半导体与先进封装 · 全部实体（第 54 / 100 页）

本页收录第 5301–5400 条，共 10000 条 · 返回 半导体与先进封装 首页

• Webinar Series on Semiconductor Manufacturing: Enhancement of Imaging Performance Using Cold Field Emission Technology for SEM Inspection and Review
  Ongoing device scaling and increasing pattern complexity in semiconductor manufacturing have created a critical need for electron microscopy solutions that deliver both ultra‑high spatial resolution and high throughput. Advanced electron‑beam defect inspection…
  datacite Dr. Eugene Bullock 2026 置信度 0.66
• Webinar Series on Semiconductor Manufacturing: Enhancement of Imaging Performance Using Cold Field Emission Technology for SEM Inspection and Review
  Ongoing device scaling and increasing pattern complexity in semiconductor manufacturing have created a critical need for electron microscopy solutions that deliver both ultra‑high spatial resolution and high throughput. Advanced electron‑beam defect inspection…
  datacite Dr. Eugene Bullock 2026 置信度 0.66
• Webinar Series on Semiconductor Manufacturing: Enhancement of Imaging Performance Using Cold Field Emission Technology for SEM Inspection and Review
  Ongoing device scaling and increasing pattern complexity in semiconductor manufacturing have created a critical need for electron microscopy solutions that deliver both ultra‑high spatial resolution and high throughput. Advanced electron‑beam defect inspection…
  datacite Dr. Eugene Bullock 2026 置信度 0.66
• Growth and applications of GeSn-related group-IV semiconductor materials
  We review the technology of Ge1−xSnx-related group-IV semiconductor materials for developing Si-based nanoelectronics. Ge1−xSnx-related materials provide novel engineering of the crystal growth, strain structure, and energy band alignment for realising various…
  datacite Zaima, Shigeaki, Nakatsuka, Osamu, Taoka, Noriyuki, Kurosawa, Masashi 等 2015 置信度 0.66 620germanium tingroup-IV semiconductorepitaxycrystal growth
• Doping and alloying of kesterites
  Attempts to improve the efficiency of kesterite solar cells by changing the intrinsic stoichiometry have not helped to boost the device efficiency beyond the current record of 12.6%. In this light, the addition of extrinsic elements to the Cu2ZnSn(S,Se)4 matri…
  datacite Romanyuk, Yaroslav E., Haass, Stefan G., Giraldo, Sergio, Placidi, Marcel 等 2019 置信度 0.66 DDC::5** Naturwissenschaften und Mathematik::53* Physik
• Multi-dimensional modeling and simulation of semiconductor nanophotonic devices
  Self-consistent modeling and multi-dimensional simulation of semiconductor nanophotonic devices is an important tool in the development of future integrated light sources and quantum devices. Simulations can guide important technological decisions by revealing…
  datacite Kantner, Markus, Höhne, Theresa, Koprucki, Thomas, Burger, Sven 等 2019 置信度 0.66 Nanophotonic devicesdevice simulationmulti-physics modelsVCSELssingle-photon sources
• Review of NanosheetTransistors Technology
  Nano-sheet transistor can be defined as a stacked horizontally gate surrounding the channel on all direction. This new structure is earning extremely attention from research to cope the restriction of current Fin Field Effect Transistor (FinFET) structure. To …
  datacite Natheer, Firas 2023 置信度 0.66 Electrical circuits and systems
• Multi-dimensional modeling and simulation of semiconductor nanophotonic devices
  Self-consistent modeling and multi-dimensional simulation of semiconductor nanophotonic devices is an important tool in the development of future integrated light sources and quantum devices. Simulations can guide important technological decisions by revealing…
  datacite Kantner, Markus, Höhne, Theresa, Koprucki, Thomas, Burger, Sven 等 2019 置信度 0.66 510Nanophotonic devicesdevice simulationmulti-physics modelsVCSELs
• Electronic states in semiconductor nanostructures and upscaling to semi-classical models
  In semiconductor devices one basically distinguishes three spatial scales: The atomistic scale of the bulk semiconductor materials (sub-Angstroem), the scale of the interaction zone at the interface between two semiconductor materials together with the scale o…
  datacite Koprucki, Thomas, Kaiser, Hans-Christoph, Fuhrmann, Jürgen 2006 置信度 0.66 510Semiconductor nanostructureskp methodelectronic statesband structure
• Electronic states in semiconductor nanostructures and upscaling to semi-classical models
  In semiconductor devices one basically distinguishes three spatial scales: The atomistic scale of the bulk semiconductor materials (sub-Angstroem), the scale of the interaction zone at the interface between two semiconductor materials together with the scale o…
  datacite Koprucki, Thomas, Kaiser, Hans-Christoph, Fuhrmann, Jürgen 2006 置信度 0.66 Semiconductor nanostructureskp methodelectronic statesband structuresemiclassical models
• GaAs-based semiconductor optical amplifiers with quantum dots as an active medium
  In dieser Arbeit über GaAs-basierte optische Halbleiterverstärker (SOA) mit InGaAs Quantenpunkten (QPen) als aktivem Material wird über die Herstellung und Charakterisierung solcher Bauelemente für optische Verstärkung im 1.3 µm Wellenlängenbereich berichtet. …
  datacite Lämmlin, Matthias 2007 置信度 0.66 530 PhysikBitfehlerrateGaAsHalbleiterverstärkerQuantenpunkt
• Spatio-temporal modeling and device optimization of passively mode-locked semiconductor lasers
  Passively mode-locked lasers produce regular optical pulse trains at high repetition rates and find many applications in science and technology. This thesis numerically investigates two specific devices: a monolithically integrated three-section tapered semico…
  datacite Meinecke, Stefan 2021 置信度 0.66 530 Physiksemiconductor lasermode-lockingnonlinear dynamicsnumerical simulation
• Nano-scale Raman thermometry of diamond
  Raman spectroscopy is well established over a broad range of interdisciplinary applications, which include optical imaging, crystallographic probing, spectroscopy and thermometry. The basis of this thesis is Raman thermometry with nanodiamond, i.e. nano-scale …
  datacite Conquest, Oliver 2022 置信度 0.66 Other education not elsewhere classified
• Nano-scale Raman thermometry of diamond
  Raman spectroscopy is well established over a broad range of interdisciplinary applications, which include optical imaging, crystallographic probing, spectroscopy and thermometry. The basis of this thesis is Raman thermometry with nanodiamond, i.e. nano-scale …
  datacite Conquest, Oliver 2022 置信度 0.66 Other education not elsewhere classified
• Switchable nanoelectronic devices beyond silicon
  Silicon-based electronics have been the mainstay of the electronics industry for several decades, but silicon is now approaching its physical limits where it would fail to keep up with future demands. Areas such as internet-of-things, crypto-currencies, and sp…
  datacite NIRANTAR, Shruti 2024 置信度 0.66 MicroelectronicsFunctional materialsNanoelectronicsNanomaterials
• TWO-DIMENSIONAL NANO-TRANSISTORS FOR STEEP-SLOPE DEVICES AND HARDWARE SECURITY
  Since the discovery of graphene, two-dimensional (2D) materials have attracted broad interests for transistor applications due to their atomically thin nature. This thesis studies nano-transistors based on 2D materials for several novel applications, including…
  datacite Wu, Peng 2021 置信度 0.66 Electrical engineering not elsewhere classifiedNanomaterialsNanoelectronics
• TWO-DIMENSIONAL NANO-TRANSISTORS FOR STEEP-SLOPE DEVICES AND HARDWARE SECURITY
  Since the discovery of graphene, two-dimensional (2D) materials have attracted broad interests for transistor applications due to their atomically thin nature. This thesis studies nano-transistors based on 2D materials for several novel applications, including…
  datacite Wu, Peng 2021 置信度 0.66 Electrical engineering not elsewhere classifiedNanomaterialsNanoelectronics
• Future interconnect materials for highly integrated semiconductor devices
  As semiconductor-based electronic technologies continue downscaling, there is an urgent need to overcome the limitations of interconnect architectures and materials that are driving an unsustainable increase in energy consumption and jeopardizing performance. …
  datacite Kim, Hyeongjoon, Oh, Sehun, An, Sihyeon, Kim, Jaewon 等 2025 置信度 0.66 40 Engineering51 Physical Sciences5104 Condensed Matter Physics
• Low-Power Timing Optimization Via Power And Clock Gating In Advanced Nodes: Techniques, Challenges and Future Directions
  The continued scaling of semiconductor technology to advanced nodes at 7 nm, 5 nm, and 3 nm has intensified challenges in power leakage, timing convergence, and process variability for modern System-on-Chip (SoC) designs. Among the most effective low-power des…
  datacite Ujjwal Singh 2026 置信度 0.66 Low-Power DesignTiming OptimizationClock GatingPower GatingAdvanced Nodes
• Low-Power Timing Optimization Via Power And Clock Gating In Advanced Nodes: Techniques, Challenges and Future Directions
  The continued scaling of semiconductor technology to advanced nodes at 7 nm, 5 nm, and 3 nm has intensified challenges in power leakage, timing convergence, and process variability for modern System-on-Chip (SoC) designs. Among the most effective low-power des…
  datacite Ujjwal Singh 2026 置信度 0.66 Low-Power DesignTiming OptimizationClock GatingPower GatingAdvanced Nodes
• COMPREHENSIVE ANALYSIS OF NANOSCALE FABRICATION TECHNIQUES FOR SEMICONDUCTOR DEVICES WITH EMPHASIS ON LITHOGRAPHIC INNOVATIONS AND QUANTUM DOT INTEGRATION
  Nanoscale fabrication is a cornerstone of semiconductor device advancement, enabling the miniaturization and enhanced functionality of modern electronics. This paper provides a comprehensive analysis of nanoscale fabrication techniques, focusing on lithographi…
  datacite Researcher 2025 置信度 0.66 Nanoscale Fabrication, Lithography, Quantum Dots, EUV Lithography, Nanoimprint Lithography, Semiconductor Devices
• Compound semiconductor device library
  crossref 2003-06-30T09:57:08Z 置信度 0.70
• Review of Power Device Concepts
  crossref Roland Sittig 2011-07-18T15:48:33Z 置信度 0.70
• A review of nanoimprint lithography for high-volume semiconductor device manufacturing
  crossref Douglas J. Resnick, Jin Choi 2018-04-12T08:51:55Z 置信度 0.70
• Semiconductor Device-based Sensors for Gas, Chemical, and Biomedical Applications
  crossref Robert Bogue 2014-11-15T18:29:39Z 置信度 0.70
• A Review of the Reliability of III–V Opto-electronic Components
  crossref S. P. Sim 2012-07-28T20:04:34Z 置信度 0.70
• Photoelectrochemical Methods For III-V Compound Semiconductor Device Processing
  crossref P. Kohl 2002-07-27T11:43:28Z 置信度 0.70
• Device reliability challenges for modern semiconductor circuit design – a review
  Abstract. Product development based on highly integrated semiconductor circuits faces various challenges. To ensure the function of circuits the electrical parameters of every device must be in a specific window. This window is restricted by competing mechanis…
  crossref C. Schlünder 2010-04-29T12:22:15Z 置信度 0.70
• Application of Laser to Semiconductor Device Process
  crossref Kenji GAMO 2011-12-16T04:36:20Z 置信度 0.70
• RF and Microwave Semiconductor Device Handbook [Book Review]
  crossref 2004-06-15T20:13:51Z 置信度 0.70
• Faculty Opinions recommendation of An integrated semiconductor device enabling non-optical genome sequencing.
  crossref Stephan Beck 2012-08-20T13:24:07Z 置信度 0.70
• Integrating power semiconductor device courses in electrical engineering curricula, a review paper
  crossref Ibrahim M. Abdel-Motaleb 2014-08-18T17:03:43Z 置信度 0.70
• Thermal structuring of metal-semiconductor core fibres: toward optoelectronic device fabrication
  Abstract Combining metal and semiconducting components in the core of a glass-clad fibre brings new breadth to the range of structures that can be fabricated using localized thermal gradients. Both axial and lateral structuring of fibres drawn withm ultiple co…
  crossref Seunghan Song, Fredrik Laurell, Bailey Meehan, Thomas Hawkins 等 2021-11-18T16:16:51Z 置信度 0.70
• Erratum: Wigner-function model of a resonant-tunneling semiconductor device
  crossref William R. Frensley 2002-07-27T02:38:00Z 置信度 0.70
• Semiconductor Laser as High Speed Functional Device.
  crossref Takeshi KAMIYA, Jungkeun LEE 2011-12-16T04:43:28Z 置信度 0.70
• Ultrafast Nonlinear Optical Device Utilizing Intersubband-Transition in Semiconductor Quantum Wells
  crossref 2011-12-16T04:42:27Z 置信度 0.70
• The Stationary Semiconductor Device Equations. (Peter A. Markowich)
  crossref Joseph M. Pimbley 2005-03-07T02:09:36Z 置信度 0.70
• Dopant impurity diffusion from polymer diffusants and its applications in semiconductor device technology. A review
  crossref E. G. Guk 2002-07-27T10:22:46Z 置信度 0.70
• Semiconductor material and device characterization [Book Review]
  crossref P. Hagouel 2005-04-21T20:22:11Z 置信度 0.70
• Historical Overview of Semiconductor Device Reliability for Telecommunication Networks––Field Data, Prediction Model of Device Failure Rate, and Wear-out Failure Analyses at NTT
  crossref Noboru Shiono, Eisuke Arai, Shin'ichiro Mutoh 2024-05-19T22:12:26Z 置信度 0.70
• Advanced composites and other advanced materials for electronic packaging thermal management
  crossref C. Zweben 2002-11-13T14:55:33Z 置信度 0.70
• 2009 Index IEEE Transactions on Advanced Packaging Vol. 32
  crossref 2009-11-05T13:30:01Z 置信度 0.70
• An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)
  Chiplets connected on package, referred to as system-in-package (SiP), has become mainstream across the compute continuum. Universal Chiplet Interconnect expressTM (UCIeTM) is an open industry standard offering significant bandwidth, power-efficiency, and late…
  crossref Debendra Das Sharma, Michael Mingliang Liu 2025-02-17T16:20:33Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2010-08-09T22:11:51Z 置信度 0.70
• 2010 Index IEEE Transactions on Advanced Packaging Vol. 33
  crossref 2011-01-07T14:04:02Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2010-03-03T20:57:35Z 置信度 0.70
• Packaging of MEMS and MOEMS: Challenges and a Case Study
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2011-01-07T14:04:02Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-07-18T18:53:58Z 置信度 0.70
• Advanced microelectronic packaging using BeO ceramics
  crossref J.L. Sepulveda 2002-11-27T11:41:39Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-02-06T22:38:54Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2007-11-07T19:19:13Z 置信度 0.70
• Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
  crossref CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino 等 2024-01-11T02:07:01Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2007-08-16T21:00:19Z 置信度 0.70
• 2008 Index IEEE Transactions on Advanced Packaging Vol. 31
  crossref 2008-12-09T18:04:52Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2010-05-12T16:11:03Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-12-09T18:04:52Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-02-11T20:20:18Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2007-06-01T20:11:11Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2009-02-19T22:09:56Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-08-13T19:37:37Z 置信度 0.70
• Photonic chiplet interconnection via 3D-nanoprinted interposer
  crossref Huiyu Huang, Zhitian Shi, Giuseppe Talli, Maxim Kuschnerov 等 2024-08-19T05:39:42Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2009-11-05T13:30:01Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2008-05-05T20:36:46Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2009-05-27T15:29:29Z 置信度 0.70
• 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
  crossref 2011-09-14T16:02:26Z 置信度 0.70
• IEEE Transactions on Advanced Packaging publication information
  crossref 2009-08-07T15:50:22Z 置信度 0.70
• High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging
  crossref Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda 等 2024-01-11T20:18:45Z 置信度 0.70
• Rapid Prediction of Effective Orthotropic Elastic Properties for 2.5D Chiplet Packaging RDL
  crossref Dingjie Lu, Jun Liu, Wenzu Zhuang, Richard Xian-Ke Gao 等 2026-06-17T19:37:15Z 置信度 0.70
• Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications
  crossref Chuei-Tang Wang, Shu-An Shang, Yu-Ming Hsiao, Kathy Yan 等 2024-03-18T18:54:03Z 置信度 0.70
• Characterization, Testing, Simulation, and Failure Analysis of Materials in Advanced Semiconductor Packaging
  crossref Yan Li 2026-08-25T19:17:23Z 置信度 0.70
• Index
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Contributors
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Acronyms
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Index
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Frontmatter
  crossref 2015-05-18T21:11:37Z 置信度 0.70
• Encapsulation Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
  crossref Zihao Lin, Ching-Ping Wong 2026-08-25T19:17:23Z 置信度 0.70
• Frontmatter
  crossref 2010-02-04T21:10:39Z 置信度 0.70
• Microelectromechanical Systems and Packaging
  crossref Y. C. Lee 2008-12-16T13:54:29Z 置信度 0.70
• RDL Formation Using Low Df Thermosetting Film: Progress of the Chiplet Integration Platform Consortium in Japan
  crossref Yusuke Naka, Meiten Koh, Ichiro Kono, Yasuhiro Morikawa 等 2025-05-21T17:36:38Z 置信度 0.70
• Lasers in Advanced IC Packaging Applications
  crossref Nick Konidaris 2008-03-13T19:33:06Z 置信度 0.70
• Wafer Level Chip Scale Packaging
  crossref Michael Töpper 2016-11-18T08:37:52Z 置信度 0.70
• Wafer Level Chip Scale Packaging
  crossref Michael Töpper 2008-12-16T13:54:29Z 置信度 0.70
• Research on Intelligent Thermal Optimization for Chiplet-Based Heterogeneously Integrated AI Chip Embedded with Leaf-Vein-Inspired Fractal Microchannels.
  europepmc 2026 置信度 0.80
• Emerging Chiplet-Based Architectures for Heterogeneous Integration
  This article explores the semiconductor industry's pivotal shift from traditional monolithic system-on-chip designs to chiplet-based architectures employing heterogeneous integration. As Moore's Law scaling encounters fundamental physical and economic barriers…
  datacite Mandalapu, Murali Krishna Reddy 2025 置信度 0.66 Architecture; Chiplet; Heterogeneous; Integration; Semiconductor
• Emerging Chiplet-Based Architectures for Heterogeneous Integration
  This article explores the semiconductor industry's pivotal shift from traditional monolithic system-on-chip designs to chiplet-based architectures employing heterogeneous integration. As Moore's Law scaling encounters fundamental physical and economic barriers…
  datacite Mandalapu, Murali Krishna Reddy 2025 置信度 0.66 Architecture; Chiplet; Heterogeneous; Integration; Semiconductor
• Advanced Chip Packaging Market: Growth Trends, Key Drivers, and Future Outlook
  The Advanced Chip Packaging Market is growing steadily, driven by increasing demand for high-performance and miniaturized electronic devices, along with the rapid expansion of AI, 5G, and high-performance computing. Key drivers include the shift toward chiplet…
  datacite Next Move Strategy Consulting 2026 置信度 0.66 SemiconductorsElectronics
• Advanced Chip Packaging Market: Growth Trends, Key Drivers, and Future Outlook
  The Advanced Chip Packaging Market is growing steadily, driven by increasing demand for high-performance and miniaturized electronic devices, along with the rapid expansion of AI, 5G, and high-performance computing. Key drivers include the shift toward chiplet…
  datacite Next Move Strategy Consulting 2026 置信度 0.66 SemiconductorsElectronics
• Chiplet-Based Architectures and Advanced Packaging
  datacite Safa Mohamed , Safa Kamal , Safa Mostafa 2026 置信度 0.66
• Chiplet-Based Architectures and Advanced Packaging
  datacite Safa Mohamed , Safa Kamal , Safa Mostafa 2026 置信度 0.66
• Enabling Broad-Based Access to Advanced Packaging Facilities for Scientific Discovery: A National Strategy for CHIPS for Science
  Federal and state investments in advanced semiconductor packaging, including the CHIPS and Science Act, DARPA's Next Generation Microsystems Manufacturing (NGMM) program, and state programs such as the Texas CHIPS Act, have created domestic capability that mos…
  datacite Cullinan, Michael 2026 置信度 0.66 advanced packaging3D heterogeneous integration (3DHI)CHIPS for Scienceresearch infrastructuremulti-project packaging (MPP)
• Reflective Lensless Through-Silicon Phase Imaging for Advanced Semiconductor Packaging Metrology
  Achieving high-yield heterogeneous integration in silicon photonics and advanced microelectronics requires compact, high-contrast metrology to inspect buried interfaces during die-to-wafer and stacked-chip assembly. This inspection underpins pre-bond alignment…
  datacite Karen Eguiazarian, Mircea Guina, Jukka Viheriälä, Aleksandr Vlasov 等 2026 置信度 0.66 EngineeringInformation and computing sciences
• Reflective Lensless Through-Silicon Phase Imaging for Advanced Semiconductor Packaging Metrology
  Achieving high-yield heterogeneous integration in silicon photonics and advanced microelectronics requires compact, high-contrast metrology to inspect buried interfaces during die-to-wafer and stacked-chip assembly. This inspection underpins pre-bond alignment…
  datacite Karen Eguiazarian, Mircea Guina, Jukka Viheriälä, Aleksandr Vlasov 等 2026 置信度 0.66 EngineeringInformation and computing sciences
• Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules
  As contribution to projects like European Processor Initiative (EPI) as well as Stencil- and Tensor Accelerator (STX), Fraunhofer IZM has further developed its advanced packaging portfolio with special focus on wafer level packaging of high performance computi…
  datacite Zoschke, Kai, Oppermann, Hermann, Schiffer, Michael, Ndip, Ivan 等 2024 置信度 0.66 High performance computingwafer level packaginghigh density redistributionsilicon interposerthrough silicon vias (TSVs)
• WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks
  Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated materials. However, only a limited number of studies have focused on developing comp…
  datacite Li, Xinyu, Tang, Min, Sun, Zeyu, Zhu, Wenxing 等 2026 置信度 0.66 Numerical Analysis (math.NA)FOS: Mathematics
• CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration
  Advanced 2.5D Systems-in-Package (SiPs) compose a growing portion of high-performance systems. While the packaging and interconnect choices play a large role in the overall system design, system architects still lack a suitable framework for early design space…
  datacite Zhu, Zhengping, Rovinski, Austin 2026 置信度 0.66 Hardware Architecture (cs.AR)FOS: Computer and information sciencesB.4.3; C.4
• Advanced Verification Methodologies for Multi-Die Integrated Systems
  The semiconductor industry is experiencing a fundamental transformation as traditional monolithic system-on-chip integration encounters insurmountable economic and physical limitations at advanced process nodes. Escalating mask costs, yield degradation on larg…
  datacite Suri Babu Talla 2026 置信度 0.66