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• Chiplet-LEGO: Delivering Multiple Voltage Rails to Chiplets with Chiplet VRMs
  crossref Wenliang Zeng, Gyeong-Gu Kang, Haoran Li, Mian Liao 等 2025-08-19T18:07:51Z 置信度 0.70
• Co-Design and Modelling for Advanced Integration and Packaging
  crossref Christopher Bailey, Stoyan Stoyanov, Hua Lu 2015-10-12T17:44:48Z 置信度 0.70
• 3D Packaging Technologies: Are Flex Based Solutions the Answer?
  crossref Ted Tessier 2011-05-19T00:05:49Z 置信度 0.70
• Interaction Phenomena Between Packaging and Product
  crossref S. K. Vimala Bharathi, J. A. Moses, C. Anandharamakrishnan 2018-11-05T09:24:10Z 置信度 0.70
• Advanced Packaging for Automotive Dashboard Application
  The current automotive market for the IC (integrated circuit) packaging industry has grown significantly due to the increasing need for automation and higher performance in vehicles. These changes in the automotive market will enable cars to be more reliable a…
  crossref Nokibul Islam 2017-09-15T21:15:16Z 置信度 0.70
• Thermal issues in microsystems packaging
  crossref W. Nakayama 2002-08-24T18:17:23Z 置信度 0.70
• Integrating Solutions for Advanced Packaging Complexity
  crossref Shin-Puu Jeng 2026-06-10T19:59:01Z 置信度 0.70
• Innovative Materials For Advanced Semiconductor Packaging
  ABSTRACT Advanced packaging has continued to evolve in order to meet the different needs of the industry-from the deployment of 5G, the broad usage of artificial intelligence, the surge of internet traffic, to the growth of electronics content in automotive, a…
  crossref Dongkai Shangguan, Sze Pei Lim, Evan Griffith, Andy Mackie 2025-12-01T20:34:46Z 置信度 0.70
• Electromigration simulation study of copper interconnects in 3D packaging
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Environmental assessment of food packaging and advanced methods for choosing the correct materials
  crossref K. Verghese 2010-12-30T04:01:27Z 置信度 0.70
• 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2020-02-06T17:11:15Z 置信度 0.70
• Advanced Electronic Packaging
  crossref Richard K. Ulrich, William D. Brown 2015-05-18T17:11:37Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2007-10-04T19:35:49Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2006-11-16T03:32:42Z 置信度 0.70
• 2024 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2025-05-12T17:43:12Z 置信度 0.70
• Advanced analytics for sustainable packaging and returns in e-commerce
  E-commerce is continuing to transform the retail industry and steadily gaining market share across sectors. With this surge in relevance, the e-commerce industry also gains increasing responsibility for adopting environmentally sustainable practices while mana…
  crossref Lucas Clement 2025-09-05T11:38:30Z 置信度 0.70
• Bio-Based Materials for Active Food Packaging
  crossref Ângelo Luís, Fernanda Domingues, Filomena Silva 2020-08-24T19:24:51Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2007-10-04T19:35:53Z 置信度 0.70
• Trends in lead frame technology for plastic packaging
  crossref D. Mahulikar 2002-11-22T20:21:11Z 置信度 0.70
• Photoresist Removal Requirements for Advanced Wafer Level Packaging Technology
  crossref Yasuhisa Yamamoto 2009-02-19T19:03:31Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-07-18T14:29:19Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2007-10-04T19:35:49Z 置信度 0.70
• Advanced LED wafer level packaging technologies
  crossref S. W. Ricky Lee 2012-01-06T19:38:06Z 置信度 0.70
• The Application of Green Ecological Packaging Materials in Modern Packaging Design
  With the concept of an environmental-friendly and energy saving society deepening, people are enhancing their demands of the green ecologicalization of modern packaging design. With the continuous development of products and packaging forms, packaging material…
  crossref Li Yan Gao 2014-09-12T09:58:54Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2011-06-08T12:59:20Z 置信度 0.70
• Is Chiplet the Key to Greener AI Accelerators? A Quantitative Benchmarking of Real Chiplet Architectures
  The growing carbon footprint of AI accelerators highlights the urgent need for greener hardware design strategies. Recent works point out that the chiplet-based architecture can be a more sustainable alternative to the monolithic System-on-Chip (SoC) solution …
  crossref Yuhan Sun, Jiacong Sun, Xiaoling Yi, Marian Verhelst 2025-08-06T15:19:53Z 置信度 0.70
• Foreword Wafer-Level Packaging
  crossref Willem Dirk van Driel 2007-08-16T21:00:19Z 置信度 0.70
• 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
  crossref 2021-01-13T21:14:03Z 置信度 0.70
• IEEE Components, Packaging, and Manufacturing Technology Society Information
  crossref 2008-07-18T18:12:20Z 置信度 0.70
• 2000 Index IEEE Transactions on advanced packaging Vol. 23
  crossref 2005-04-21T20:22:11Z 置信度 0.70
• Our Thanks to Reviewers IEEE Transactions on Advanced Packaging
  crossref 2011-01-07T14:04:02Z 置信度 0.70
• Our Thanks to Reviewers IEEE Transactions on Advanced Packaging
  crossref 2009-11-05T18:30:01Z 置信度 0.70
• High-density interconnects for chiplet integration: challenges, opportunities, and future directions
  crossref Pradeep Chhawcharia, Ishita Sharma, Devendra Singh Rao, Shubham Joshi 等 2026-05-05T19:59:37Z 置信度 0.70
• Design Considerations
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration
  crossref Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq 等 2024-03-18T18:54:03Z 置信度 0.70
• New material deposition technologies for advanced packaging [IC packaging]
  crossref J. Kloeser, P. Kasulke 2004-04-23T14:38:15Z 置信度 0.70
• Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms
  crossref Yousef Safari, Yushu Zhao, Boris Vaisband 2024-06-10T12:29:41Z 置信度 0.70
• Session 2: Advanced packaging I
  crossref 2010-01-20T20:56:12Z 置信度 0.70
• Influence of Energetic Particles and Electron Injection on Minority Carrier Transport Properties in Gallium Oxide
  preprints 2023 置信度 0.74
• Direct Optical Patterning of Quantum Dots: One Strategy Different Chemical Processes
  preprints 2023 置信度 0.74
• Accuracy Verification of Low-Cost Co2 Sensors Used for Covid-19 Risk Mitigation
  preprints 2023 置信度 0.74
• A Review on Solution-Processed Organic Phototransistors and Their Recent Developments
  preprints 2021 置信度 0.74
• KIET Annual Report 2022
  preprints 2023 置信度 0.74
• Highly Sensitive and Wide-Range Detection of Sars-Cov-2 Via Recyclable Electrolyte-Gated Igzo Thin-Film Transistors
  preprints 2023 置信度 0.74
• A low-cost device for cryoanesthesia of neonatal rodents
  preprints 2022 置信度 0.74
• Design and Development of Graphene FET Biosensor for the Detection of SARS-CoV-2
  preprints 2021 置信度 0.74
• Celestial compass design mimics the fan-like polarisation filter array of insect eyes
  Abstract Insects use the sun's position (even when concealed) as a compass for navigation by filtering celestial light intensity and polarisation through their compound eyes. To replicate this functionality, we present a sensor that imitates essential aspects …
  preprints 2023 置信度 0.74
• IoT-Enabled Multiplexed Digital PCR System for Onsite Detection of Infectious Diseases
  preprints 2022 置信度 0.74
• Effect of COVID-19 on the Composition of Exhaled Air
  preprints 2021 置信度 0.74
• Framework for Assessing Collection-Based Reactive Air Treatment Systems
  preprints 2023 置信度 0.74
• Electronic Detection of SARS-CoV-2 N-Protein Before the Onset of Symptoms
  preprints 2022 置信度 0.74
• Ceramic Packaging in Neural Implants
  preprints 2020 置信度 0.74
• Post-Covid-19 Pandemic Era and Sustainable Healthcare: Organization and Delivery of Health Economics Research (Principles and Clinical Practice)
  preprints 2023 置信度 0.74
• One-Step Rapid Quantification of SARS-CoV-2 Virus Particles via Low-Cost Nanoplasmonic Sensors in Generic Microplate Reader and Point-of-Care Device
  preprints 2020 置信度 0.74
• Systemic Risk in Supply Chains: A Vector Autoregressive Measurement Approach Based on the Example of Automotive and Semiconductor Supply Chains
  preprints 2021 置信度 0.74
• SARS-CoV-2 Detection in COVID-19 Patients' Sample Using Wooden Quoit Conformation Structural Aptamer (WQCSA)-Based Electronic Bio-Sensing System
  preprints 2023 置信度 0.74
• How Can a Departing Employee Misappropriate Their Own Creative Outputs?
  preprints 2023 置信度 0.74
• A Journey with COVID-19: Impact on the Sustainable Development and United Nation’s Climate Action
  preprints 2023 置信度 0.74
• Electroplating of Electronic Materials for Applications in Large Area Electronics: A Review
  preprints 2018 置信度 0.74
• Improving the sensitivity of fluorescence-based immunoassays by time-resolved and spatial-resolved measurements
  preprints 2023 置信度 0.74
• Silicon Photonic Biosensors Using Label-Free Detection
  preprints 2018 置信度 0.74
• Towards Neuromorphic Learning Machines using Emerging Memory Devices with Brain-like Energy Efficiency
  preprints 2018 置信度 0.74
• A nanobody-functionalized organic electrochemical transistor for the rapid detection of SARS-CoV-2 and MERS antigens at the physical limit
  preprints 2020 置信度 0.74
• Diffusion-Driven Charge Transport in Light Emitting Devices
  preprints 2017 置信度 0.74
• Distributed R&D Networks and Healthcare Crises: Data-Driven Supply Chain Design for Resilience
  preprints 2022 置信度 0.74
• Export Restrictions in the Post-COVID World: Another Step in the Demise of the World Trade Organization (Review of Chien-Huei Wu, Law and Politics on Export Restrictions)
  preprints 2022 置信度 0.74
• Low-field thoracic magnetic stimulation increases peripheral oxygen saturation levels in coronavirus disease (COVID-19) patients: a single-blind, sham-controlled, crossover study
  preprints 2021 置信度 0.74
• Strategies for Improving the Sustainability of Data Centers via Energy Mix, Energy Conservation, and Circular Energy
  preprints 2021 置信度 0.74
• Long-term, continuous, and multimodal monitoring of respiratory digital biomarkers via wireless epidermal mechano-acoustic sensing in clinical and home settings for COVID-19 patients
  preprints 2020 置信度 0.74
• Comparative pathogenicity of SARS-CoV-2 Omicron subvariants including BA.1, BA.2, and BA.5
  preprints 2022 置信度 0.74
• Design of optical cavity for air sanification through ultraviolet germicidal irradiation
  preprints 2021 置信度 0.74
• Impacts of COVID-19 on Various Financial Assets in Korea: A Bayesian Network Approach
  preprints 2023 置信度 0.74
• Beyond Data Protection to Command and Control (C2) Sustainability in a Post-COVID19 World: Execution of U.S. Data Protection Act for U.S. Data Protection Agency; U.S. Data Protection Act Proposal by US Senator for New York Kirsten Gillibrand
  preprints 2020 置信度 0.74
• MDM2 acts as a timer reporting the length of mitosis
  preprints 2023 置信度 0.74
• Low-Cost Manually Assembled Open Source Reader for Isothermal Pathogen Detection from Saliva using RT-LAMP: SARS-CoV-2 Use Case
  preprints 2020 置信度 0.74
• Empirical networks for localized COVID-19 interventions using WiFi infrastructure at university campuses
  preprints 2021 置信度 0.74
• Supply Chain Risk: Changes in Supplier Composition and Vertical Integration
  preprints 2022 置信度 0.74
• PP6 regulation of Aurora A-TPX2 limits NDC80 phosphorylation and mitotic spindle size
  preprints 2022 置信度 0.74
• Global Value Chains: Measurement, Trends and Drivers
  preprints 2022 置信度 0.74
• Firm-Level Risk Exposures and Stock Returns in the Wake of COVID-19
  preprints 2020 置信度 0.74
• Firm-Level Risk Exposures and Stock Returns in the Wake of COVID-19
  preprints 2020 置信度 0.74
• III-nitride semiconductor nanowires: recent advances in molecular beam epitaxy and optoelectronic devices.
  europepmc 2026 置信度 0.80
• CH<sub>3</sub>NH<sub>3</sub>PbBr<sub>3</sub> Perovskite Single-Crystal X-Ray Photon-Counting Detection Based on Multi-Layer Electrodes.
  europepmc 2026 置信度 0.80
• Beyond Point-like Defects in Bulk Semiconductors: Junction Spectroscopy Techniques for Perovskite Solar Cells and 2D Materials.
  europepmc 2026 置信度 0.80
• Nonreciprocal electrical transport in emerging noncentrosymmetric systems: from hidden symmetry to functional devices.
  europepmc 2026 置信度 0.80
• Co-packaged electronics with microfluidics for direct-to-package cooling.
  europepmc 2026 置信度 0.80
• Tunable high-efficiency microwave photon detector based on a double quantum dot coupled to a superconducting high-impedance cavity.
  europepmc 2026 置信度 0.80
• From Planar to 3D: The Evolution of Complementary Field-Effect Transistor for Next-Generation Semiconductor Nodes.
  europepmc 2026 置信度 0.80
• From Static to Dynamic Security: Multidimensional and Reconfigurable Physical Unclonable Functions.
  europepmc 2026 置信度 0.80
• Microwave Near Field Imaging of Externally Injected Signals in an Encapsulated Electronic Device.
  europepmc 2026 置信度 0.80
• Oriented Nucleation and Growth of Halide Perovskites.
  europepmc 2026 置信度 0.80
• Strategies for Photoelectrochemical Splitting of Water.
  europepmc 2026 置信度 0.80
• Capacitive piezotronics.
  europepmc 2026 置信度 0.80
• Surprises from a boron-rich semiconductor under pressure.
  europepmc 2026 置信度 0.80
• Intelligent optoelectronics and electronics based on electrospinning technology.
  europepmc 2026 置信度 0.80
• Advances in methanol oxidation catalysts and system-level engineering for direct methanol fuel cells.
  europepmc 2026 置信度 0.80
• Breakthrough in 2D ultrahigh-<i>κ</i> dielectrics by paraelectric phase engineering in van der Waals crystal.
  europepmc 2026 置信度 0.80
• Interactive Nanophotonic Platforms for Multimodal Information Storage and Security.
  europepmc 2026 置信度 0.80
• Advances in nanotechnology for addressing biofilm-related challenges in medical devices.
  europepmc 2026 置信度 0.80
• Conductivity Spectroscopy for Investigation and Discovery of Photovoltaic Materials.
  europepmc 2026 置信度 0.80