Kei Misumi, Naoto Usami, Akio Higo, Gwenn Ulliac 等 2022-10-13T19:44:47Z 置信度 0.70
• Buckled Thin Film Cap Transfer Packaging Technology
  crossref Seonho Seok 2018-04-27T10:04:00Z 置信度 0.70
• Millimeter‐Wave Packaging
  crossref Ullrich Pfeiffer 2009-02-26T11:46:28Z 置信度 0.70
• Current Advances and Outlook of Advanced Packaging
  Abstract In this study, 2D, 2.1D, 2.3D, 2.5D, 3D. 3.3D, and 3.5D IC integrations will be presented and updated. Chiplet communication such as bridges embedded in build-up package substrate and fan-out epoxy molding compound (EMC) with RDLs (redistribution laye…
  crossref John H Lau 2025-10-11T15:46:49Z 置信度 0.70
• Next Generation Chiplet Technology Development: Focusing on Fine RDL Patterning
  crossref M. Sasago, H. Nishizawa, T. Doi, M. Ozono 等 2025-05-21T17:36:38Z 置信度 0.70
• FEM Modeling of Debonding of Transfer Packaging
  crossref Seonho Seok 2018-04-27T10:04:00Z 置信度 0.70
• Bio-nanocomposites in Packaging: Business Model for Products’ Commercialisation
  crossref Hezekiah Oladimeji, Shalini Singh 2018-11-05T09:24:10Z 置信度 0.70
• Electronic Packaging Materials and Their Functions in Thermal Managements
  crossref Xingcun Colin Tong 2011-01-04T23:06:02Z 置信度 0.70
• Advanced Memory and Device Packaging
  crossref Chong Leong, Gan, Chen-Yu, Huang 2023-04-28T17:02:12Z 置信度 0.70
• Advanced Electronic Packaging
  crossref YongAn Huang, Zhouping Yin, Xiaodong Wan 2019-04-23T19:03:53Z 置信度 0.70
• Microwave characterization of thin film materials for interconnections of advanced packaging
  crossref B. Flechet, R. Salik, J.W. Tao, G. Angenieux 2002-11-22T15:21:11Z 置信度 0.70
• Thermal Management Fundamentals and Design Guides in Electronic Packaging
  crossref Xingcun Colin Tong 2011-01-04T23:06:02Z 置信度 0.70
• Mobile Applications to Enhance Manufacturing Productivity in Advanced Packaging
  ABSTRACT History has often shown that industries remain competitive only if they are willing to adopt new technologies that drive efficiency, productivity, and profitability. The days of running a manufacturing facility that operates within a vacuum are over. …
  crossref Didier Chavet, Shekar Krishnaswamy 2025-12-01T20:33:42Z 置信度 0.70
• Memory Packaging Material and Assembly Trends
  crossref Wei Koh 2006-08-08T22:44:03Z 置信度 0.70
• Defluxing in Advanced Packaging: Critical Process Considerations and Solutions
  crossref Ravi Parthasarathy 2025-03-11T17:30:44Z 置信度 0.70
• Al/SiC for power electronics packaging
  crossref M.K. Premkumar 2002-11-22T15:21:11Z 置信度 0.70
• DICE: Detailed Inter-Chiplet End-to-End Phy Modeling for Accurate Chiplet Simulation
  crossref Rashid Aligholipour, Stefanos Kaxiras, Yuan Yao 2026-08-04T19:13:10Z 置信度 0.70
• Improved Resolution in Advanced Packaging Metrology Through Advanced Nano-Focus X-Ray Sources
  crossref Till Dreier, Daniel Nilsson, Julius Hållstedt, Shichao Hu 2024-09-23T17:24:29Z 置信度 0.70
• Advanced area array packaging - from CSP to WLP
  crossref W.H. Koh 2004-06-03T16:14:56Z 置信度 0.70
• The Future of Advanced Packaging Inspection is X-Ray
  ABSTRACT Detecting and understanding killer defects quickly is critical to the advancement of new processes to keep up with Moore's Law. Historically, X-ray inspection was not the inspection technology of choice for the semiconductor manufacturing process. Var…
  crossref David Kruidhof, Kevin Jan 2025-12-01T20:27:38Z 置信度 0.70
• Insulation Materials for Advanced Packaging Applications
  crossref Reki Nakano 2025-11-10T18:45:25Z 置信度 0.70
• Analytical Techniques for Materials Characterization
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Development and application by ink-jet printing of advanced packaging materials
  crossref D.J. Hayes, M.E. Grove, W.R. Cox 2003-01-20T15:55:24Z 置信度 0.70
• Electrical Considerations, Modeling, and Simulation
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Fututre of Packaging and packaging materials
  crossref R. Tummala, C.P. Wong, J. Qu, S. Sitaraman 等 2006-08-08T18:44:03Z 置信度 0.70
• Advanced Packaging Architectures and the Role of Materials in Their Evolution
  crossref Ravi Mahajan, Ashay Dani, Debendra Mallik, Gaurang Choksi 等 2026-08-25T19:17:23Z 置信度 0.70
• Structural integration simulation under vibration for PBGA packaging
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Plasma considerations prior to wire bonding in advanced packaging
  crossref J. Zhao, J. Getty 2006-01-05T09:52:38Z 置信度 0.70
• 2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2020-02-28T09:33:16Z 置信度 0.70
• 2013 IEEE International Symposium on Advanced Packaging Materials
  crossref 2020-02-02T10:53:32Z 置信度 0.70
• An Industry Perspective on MCMD
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Low-Temperature Deposited SiO₂ for Advanced Chiplet
  D2W hybrid bonding is a crucial technology for chiplets and 3D HBMs [1]. However, the sequential die bonding process has not been matured yet, in particular due to the compatibility of process tools with high-level particle control, e.g. die level cleaning, ac…
  crossref Hayato Kitagawa, Koki Onishi, Junya Fuse, Akira Uedono 等 2024-02-08T19:45:32Z 置信度 0.70
• Enabling Heterogenous Integration Through Chiplet Architectures
  Advanced packaging enabled chiplet architectures are increasingly adopted to drive performance and cost improvements. New heterogeneous architectures like 2.5D Fanout, 3D and 3.5D Hybrid bonded architectures driving AMD’s industry leading advanced technology r…
  crossref Hemanth Dhavaleswarapu 2025-01-30T21:37:38Z 置信度 0.70
• Novel Electrochemical Processes for Advanced Packaging
  crossref Bongyoung Yoo 2026-06-10T19:59:01Z 置信度 0.70
• Microwave characterization of packaging materials
  crossref D.I. Amey, S.J. Horowitz 2002-11-22T20:21:11Z 置信度 0.70
• 2008 Electrical Design of Advanced Packaging and Systems Symposium
  crossref 2020-02-05T20:36:35Z 置信度 0.70
• 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
  crossref 2011-07-13T04:35:16Z 置信度 0.70
• Analytical Techniques for Materials Characterization
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• 2011 International Symposium on Advanced Packaging Materials (APM)
  crossref 2020-02-03T15:53:07Z 置信度 0.70
• Discrete and Embedded Passive Devices
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• The bifurcation of advanced packaging
  Following a similar trend from the 1990's, IC package design is experiencing a sea change. As a refresher, the 1990's is when the ball grid array (BGA) came along, introducing a whole new set of design tool requirements. The mechanical design tools used for th…
  crossref John Park 2019-06-14T19:47:48Z 置信度 0.70
• 2nd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
  crossref 2011-07-13T04:35:16Z 置信度 0.70
• 7th Electronics Packaging Technology Conference (EPTC 2005)
  crossref 2008-02-06T17:38:54Z 置信度 0.70
• Introduction to MEMS Packaging
  crossref Y. C. Lee, Ramesh Ramadoss, Nils Hoivik 2017-12-20T11:01:03Z 置信度 0.70
• Packaging Trends and New Materials Challenges
  crossref Ho-Ming Tong 2006-08-08T22:44:03Z 置信度 0.70
• 7th Electronics Packaging Technology Conference (EPTC 2005)
  crossref 2008-02-06T17:38:54Z 置信度 0.70
• The lithography with low-COO and high-performance for advanced packaging
  crossref Wenhui Liu 2006-01-05T14:52:38Z 置信度 0.70
• Packaging of advanced computer components
  crossref K. Kurzweil 2002-12-10T14:53:10Z 置信度 0.70
• Series on Advanced Electronic Packaging Technology and Key Materials
  crossref 2019-11-22T10:13:51Z 置信度 0.70
• Advanced Opportunity Cost Analysis of 3D Packaging Technologies
  crossref Charles E. Bauer, Herbert J. Neuhaus 2009-01-29T16:46:26Z 置信度 0.70
• ASIC packaging challenges with high speed interfaces
  crossref Nanju Na, Jean Audet 2009-01-14T13:49:22Z 置信度 0.70
• Electrochemical Deposition in Advanced Packaging
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:47Z 置信度 0.70
• Optoelectronic and Electronic Packaging Materials and Their Properties
  crossref Theivasanthi Thirugnanasambandan, Karthikeyan Subramaniam 2020-08-24T19:24:51Z 置信度 0.70
• Keys to Successful and Stable On-Shore Packaging and Advanced Packaging Defense Industrial Base
  Autonomous and next generation applications leverage a Supply Chain to enable integration of Technologies such as sensors, MEMs, computing, memory, communications, and other functions in a SiP that drives SWaP advancements. A healthy, open and stable Ecosystem…
  crossref Jim Will 2024-02-28T12:12:03Z 置信度 0.70
• Chitosan-Based Edible Membranes for Food Packaging
  crossref Mohamed E. I. Badawy, Entsar I. Rabea 2018-11-05T09:24:10Z 置信度 0.70
• Foldable Flex and Thinned Silicon Multichip Packaging Technology
  crossref 2011-05-19T00:05:49Z 置信度 0.70
• 8th Electronics Packaging Technology Conference (EPTC 2006)
  crossref 2008-07-18T18:12:20Z 置信度 0.70
• Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs
  crossref Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara 等 2021-09-17T19:56:32Z 置信度 0.70
• Advanced Chip-to-Substrate Connections
  crossref Paul A. Kohl 2016-11-18T08:37:52Z 置信度 0.70
• High Productivity and Fine Electrode Pitch Die-to-Die Connection Technology for Pillar-Suspended Bridge (PSB) Chiplet Integration Technology
  crossref Ichiro Kono, Yoichiro Kurita 2026-04-30T22:11:31Z 置信度 0.70
• A Deadlock-Free Bridge Module for Inter-Chiplet Cache-Coherent Communication in an Open Chiplet Ecosystem
  crossref Zhiqiang Chen, Wenwen Fu, Yongwen Wang, Hongwei Zhou 2026-03-04T20:47:22Z 置信度 0.70
• A Promising Silicon-Based Fan-Out Heterogeneous Integration Technology for V-Band InP Transceiver Chiplet Package
  crossref Hongze Zhang, Zonglei Jiao, Keqiang Yuan, Yao Liu 等 2024-09-23T17:24:29Z 置信度 0.70
• Packaging of Membrane-Based Polymer Microfluidic Systems
  crossref Yu-Chuan Su 2017-12-20T11:01:03Z 置信度 0.70
• The next generation advanced MEMS& sensor packaging
  crossref Lingen Wang, Arnold Bos, Ton van Weelden, Frank Boschman 2010-09-29T14:06:11Z 置信度 0.70
• Nanotechnology and Edible Films for Food Packaging Applications
  crossref Paula J. P. Espitia, Caio G. Otoni 2018-11-05T09:24:10Z 置信度 0.70
• Materials in next generation of packaging
  crossref R. Tummala, C.P. Wong 2002-11-22T15:21:11Z 置信度 0.70
• Self-assembly for microscale and nanoscale packaging: steps toward self-packaging
  crossref C.J. Morris, S.A. Stauth, B.A. Parviz 2005-11-08T15:50:45Z 置信度 0.70