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• Evaluation of Bio-composite as a Packaging Material from Agricultural Waste
  This study aims to explore the potential of repurposing agricultural waste to develop a biodegradable bio-composite with antimicrobial properties. The research carried out focuses on utilizing pineapple leaves, a rich source of fiber, as the primary component …
  crossref Yashika Santwani, Alina Shaikh, Sejal Rathod 2026-05-08T11:38:31Z 置信度 0.70
• Research on Color and Material Image Matching Design of Cigarette Packaging Based on Sensory Engineering
  With the intensification of competition in the domestic tobacco market and the continuous tightening of tobacco control policies, the brand emotional transmission of cigarette packaging and the matching of users’ emotional demands have become the core competit…
  crossref Y. Tian, Y. Z. Chen 2026-08-15T12:57:58Z 置信度 0.70
• Photo-Definable Dry Film Adhesive and Temporay Bonding De-Bonding Adhesive for Wafer Level Advanced Packaging
  ABSTRACT Recently advanced semiconductor package toward to 5G/6G mmWave and AI high-performance computing (HPC) requests permanent and temporary adhesives which need thin-film insulating material for build-up substrate and temporary bonding de-bonding (TBDB) m…
  crossref Takenori Fujiwara, Akira Shimada, Kazuyuki Matsumura, Keigo Kato 等 2026-05-13T02:09:43Z 置信度 0.70
• 2.5D/3D Chiplet-based Integration: New Dimensions in Design and Testing
  crossref Ganap A. Tewary, Partho Bhoumik, Pragnya S. Nalla, Yu Cao 等 2026-06-18T20:06:49Z 置信度 0.70
• Multifunctional metal-phenolic network-based hybrid materials: advanced engineering composites for food packaging applications
  crossref Arezou Khezerlou, Reza Abedi-Firoozjah, Mahmood Alizadeh Sani, Jong-Whan Rhim 2026-05-11T02:04:11Z 置信度 0.70
• Analyzing the field of packaging as cultural intermediation: A Bourdieusian approach*
  Packaging is a crucial element that plays an important role in consumers’ purchasing preferences in contemporary consumer society. The phenomenon of packaging has a multifaceted identity with its technical, aesthetic, and cultural dimensions, which sometimes s…
  crossref Duygu Çubuk, Alparslan Nas 2026-07-27T12:31:59Z 置信度 0.70
• RL-Driven 3D Clustering of Jscan Architecture with Routing and Area Optimization in Chiplet Sip
  crossref Hilay Patel, Naman Kalra, Jaynarayan T. Tudu 2026-08-18T19:15:26Z 置信度 0.70
• Learning-Assisted Adaptive Hybrid Interconnection Design for Chiplet-Based Heterogeneous Systems
  crossref Md Tareq Mahmud, Ke Wang, Ahmed Louri 2026-06-18T14:17:19Z 置信度 0.70
• Introduction to intelligent packaging
  crossref Parya Ezati, Ajahar Khan 2026-06-26T11:58:26Z 置信度 0.70
• Active Food Packaging
  crossref 2026-05-08T08:51:44Z 置信度 0.70
• Advantages and challenges of active food packaging
  crossref Maria Vesna Nikolic 2026-05-08T08:51:15Z 置信度 0.70
• CFD: A Chiplet Function Decomposition method for edge computing tasks
  crossref Guiling Sun, Yunlong Kong, Haicheng Zhang, Bowen Zheng 2026-01-13T14:21:40Z 置信度 0.70
• Interfacial Engineering of Tannic Acid‐Cross‐Linked Chitosan–Gelatin Biofilms for Advanced Antimicrobial Packaging Applications
  ABSTRACT Biopolymer‐based films have emerged as promising alternatives for sustainable food packaging; however, their practical implementation remains limited by insufficient mechanical stability and sensitivity to humid environments. This work establishes con…
  crossref Johanna Fiallos‐Núñez, Gustavo Cabrera‐Barjas, Patricia Castaño Rivera, Alejandro López Amador 等 2026-08-11T05:01:49Z 置信度 0.70
• 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
  crossref Kai Zhu, Darong Huang, Luis Costero, David Atienza 2026-06-04T19:53:10Z 置信度 0.70
• Food packaging safety: Preventing migration of packaging components to food products and their impacts
  crossref Li Wang 2025-10-25T07:43:52Z 置信度 0.70
• Applications of Picosecond Laser Acoustics for Advanced Packaging
  crossref Johnny Dai, John Tan, Jay Chen, Kwan-Soon Park 等 2026-06-02T20:03:17Z 置信度 0.70
• Timing and Power Optimization in Chiplet-Based SoCs with Heterogeneous Interconnects
  crossref Phaneendra Chainulu Sri Adibhatla 2026-04-07T13:08:11Z 置信度 0.70
• Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability
  As transistor scaling approaches physical and economic limits, advanced packaging has become an important approach to continued system scaling. This review compares two-dimensional (2D), two- and-a-half-dimensional (2.5D), and three-dimensional (3D) integratio…
  crossref Yuxian Huang, Dingguan Wang, Qianyi Li, Zhiming Pan 2026-08-31T02:08:58Z 置信度 0.70
• A Review of Multimodal Vision-Electrical Defect Diagnosis in Advanced Packaging
  crossref Sichao Xie, Hanguang Su, Xinbo Hu, Xinpeng Wang 2026-07-07T19:42:08Z 置信度 0.70
• AuxiliarySRAM: Exploring Elastic On-Chip Memory in 2.5D Chiplet Systems Design
  crossref Zichao Ling, Lin Li, Yi Huang, Yixin Xuan 等 2025-06-27T13:58:23Z 置信度 0.70
• Enabling 20 Tb/s/mm Die-to-Die Bandwidth Density with Advanced Packaging Technologies
  crossref Zhiguo Qian, Kemal Aygün 2025-06-26T17:40:11Z 置信度 0.70
• Suppression of Connector Radiation Coupling to Antenna by Phase Cancellation
  crossref Chih-Yu Fang, Yung-Chih Hou, Tzong-Lin Wu 2026-03-03T20:50:33Z 置信度 0.70
• Prediction methodology of die shift for advanced panel level packaging
  ABSTRACT This study has been focused on die shift mechanism in die-first manufacture process, with a specific focus on the process-induced challenges associated with large area substrate size. The critical process parameters and package stacking geometry facto…
  crossref Chang-Chun Lee, Jui-Chang Chuang, Hao-Zhou Lin, Yan-Yu Liou 2025-11-13T13:06:30Z 置信度 0.70
• The Downside of Antimicrobial Packaging: Migration of Packaging Elements into Food
  crossref Cristina Nerin, Raquel Becerril, Filomena Silva 2025-02-28T19:59:36Z 置信度 0.70
• Electronic Interposer Platform for 2.5D Heterogeneous Integration of Photonics-Electronics Chiplet Systems
  We present an electronic interposer MPW platform with metal and redistribution layers to co-integrate photonics and electronic integrated circuits. Designers can mix and match verified electronic circuits with PICs to form scalable multi-chip module systems.
  crossref Nathan C. Lin, Colin McDonough, Robert Carroll, Seth Kruger 等 2025-09-18T16:55:04Z 置信度 0.70
• Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
  crossref 2025-11-14T11:33:30Z 置信度 0.70
• Food Packaging: Legislation and Regulatory Issues
  crossref Francesco Aversano 2025-02-28T20:01:14Z 置信度 0.70
• Packaging Material in the Food Industry
  crossref Valentina Siracusa 2025-02-28T15:00:15Z 置信度 0.70
• Analysis of Repair Structures for Chiplet Interfaces
  crossref Théo Bermond, Adrian Evans 2025-11-25T18:27:02Z 置信度 0.70
• LLM-Design Platform for Thermal-Failure-Aware 3D Chiplet Layout via Iterative Parameter Analysis
  crossref Tai Song, Senling Wang, Xiaoqing Wen 2026-04-23T19:57:38Z 置信度 0.70
• UCIe: Standard for an Open Chiplet Ecosystem
  crossref Peter Onufryk, Swadesh Choudhary 2024-09-06T17:49:38Z 置信度 0.70
• Optical Chiplet Structure Based on MCeP®
  We propose the optical chiplet structure based on the high-density packaging technology MCeP ® *. This design incorporates a reinforced structure that supports the fiber array, achieving both low optical coupling loss and high adhesive strength. *MCeP is regis…
  crossref Yuji Furuta, Masaki Matsumoto, Motoyuki Fukuhara, Tatsuaki Denda 等 2026-02-24T16:23:15Z 置信度 0.70
• Optical Pitch Transformer Chiplet for Glass Interposer: Concept and Feasibility Study
  crossref How Yuan Hwang, Xiuyun He, Peter O'Brien 2025-12-22T18:39:16Z 置信度 0.70
• Advanced Wireless Packaging and Optimization for High Power WBG Modules
  crossref Asif Emon, Samuel Defaz, Yang Li, Fang Luo 2025-03-05T18:42:00Z 置信度 0.70
• Revitalizing Advanced Packaging in America
  ABSTRACT The resurgence of advanced semiconductor packaging technologies in the United States is crucial for sustaining the nation's position as a global leader in technology. As demands for high-performance computing, artificial intelligence (AI), and energy-…
  crossref Pavanbabu Arjunamahanthi, Himanandhan Reddy Kottur, Navid Asadizanjani, Charles Woychik 2025-12-01T20:27:19Z 置信度 0.70
• Advanced Bio-Based Smart Materials for Food Packaging: Applications, Safety, and Sustainability
  The greatest issues facing humanity today are food security, safety, and waste management, as well as the pernicious impacts of environmental climate change [...]
  crossref Ioannis Konstantinos Karabagias 2025-10-10T13:47:08Z 置信度 0.70
• Advanced Packaging Technology and Design Methodology for Next Generation Chiplets
  crossref Hideki Sasaki 2025-03-04T14:32:21Z 置信度 0.70
• Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
  This paper presents a mechanical simulation of image sensor packages, with a particular emphasis on accurately modeling the cure shrinkage and viscoelasticity. Image sensors have a wide application in mobile phones, autonomous vehicles, and medical imaging. Th…
  crossref Ning Liu, Shahram Seyedmohammadi, Howard Yun, Matthew Tsai 2025-11-17T19:49:38Z 置信度 0.70
• Advanced Packaging-Compatible Vertical Microlenses and Mach-Zehnder Interferometer for Micro-Opto-Electro-Mechanical Systems
  crossref Guandong Liu, Wei Yu, Chen Hu, Dingding Qi 等 2025-09-17T17:29:31Z 置信度 0.70
• Warpage Management in Semiconductor Packaging
  crossref John Lau, Xuejun Fan 2025-05-18T06:02:21Z 置信度 0.70
• Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement
  crossref Poyu Tsai, Hsin-Han Lin, I-Cheng Huang, Hung-Hsien Huang 等 2026-03-03T20:50:33Z 置信度 0.70
• Pressure-Bonding of GaN-HEMT Die to Graphite Carbon for Heat Dissipation
  crossref Koji Aramaki, Akio Wakejima 2026-03-03T20:50:33Z 置信度 0.70
• AuthenTree: A Scalable MPC-Based Distributed Trust Architecture for Chiplet-Based Heterogeneous Systems
  crossref Ishraq Tashdid, Tasnuva Farheen, Sazadur Rahman 2026-01-06T18:33:50Z 置信度 0.70
• Correction to “Fatty Acid Cellulose Ester–Carboxymethyl Cellulose Blend Thermoplastics: Tailoring Thermal, Mechanical, and Water‐Soluble Properties for Eco‐Friendly Packaging”
  crossref 2025-12-17T14:14:15Z 置信度 0.70
• Advanced edible packaging systems for the seafood preservation: Innovative technologies for waste utilization and extended freshness
  crossref Kharadi Nehabahen Visharambhai 2025-01-25T08:03:51Z 置信度 0.70
• Sustainable Smart Packaging from Protein Nanofibrils (Adv. Mater. 22/2025)
  crossref Mohammad Peydayesh, Alan Kovacevic, Leah Hoffmann, Felix Donat 等 2025-06-05T05:42:57Z 置信度 0.70
• Editorial: Advanced electronic packaging materials: Constitutive model, simulation, design and reliability
  crossref Yutai Su 2025-10-17T05:29:49Z 置信度 0.70
• Material Property Simulation for Advanced Packaging
  Advanced packaging allows chiplet integration and maximizes device performance with faster product development cycle, lower cost, and higher yield. As the package size becomes bigger and the device is getting more complicated, there is growing motivation to em…
  crossref Yan Li, Seo Young Kim, Woopoung Kim, Mohammad Atif Faiz Afzal 等 2026-01-27T14:01:35Z 置信度 0.70
• Guided by Uncertainty: Adaptive Frequency Sampling Using Gaussian Processes
  crossref Thijs Ullrick, Yens Lindemans, Dirk Deschrijver, Tom Dhaene 2026-03-03T20:50:33Z 置信度 0.70
• NON-THERMAL PROCESSING AND PACKAGING REQUIREMENTS: RECENT TRENDS AND APPLICATIONS
  Improving food quality and shelf stability of all types of processed and raw foods before packing is motivated by the idea of safe food for customers. This has prompted specialists in food processing to research cutting-edge technologies that are new and diffe…
  crossref Kritanjal Goswami 2025-06-06T06:14:16Z 置信度 0.70
• Smart Automated Warehouse System for E-Commerce Order Packaging Model
  crossref Nainesh Nageshree 2026-03-14T08:45:33Z 置信度 0.70
• 3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review
  crossref Jean Charbonnier, Thierry Mourier, Stéphane Bernabé 2025-06-23T13:27:56Z 置信度 0.70
• Network-on-Interposer Co-Design for Heterogeneous Chiplet-Based Integrated Systems
  crossref Andres Ayes, Eby G. Friedman, Marilyn Wolf 2025-06-27T17:42:19Z 置信度 0.70
• Toughening and Performance Enhancement of Epoxy Acrylate-Based Solder Resist Using Polyurethane Acrylate for Advanced Packaging
  crossref Chuanyu Wu, Jie Liu, Xialei Lv, Jinhui Li 等 2025-09-17T17:29:31Z 置信度 0.70
• Design of a Digital-Analog Integrated Driver Amplifier Module Based on Chiplet Technology
  crossref Yang Gen, Liu Peng, Yan Shaomin 2025-10-14T17:38:09Z 置信度 0.70
• Application of Indium Sheet Thermal Interface Material in Advanced Semiconductor Packaging
  crossref Wen-Yu Teng, Leon Li, Debby Li, Terry Hou 等 2025-05-21T17:36:38Z 置信度 0.70
• Revolutionizing Wafer-Level Chip-Scale Packaging Advanced Die Chipping Solutions Using Laser Grooving and Plasma Dicing
  crossref Wentao Dou, JW Seah, VK Leong, Jingwei Sun 等 2025-09-17T17:29:31Z 置信度 0.70
• Electrical Insulation yet Electromagnetic Interference Shielding Epoxy Composite for Advanced Electronics packaging
  crossref Zeyu Zheng, Yang Liu, Hebin Zhang, Jialin Wen 等 2025-09-17T17:29:31Z 置信度 0.70
• A Chiplet-Based High-Performance and Secure Hybrid Interconnection Network Design Against DoS and Sniffing Attacks
  crossref Md Tareq Mahmud, Ke Wang 2025-04-25T17:38:19Z 置信度 0.70
• High Volume Manufacturing of Through Glass via (TGV) Wet Etch for Glass Core Substrates for High Density 3D Advanced Packaging Applications
  crossref Venugopal Govindarajulu, Coby Tao, Vengal Jalagam, Keshav Chandran 等 2025-05-21T17:36:38Z 置信度 0.70
• The Fake-Busy and True-Idle Problems of Running Graph Applications on Chiplet-Based Multi-Cores
  crossref Rashid Aligholipour, Yuan Yao 2025-11-20T18:39:36Z 置信度 0.70
• Extending EV Charger Lifetime by Advanced SiC Power MOSFET Packaging Technology
  crossref Kwok Wai Ma, Dinesh Palaniappan 2026-01-22T20:59:14Z 置信度 0.70
• Introduction
  crossref Generoso Branca 2025-11-03T10:27:36Z 置信度 0.70
• From Design to Inspection: Can Inspection-aware Design Enhance Reliability in Advanced Packaging?
  crossref Katayoon Yahyaei, M Shafkat M Khan, Navid Asadizanjani 2025-06-10T17:48:39Z 置信度 0.70
• Antistatic, Flame‐Retardant, and Mechanically Resistant Cellulose/Carbon Black Cryogels for Electrostatic Discharge Packaging (Adv. Sustainable Syst. 5/2025)
  crossref Gabriele Polezi, Diego M. Nascimento, Elisa S. Ferreira, Juliana S. Bernardes 2025-05-30T02:19:26Z 置信度 0.70
• Cracking, Delamination, and Fatigue in Electronics Packaging
  crossref John Lau, Xuejun Fan 2025-05-18T06:02:01Z 置信度 0.70
• Machine Learning-Enhanced Equivalent Circuit Modeling for Advanced Packaging Components
  crossref Tao Xu, Zhenhua Wu, Cheng Zhuo, Qi Sun 2025-06-03T17:42:31Z 置信度 0.70
• Comprehensive Characterization of Inkjet Printer Ag Film on Paper Substrate for Sensor Electrodes
  crossref Akanksha Arya, Sanjeev Kumar Manhas 2026-03-03T20:50:33Z 置信度 0.70
• Conclusions
  crossref Generoso Branca 2025-11-03T10:27:45Z 置信度 0.70
• Advanced polymer nanocomposites in packaging applications
  Abstract Polymer nanocomposites (PNCs) have emerged as advanced materials for several crucial applications such as packaging, electronics, pharmaceuticals, construction and transportation. This review work explores the integration of various dispersible nanost…
  crossref Varsha Srivastava, Sangeeta Garg, Amit D. Saran 2025-05-05T06:02:59Z 置信度 0.70
• Effect of Wiring Geometry Modification on Signal Integrity in Silicon-Interposer Interconnect
  crossref Yosei Kawamoto, Takeshi Ohkawa, Masahiro Aoyagi 2026-03-03T20:50:33Z 置信度 0.70
• X64 UCIe Chiplet Interconnection at 32 GT/s on a Silicon Core Substrate
  crossref Steven Verhaverbeke, Han-Wen Chen, Seann Ayers, Farhang Yazdani 2025-06-26T17:40:11Z 置信度 0.70
• Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
  Abstract Photonic integrated chip packaging is a promising technology for integrating optical components into devices, enabling high‐speed data transmission, wide bandwidth, low latency, and high energy efficiency. This technology is expected to overcome the l…
  crossref Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn 等 2025-06-25T23:39:28Z 置信度 0.70
• Heterogeneous Integration of High-Performance Compute, Memory and Optical Engine Chiplet on Large Reconstituted Interposer Package
  crossref Chai Tai Chong, Mihai Rotaru, BG Sajay, Ji Lin 等 2026-02-24T20:55:10Z 置信度 0.70
• Special Issue on Interconnects for Chiplet Integration Technologies
  crossref Debendra Das Sharma, Nam Sung Kim 2025-03-06T18:40:18Z 置信度 0.70
• CoWoS, Advanced Packaging Technologies Enabling the AI-Era
  crossref 2024-12-31T22:10:49Z 置信度 0.70
• Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
  As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated attacks such as tampering, counterfeiting, and supply chain infiltration. This paper…
  crossref Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, M. Shafkat M. Khan, Liton Kumar Biswas 等 2025-11-17T19:49:39Z 置信度 0.70
• Microscopic Insights into Strain and Failure Mechanisms in Advanced Semiconductor Packaging
  crossref Pawel Nowakowski, Richard Wei-Chih Li, Mary Ray, Paul Fischione 2025-07-25T14:11:39Z 置信度 0.70
• Advanced Photonics Packaging for Space and sub-THz Communication Systems
  crossref A. Serrano Rodrigo, M. Chiesa, D. Rotta 2025-08-25T20:14:24Z 置信度 0.70
• Advanced Dielectric Films for Fusion Bonded 3D Integration
  crossref Taisuke Yamamoto, Hayato Kitagawa, Ryosuke Sato, Ryota Ogata 等 2025-11-10T18:45:25Z 置信度 0.70
• Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced Packaging
  The continuous growth of cloud computing, big data analytics, and artificial intelligence has fueled the demand for high-performance and energy efficient server infrastructure. To address these needs, the semiconductor industry is actively exploring advanced p…
  crossref Kazuhiro Hirooka, Honoka Nakagawa, Mayu Tsukuda, Jun-ichi Katayama 等 2025-11-17T19:49:41Z 置信度 0.70
• Comprehensive Interface Adhesion Characterization for Advanced Semiconductor Packaging
  crossref Dong Jun Kim, Sun Woo Lee, Won Choi, Ho Jun Chang 等 2025-12-16T18:30:06Z 置信度 0.70
• Design and Measurement of Ultra-Wideband Bidirectional Absorptive Common Mode Filter
  crossref Akihiro Narushima, Hiroki Matsuura, Weiyu Zhou, Koji Wada 2026-03-03T20:50:33Z 置信度 0.70
• Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structures
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• Characterization of Oxidation-Controlled Cu for 3D-Chiplet Integration
  crossref Kenta Hayama, Yutetsu Kamiya, Kohei Nakayama, Fabiana Lie Tanaka 等 2025-07-16T17:36:44Z 置信度 0.70
• Feasibility and Reliability Considerations of Liquid Metal Alloys in Advanced Packaging
  crossref Wen-Yu Teng, Dai Fei Li, Jyun-De Jhan, Yung Ta Li 等 2026-06-10T19:59:01Z 置信度 0.70
• Development of Equivalent Material Properties of Substrate/Interposer-type Components for Advanced Packaging
  crossref Ya-Chi Chen, Yu-Ting Su, Kuo-Ning Chiang 2026-06-10T19:59:01Z 置信度 0.70
• Ultra-Thick Photoresist Patterning Enabling Higher Aspect Ratio Cu Posts for Advanced Packaging
  crossref Tatsuya Fujii, Issei Suzuki, Kazuki Hirano, Eiichi Hayashi 等 2026-06-10T19:59:01Z 置信度 0.70
• DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
  Spiking Neural Networks (SNNs) implemented on in-memory computing (IMC) based architectures offer a promising solution for energy-efficient inference. However, the area and memory required to store temporal neuronal state membrane potentials updated by leaky-i…
  crossref Pramit Kumar Pal, Harsh Sharma, Abhishek Moitra, Partha Pratim Pande 2026-01-26T20:20:47Z 置信度 0.70
• Solution of High Aspect Ratio TSV PVD in Advanced Packaging
  crossref Tongwen Zhang, Lucinda Wang 2026-06-02T20:03:17Z 置信度 0.70
• Effects of Redundancy and Current Nonuniformity on Multi-Ball Electromigration in Advanced Packaging
  crossref Howard Gan, Jeffrey Zhang 2026-05-07T19:51:08Z 置信度 0.70
• Thermal Challenges and the Future of Thermal Management in 3D Advanced Packaging Technologies
  crossref 2026-05-26T19:39:43Z 置信度 0.70
• Advanced semiconductor packaging design via artificial intelligence and machine learning: A review
  crossref M. Rafiee, P. Saini 2026-04-21T10:40:14Z 置信度 0.70
• Biopolymers, Bioplastics, and Carbon-Based Materials for Food Packaging
  crossref Bhagyalakhi Baruah 2026-04-01T14:21:37Z 置信度 0.70
• A Review on Biobased Barrier Coating and Its Challenges for Sustainable Paper Packaging
  ABSTRACT Barrier coatings are an essential advancement for enhancing the performance of paper‐based packaging. Unlike plastics, paper possesses inherent weaknesses such as high porosity, poor moisture and gas resistance, low thermal stability and a lack of hea…
  crossref Kundan Kumar Singh, Devendra Kumar 2026-04-04T04:41:55Z 置信度 0.70
• One-Wire Architecture for Chiplet Reuse and Integration in Low-Dimensional Systems
  crossref Anil Kumar Gundu, Neelkamal Semwal, Massimo Alioto 2026-05-15T02:52:39Z 置信度 0.70
• Non-Intrusive THz Chiplet Calibration Using Deep Neural Networks
  crossref Amirata Tabatabavakili, Mohammed Ayman Habib, Osei Brempong, Morteza Fayazi 等 2026-06-18T20:06:49Z 置信度 0.70
• Integrated Framework for Multi-Die Semiconductor Interconnect Systems: Hierarchical Signal Management Methodology and Coordinated Tessellation Architecture for Heterogeneous Chiplet Integration
  The progressive scaling limitations of monolithic semiconductor dies have driven the semiconductor industry toward heterogeneous multi-die integration, wherein multiple specialised chiplets are co-packaged on a shared substrate.[1,2] This work presents two com…
  crossref Manan Limbad 2026-03-11T13:25:34Z 置信度 0.70
• Investigation of Laser Debonding Using a 308 nm Excimer Laser for Advanced Semiconductor Packaging
  crossref 2026-08-29T05:54:11Z 置信度 0.70
• CHARM: Chiplet Heterogeneity-Aware Runtime Mapping System
  crossref Alessandro Fogli, Bo Zhao, Peter Pietzuch, Jana Giceva 2026-04-24T20:20:04Z 置信度 0.70