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• Reliability of wide bandgap semiconductor power switching devices
  crossref Krishna Shenai 2011-02-15T21:19:50Z 置信度 0.70
• Principles and Optimization of GaN HEMTs
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Preparation and Performance of GaN HEMTs
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Introduction
  crossref Yuming Zhang, Hui Guo, Jinfeng Zhang, Chiwen Qian 等 2025-09-26T06:24:42Z 置信度 0.70
• Growth and Optimization of AlGaN/GaN Heterqstructures
  crossref 2016-11-14T13:13:51Z 置信度 0.70
• Wide bandgap (WBG) semiconductor power converters for DC microgrid applications
  crossref Krishna Shenai 2015-07-17T16:12:19Z 置信度 0.70
• Contacts for wide bandgap semiconductor materials
  crossref Thomas Lamp, Sam Liu, M. L. Ramalingam 2009-04-10T16:04:45Z 置信度 0.70
• Applications of GaN power devices
  crossref Fred C. Lee, Qiang Li, Chao Fei, Yuchen Yang 2018-10-26T14:48:07Z 置信度 0.70
• Wide bandgap semiconductor MESFETs for high temperature applications
  crossref R.J. Trew, M.W. Shin 2002-12-17T15:43:17Z 置信度 0.70
• Heteroepitaxial Growth and Defect Properties of Nitrides
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Vertical GaN-on-GaN power devices
  crossref Houqiang Fu, Kai Fu, Yuji Zhao 2020-10-01T10:23:35Z 置信度 0.70
• The wide and the narrow: DARPA/MTO programs for RF applications in wide bandgap and antimonide-based semiconductors
  crossref M. Rosker 2005-11-15T10:48:27Z 置信度 0.70
• Enhancement-Mode GaN HEMTs and Integrated Circuits
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Wide bandgap (WBG) semiconductor power device datasheets and circuit models
  crossref Krishna Shenai 2015-10-13T16:52:35Z 置信度 0.70
• Wide-Bandgap Compound Semiconductors to Enable Novel Semiconductor Devices
  crossref M.H. Crawford, W.W. Chow, A.F. Wright, S.R. Lee 等 2007-04-18T14:18:51Z 置信度 0.70
• Al-rich AlGaN semiconductor materials and their device applications
  crossref Liwen Sang, Jiejun Wu, Fujun Xu, Zhixin Qin 等 2019-06-21T15:37:48Z 置信度 0.70
• Application of Ultra-Wide Bandgap Semiconductor Ga2O3Material in Photodetectors
  The rapid development of optoelectronic technology, the demand for high-performance photodetectors in various fields has been continuously increasing. Ultra-wide bandgap materials have attracted significant attention due to their potential to meet the requirem…
  crossref Zixue Huang 2025-09-09T09:21:27Z 置信度 0.70
• II-VI Wide-Bandgap Semiconductor Device Technology: Post-Deposition Treatments
  crossref Ghenadii Korotcenkov 2023-04-20T14:12:15Z 置信度 0.70
• Electric vehicles and expectations for wide bandgap power devices
  crossref Masakatsu Hoshi 2016-07-28T16:45:56Z 置信度 0.70
• II-VI Wide-Bandgap Semiconductor Device Technology: Stability and Oxidation
  crossref Ghenadii Korotcenkov 2023-04-20T14:12:15Z 置信度 0.70
• Defects and carrier lifetimes in gallium oxide
  crossref E B Yakimov, A Y Polyakov 2020-10-01T10:23:35Z 置信度 0.70
• Optical properties of gallium oxide nanostructures
  crossref Manuel Alonso-Orts, Emilio Nogales, Bianchi Méndez 2020-10-01T10:23:35Z 置信度 0.70
• Wide Bandgap Semiconductor Research Interests at Navy Laboratories
  The Navy and other government laboratories have been actively engaged in wide bandgap semiconductor research for power and RF applications for over twenty years. In this presentation I will give brief overview of the scope of research at the Navy labs with emp…
  crossref Karl D Hobart 2020-02-27T00:51:43Z 置信度 0.70
• Wide bandgap semiconductor switching devices in integrated motor drives
  crossref Thomas M. Jahns, Bulent Sarlioglu 2023-06-06T13:25:44Z 置信度 0.70
• Wide-bandgap-semiconductor wide-bandwidth wide-temperature-range power amplifiers
  crossref J.C.M. Hwang, L.T. Kehias, J.A. Cook, M.C. Calcatera 等 2003-01-22T15:57:59Z 置信度 0.70
• Growth of InAlN/GaN Heterostructures by Pulsed MOCVD
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Ultra-Wide-Bandgap Semiconductor for Improving Resonant Spin-Transfer Torque
  The recent study on spin-transfer torque (STT) in resonant-tunneling magnetic tunnel junctions (RT-MTJs) utilizing an ultra-wide-bandgap semiconductor (SC) [Formula: see text]-Ga 2 O 3 presents significant advancements in spintronic technology. This research e…
  crossref Hadi Zolfaghari, Nader Ghobadi, Reza Daqiq 2025-05-17T04:05:44Z 置信度 0.70
• Defects and Physical Properties of Group III Nitrides
  crossref 2016-11-14T18:13:51Z 置信度 0.70
• Impurity Level-Induced Broadband Photoelectric Response in Wide-Bandgap Semiconductor SrSnO₃.
  europepmc 2024 置信度 0.80
• Wide bandgap semiconductor nanomembranes as a long-term bio-interface for flexible, implanted neuromodulator
  Abstract Electrical neuron stimulation holds promise for the treatment of several chronic neurological disorders, including spinal cord injury, epilepsy, and Parkinson’s disease. The implementation of ultrathin, flexible electrodes, that can offer non-invasive…
  europepmc Tuan-Khoa Nguyen, Matthew Barton, Aditya Ashok, Thanh-An Truong 等 2022 置信度 0.80
• SGDC–ZnO Composite Electrolyte for Semiconductor-Ionic Fuel Cells: Optimization of Mass Ratio and Heterointerface Mechanism
  europepmc 2026 置信度 0.80
• Pathways to High-Efficiency Perovskite-Organic Tandem Solar Cells.
  europepmc 2026 置信度 0.80
• Fast Neutron-Induced Enhancement of the I8 Exciton Emission in ZnO Bulk Single Crystals.
  europepmc 2026 置信度 0.80
• Optimization of terahertz s-wave attenuated total reflection spectroscopy for characterizing a thin transport layer on an undoped semiconductor substrate.
  europepmc 2026 置信度 0.80
• Large Piezoresistive Effect in a Ti/n-4H-SiC Schottky Junction.
  europepmc 2026 置信度 0.80
• Polarization-Multiplexed Chaotic LiDAR Based on a VCSEL with Delayed Orthogonal Feedback.
  europepmc 2026 置信度 0.80
• Wide Bandgap Semiconductor Spintronics
  crossref Vladimir Litvinov 2016-04-01T19:43:35Z 置信度 0.70
• Copyright
  crossref 2019-06-21T15:38:52Z 置信度 0.70
• Copyright
  crossref 2018-06-01T18:25:39Z 置信度 0.70
• Copyright
  crossref 2018-10-26T14:48:08Z 置信度 0.70
• Index
  crossref 2018-10-26T18:48:47Z 置信度 0.70
• Index
  crossref 2018-06-01T14:25:41Z 置信度 0.70
• Wide Bandgap Semiconductors
  crossref 2020-12-22T13:24:49Z 置信度 0.70
• Review of "Spin coating modeling and planarization using fill patterns for advanced packaging technologies"
  crossref Jerwin Prabu A 2017-08-14T13:28:23Z 置信度 0.70
• A Review of Food Packaging Materials and Active Packaging System
  The purpose of this study is to give a brief review of food packaging materials and active packaging systems used in food processing. The purpose of food packaging is to make our lives easier. Food packaging that is effective serves a number of purposes. It fu…
  crossref 2022-09-30T07:00:18Z 置信度 0.70
• A review of zero index metamaterial
  crossref Jianyu Lin, Dongying Li, Wenxian Yu 2018-02-01T21:46:47Z 置信度 0.70
• Review of RF packaging research at Georgia Tech's PRC
  crossref J. Laskar, N. Jokerst, M. Brooke, M. Harris 等 2002-11-27T16:41:39Z 置信度 0.70
• Research Progress and Application of Flexible Humidity Sensors for Smart Packaging: A Review
  crossref Haowei He, Yabo Fu, Siqi Liu, Jinfu Cui 等 2020-04-09T13:03:01Z 置信度 0.70
• Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design
  The increasing power density of 2.5D and 3D chiplets imposes severe thermal constraints that have a direct impact on the performance and long-term reliability of high-performance computing systems. Stacked and laterally integrated dies, which generate hundreds…
  crossref Darpan Virmani, Baibhab Chatterjee 2025-12-17T13:42:52Z 置信度 0.70
• Review on Advanced Food Packaging Materials Based on Functional Biopolymer Matrix
  crossref Md. Aftab Alam, Rizwana Khatoon, Shamsul Huda, Pramod Kumar Sharma 2022-07-01T05:01:41Z 置信度 0.70
• A review of SiC power module packaging technologies: Attaches, interconnections, and advanced heat transfer
  crossref Brandon S. Passmore, Alexander B. Lostetter 2017-06-01T20:22:56Z 置信度 0.70
• Biopolymers, Nanocomposites, and Environmental Protection: A Far-Reaching Review
  crossref Sukanchan Palit, Chaudhery Mustansar Hussain 2018-11-05T09:24:10Z 置信度 0.70
• Active Packaging In Keeping The Food Fresh – A Review
  crossref 2017-10-06T03:07:43Z 置信度 0.70
• A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
  The exceptional electronic, thermal, mechanical, and optical characteristics of carbon nanotubes offer significant improvement in diverse applications such as flexible electronics, energy conversion, and thermal management. We present an overview of recent res…
  crossref Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham 2011-06-18T03:34:44Z 置信度 0.70
• Review About Advanced LED Packaging
  ABSTRACT Improving the performance of LEDs such as increasing the light extraction efficiency (LEE), external quantum efficiency (EQE) and light efficiency of LEDs are main requirements for the LED packaging process. In this review, methods to improve the LEE,…
  crossref Yanghao Wu, Kai Hollstein, Kirsten Weide-Zaage 2025-12-01T20:35:32Z 置信度 0.70
• Composite Packaging
  crossref Himanshu, Nishant Kumar, Pratibha, Himani 2026-01-20T11:53:17Z 置信度 0.70
• Universal Handling Solutions and Advanced Test Strategies: Enabling Scalable Heterogeneous Integration
  ABSTRACT Introduction: The Shift to Heterogeneous Integration : The semiconductor landscape is undergoing a fundamental transformation as advanced packaging evolves toward a system-level paradigm. The shift from monolithic semiconductor designs—where developme…
  crossref Raj Varma, Jerry Broz, Victoria Tran 2026-05-13T02:09:43Z 置信度 0.70
• Selective Laser Modification for Stress Mitigation and Warpage Reduction in Advanced 3DIC and Optoelectronic Packaging
  crossref Yu-Lin Kao, Lon A. Wang 2026-02-16T21:07:39Z 置信度 0.70
• MRAM-MoE: Efficient Inference of Mixture-of-Experts LLMs with MRAM Chiplet-based Accelerators
  crossref Md Tanjimur Rahman, Md Asef, Mehdi Sadi 2026-06-18T14:17:19Z 置信度 0.70
• TSV-Based Shoelace Inductor: A High-Density Solution for Advanced Packaging Platforms
  crossref Yushu Zhao, Yousef Safari, Boris Vaisband 2026-02-19T20:58:46Z 置信度 0.70
• Starches in Smart Packaging
  crossref 2026-08-14T21:01:46Z 置信度 0.70
• Wirelength and Peak-Temperature Co-Optimization of 3D Chiplet-Based SoCs for zk-SNARK Proof Generation
  Layer-2 rollups shift scalability from on-chain execution to off-chain proving by posting zk-SNARK proofs to Layer-1 blockchains. While zk-SNARKs offer succinct and verifiable computation, proof generation is highly memory-intensive, motivating decentralized s…
  crossref Marten Brelén, Dongfang Wu, Shuo Ren, Chi Pui Pang 等 2026-07-07T15:38:33Z 置信度 0.70
• Advanced radiation resistant packaging technology and reliability prediction model for avionics systems
  crossref Haitao Ren, Bing Zhang, Shuo Li 2026-01-02T10:48:18Z 置信度 0.70
• Citric Acid and Dimer Diol‐Based Polyester Films for Food Packaging Applications
  ABSTRACT This study investigates the properties and potential advantages of citric acid and dimer diol‐based polyester films for flexible food packaging applications. Sebacic acid and Neopentyl glycol are used to enhance tensile strength and improve thermal st…
  crossref Sara Aghaeinejad Ajbisheh, Dilara Nur Dikmetas, Emrah Cakmakci, Funda Karbancioglu‐Guler 等 2026-03-08T08:10:47Z 置信度 0.70
• Spatiotemporal thermal characterization for 3D stacked chiplet systems based on transient thermal simulation
  crossref Yanrong Pei, Wenchang Li, Rong Chen 2026-02-16T07:22:01Z 置信度 0.70
• Biobased sustainable intelligent packaging
  crossref Tilak Gasti, Shazia Farheen, Shruti Dixit 2026-06-26T11:58:26Z 置信度 0.70
• Starch-based smart packaging added with nanomaterials
  crossref Hebat-Allah S. Tohamy 2026-08-14T21:00:43Z 置信度 0.70
• An Experience-Driven Advanced Digital Lithography System for Panel Applications
  crossref Yusuke Matsuhashi, Tomomi Terada, Koichi Bito, Masaki Kato 等 2026-06-10T19:59:01Z 置信度 0.70
• A Novel Membrance-Based Adaptive Pressure Curing System for Warpage Suppression in Advanced Packaging
  crossref Huan-Ping Su, Ming-Hua Hsu, Chih-Horng Horng 2026-06-17T19:37:15Z 置信度 0.70
• Mechanisms and Strategies of Smart Packaging
  Active packaging and intelligent packaging are two innovative technologies in the packaging field. Their main goal is to optimize product preservation and information interaction. Both also involve the use of different mechanisms and strategies to achieve smar…
  crossref 2026-01-22T15:21:51Z 置信度 0.70
• CHSM-Guard: Secure Boot and In-Field Firmware Updates for Chiplet-Based SiPs
  crossref Galib Ibne Haidar, Jingbo Zhou, Mark Tehranipoor, Farimah Farahmandi 2026-06-18T14:17:19Z 置信度 0.70
• Industrialization application of starch-based smart packaging
  crossref Łukasz Łopusiewicz, Danila Merino 2026-08-14T21:00:43Z 置信度 0.70
• Advanced packaging and interconnects: key enablers of heterogeneous integration and advancing AI solutions
  crossref Kunal Parekh 2026-04-09T19:32:09Z 置信度 0.70
• The intersection of smart packaging advances with sustainable packaging trends
  crossref Sami Fattouch, Mouna Boulares, Atef Lakoud, Olfa Ben Moussa 等 2025-12-05T21:07:41Z 置信度 0.70
• Carbon dot-integrated edible films: emerging synergies for advanced food packaging applications
  The escalating global demand for safe, sustainable, and environmentally friendly food packaging has stimulated the research of edible films as potential alternatives to conventional plastics.
  crossref Awat S. Mohammed, Sewara J. Mohammed 2026-03-02T12:11:42Z 置信度 0.70
• Nanotechnology in active food packaging
  crossref Ajay Kathuria, Pradeep Kumar, Shefali Tripathi, Kirtiraj Gaikwad 2026-05-08T08:51:15Z 置信度 0.70
• Functional Inks and Substrates for Smart Packaging
  Functional ink is the core of smart packaging to achieve dynamic perception and interaction capabilities. It gives packaging real-time information transmission, anti-counterfeiting tracking, and environmental response functions through color change, conductivi…
  crossref 2026-01-22T15:21:51Z 置信度 0.70
• Packaging, Vacuum Packaging: Principles and Uses
  crossref Ghumika Pandita, Yuvraj K Bhosale, Swarup Roy 2026-08-03T21:49:58Z 置信度 0.70
• Ethylene scavengers in active food packaging
  crossref Abir El-Araby, Tilak Gasti, Ruchir Priyadarshi 2026-05-08T08:51:15Z 置信度 0.70
• Food packaging transportation and distribution
  crossref Tugba Dursun Capar, Nejat Capar 2026-03-07T07:24:48Z 置信度 0.70
• Optimization of Encapsulation process for Advanced package using simulation
  crossref Kazuki Noguchi, Joseph Liang, Sean Wang, Masaharu Kataoka 等 2026-06-10T19:59:01Z 置信度 0.70
• Meat Preservation and Packaging Techniques
  crossref 2026-06-26T09:47:13Z 置信度 0.70
• Digitalization of CAPEX Governance Processes in Advanced Food Packaging Manufacturing Operations
  Operational governance digitalization the modernisation of approval workflows, reporting standardisation, and multi-site coordination is underexplored in Industry 4.0 research. This paper addresses that gap by proposing the Smart Governance and Operational Coo…
  crossref Mushtaq Quader Sharoz 2026-07-27T09:18:06Z 置信度 0.70
• Innovative patterning technology for advanced packaging and power electronics applications
  crossref Poulomi Mukherjee, Howard Kao, Alan May, Sarah Wozny 等 2026-05-20T19:48:55Z 置信度 0.70
• Effective Unknown Foreign Material Identification for Advanced Packaging Using Novel Submicron Infrared (O-PTIR) Microspectroscopy
  crossref Michael K. F. Lo, Changlong Liu, Hailong Hu 2026-06-02T20:03:17Z 置信度 0.70
• Introduction of Printed Electronics and Smart Packaging
  This chapter mainly introduces what printed electronics and smart packaging are and why printed electronics technology is used to manufacture smart packaging. Compared with traditional electronic manufacturing technology, printed electronics technology provide…
  crossref 2026-01-22T15:21:51Z 置信度 0.70
• Functionally Undetectable Interconnect Faults in Chiplet-Based Designs
  Chiplet-based designs use large numbers of interconnects that need to be tested thoroughly. Standard isolation logic allows the logic blocks (chiplets) and the interconnects to be tested separately. It was recently suggested for additional defect coverage to u…
  crossref Irith Pomeranz 2026-02-19T11:52:08Z 置信度 0.70
• Introduction to High-Speed LVDS Twisted Pair Transmission Across PCB and Chiplet RDL Interfaces
  crossref Mayukh Nandy, James Doyle, Simon Mayberry, Siyang Liu 等 2026-06-17T19:37:15Z 置信度 0.70
• Copyright
  crossref 2026-05-08T08:51:15Z 置信度 0.70
• Biopolymer-Based Intelligent Food Packaging
  crossref 2026-06-26T11:53:53Z 置信度 0.70
• Domain Transformation and Decomposition Method for Composable Thermal Modeling and Simulation of Chiplet-Based 2.5D Integrated System
  crossref Shunxiang Lan, Min Tang 2026-03-10T19:51:15Z 置信度 0.70
• Printed Tracks for Smart Tags and Packaging
  Printed electrodes, printed tracks, and interconnects are the basis of all printed electronic devices. Some printed tracks can also be directly converted into flexible electronic devices, such as antennas, transparent electrodes, stretchable conductors, and fl…
  crossref 2026-01-22T15:21:51Z 置信度 0.70
• Smart and Intelligent Food Packaging
  crossref 2025-12-05T20:59:49Z 置信度 0.70
• A Dual-Mode Online BISR Architecture for Interconnect and Memory Repair in Chiplet-Based Systems
  crossref Donghyun Han, Sooryeong Lee, Jongho Park, Dayoung Kim 等 2026-04-01T20:12:11Z 置信度 0.70
• Chiplet Encapsulation and Planarization with 100 μm Deep Gaps Using AlN Powder Spray + Sputter Hybrid Deposition
  This study presents a hybrid chiplet encapsulation structure that integrates aerosol‐deposited (AD) and sputtered aluminum nitride (AlN) films to address thermal and mechanical challenges in advanced packaging. AD AlN rapidly fills high‐aspect‐ratio trenches (…
  crossref Dohyun Go, Ashita Victor, Alex Wang, Mingeun Choi 等 2026-02-19T19:10:32Z 置信度 0.70
• Sensors and actuators for food packaging
  crossref Akriti Tirkey, Punuri Jayasekhar Babu 2025-12-05T21:07:41Z 置信度 0.70
• Conventional packaging formats in meat preservation
  crossref Myat Noe Khin, Lin Lin 2026-06-26T09:50:08Z 置信度 0.70
• CHIME: Chiplet-based Heterogeneous Near-Memory Acceleration for Edge Multimodal LLM Inference
  crossref Yanru Chen, Runyang Tian, Yue Pan, Zheyu Li 等 2026-06-04T19:53:10Z 置信度 0.70
• A Framework for Chiplet Authentication During Post-Stacking Test
  crossref Juan Suzano, Anthony Philippe, Fady Abouzeid, Philippe Roche 等 2026-05-19T19:47:47Z 置信度 0.70
• Sorption and diffusion of vegetable oil into high-density polyethylene packaging
  crossref Maxime Touffet, Joël Wallecan 2026-08-04T16:22:21Z 置信度 0.70