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• Sustainable Synthesis of Biodegradable Polymer Nanocomposites for Advanced Packaging Applications
  The growing environmental concerns associated with conventional petroleum-based plastics have accelerated the search for sustainable alternatives for packaging applications. Biodegradable polymer nanocomposites have emerged as promising materials due to their …
  crossref Amit Thakur 2026-06-18T17:32:15Z 置信度 0.70
• Advances and challenges in Copper–Copper bonding for 3D packaging interconnects
  crossref Yueting Zheng, Hao Cui, Anyang Yu 2026-03-27T08:34:15Z 置信度 0.70
• Scalable Security Monitoring on Chiplet-Based Systems
  crossref Pooya Aghanoury, Sneha Swaroopa, Dao Xian Ding, Farshad Firouzi 等 2026-05-28T22:26:58Z 置信度 0.70
• Design of a Central IO Chiplet Architecture Based on Chiplet Interconnect Protocol
  crossref Yujie Yang, Jinghe Wei, Guozhu Liu, Jian He 等 2026-06-22T19:52:40Z 置信度 0.70
• ShieldLink: Retry-Aware Authenticated Encryption for Secure and Reliable Chiplet Interconnects
  Chiplet-based systems-in-package increasingly rely on highspeed die-to-die links such as UCIe and CXL, where linklayer retry mechanisms and authenticated encryption are often implemented as separate reliability and security functions. This separation can creat…
  crossref Michél Nguyen 2026-07-23T05:08:09Z 置信度 0.70
• Advanced Packaging Solutions for Quality Maintenance
  crossref Abhishek R. Ranvare, Avinash Singh, Ganesh D. Khule 2026-04-14T16:47:21Z 置信度 0.70
• AttestaChain: A Chiplet-aware attestation system based on Blockchain and Zero-Trust Architecture
  crossref Abdellah Kaci, Sylvain Guilley 2026-02-04T20:45:15Z 置信度 0.70
• Advanced Hybrid Smear Removal Process with Excimer VUV Treatment for Next-Generation Organic Substrate Packaging
  crossref T. Arimoto, Y. Baba, Y. Kitahara, T. Sawada 等 2026-06-10T19:59:01Z 置信度 0.70
• Interconnect Reliability for High-Performance Semiconductor Packages and Devices
  crossref Tae-Kyu Lee 2026-08-25T19:17:23Z 置信度 0.70
• Chiplet-Escape: An Efficient Obstacle-Avoiding Escape Routing Method for Die-to-Die Interconnections in Chiplet-Based Designs
  Chiplet-based designs, also known as multi-die systems, have introduced a new paradigm that enables significant integration and performance enhancement. Interconnections between different dies are crucial to the success of such designs, where escape routing is…
  crossref Weiqing Ji, Mingyang Kou, Zhiyang Chen, Jianwang Zhai 等 2026-07-02T21:14:57Z 置信度 0.70
• Biodegradable Polymer Films Reinforced With Short Fibers for Sustainable UV Protection in Food Packaging Applications
  ABSTRACT Short‐fiber‐reinforced biodegradable polymer films offer a promising pathway toward sustainable materials combining mechanical robustness with added functionality. Here, we present agar‐based composite films reinforced with biodegradable short electro…
  crossref Daniel P. Ura, Urszula Stachewicz 2026-06-03T14:33:41Z 置信度 0.70
• Parallel Test Strategy for Chiplet Testing for HPC/AI Devices - Leveraging Smartest 8 Interleaved Testflow Solution
  crossref Zhang Jun, Vince Li 2026-06-02T20:03:17Z 置信度 0.70
• Sustainable packaging solutions for fresh horticultural produce
  crossref Swathi BS 2026-07-30T13:36:27Z 置信度 0.70
• StressScore: Evaluating AI Predicted Stress Contours in Advanced Packaging With Contrastive Learning
  crossref Kart Leong Lim, Thanmaya Bharadwaj Puvvada 2026-06-17T19:37:15Z 置信度 0.70
• Thermally Conductive Polymeric Adhesives for Electronic Packaging: Fundamentals, Material Design and Reliability Challenges
  ABSTRACT The rapid development of electronic packages and the increasing power density of modern devices have led to the necessity of major development of thermal control. With the continued reduction in size coupled with increasing performance of the electron…
  crossref Gullola Bhagyalaxmi, N. Selvaraj, P. S. C. Bose 2026-08-03T06:05:37Z 置信度 0.70
• AI-Accelerated Atomistic Modeling of Hybrid Bonding Interfaces for Advanced CMOS and 3D Packaging
  Hybrid bonding that combines direct Cu-Cu contact with dielectric-dielectric adhesion is rapidly becoming a key enabler of fine-pitch 3D integration beyond micro-bumps. Despite its promise, reliability remains limited by nanoscale interfacial defects such as r…
  crossref Hyuna Kwon 2026-07-16T07:36:10Z 置信度 0.70
• The practice of applying advanced work packaging in residential construction
  crossref Marina Petrochenko, Maksim Grishin, Viktoriya Kolpakova, Evgeniia Zavodnova 等 2026-05-27T17:00:21Z 置信度 0.70
• Automotive Reliability of Micro–Cu Pillar Bumps for 2.5D Chiplet Integration
  crossref Koichi Ando, Yoshiaki Yamada, Hideaki Tsuchiya, Hiroki Shibuya 2026-06-17T19:37:15Z 置信度 0.70
• Fast and Accurate Jitter Amplification Modeling With Variable Pulse Width Response for Statistical BER Analysis in Chiplet Interconnects and Beyond
  In this paper, we investigate Statistical Bit Error Rate (BER) analysis for low-loss short-reach chiplet interface and high-loss long-reach serial interface. We used jitter filtering to account for the residue jitter not tracked by a forwarded clock system and…
  crossref Shenggao Li, Maher Amer 2026-01-07T02:36:35Z 置信度 0.70
• Assessment of Security Risks and Defenses in Chiplet Systems
  crossref Hasin Ishraq Reefat, Hossein Pourmehrani, Junie Um, Sylvain Guilley 等 2026-06-18T20:06:49Z 置信度 0.70
• Evaluating Heterogeneous Computing Efficiency: CPU vs GPU in a Chiplet-Based Model
  crossref Giri Chandu Gompa, Gurram Revanth, Rajesh Kannan Megalingam 2026-07-06T19:42:32Z 置信度 0.70
• Enabling Affordable Chip Design with Open Chiplet Atlas ^TM Ecosystem
  crossref Zhimin Chen, Wei-Han Lien 2026-05-26T19:39:43Z 置信度 0.70
• A Unified Intelligent Optimization and Precision Control Framework for Personalized Packaging Manufacturing via Advanced 3D Printing Technologies
  crossref Zhenhai Song 2026-05-12T19:46:53Z 置信度 0.70
• TSIM4ICS: Trace-Driven SystemC-TLM Simulation Framework for I/O Die-Based Multi-Chiplet Systems
  crossref Youngchul Yoon, Soonhoi Ha 2026-06-04T19:53:10Z 置信度 0.70
• Visual System Design of Textile Packaging Guided by Sustainability
  With the rapid development of intelligent manufacturing and digital information technologies, sustainable packaging design has become increasingly important for improving resource efficiency and enhancing visual communication in modern textile systems. Advance…
  crossref R. J. Chen, Y. C. Ma 2026-08-13T08:20:14Z 置信度 0.70
• An Introduction to the Universal Chiplet Interconnect Express® (UCIe®)
  The Universal Chiplet Interconnect Express (UCIe) is an open industry standard designed to enable seamless interconnection of chiplets through planar and vertical connectivity on-package. With UCIe, a system designer can construct a system-in-package (SiP) by …
  crossref Debendra Das Sharma 2026-05-29T10:27:54Z 置信度 0.70
• A Scalable Stress Recovery Technique for Hybrid Bonding in Chiplet-Based Systems
  crossref Yin-Da Wang, Qiwei Zhan, Hao-Xuan Zhang, Yu Zhu 等 2026-08-14T19:28:56Z 置信度 0.70
• Advanced packaging, containers, and closure systems for complex ophthalmic products
  crossref Rashmi Maurya, Akash Vikal, Preeti Patel, Nitin Singh 等 2025-11-08T11:13:09Z 置信度 0.70
• Challenges and Mitigations of Microbumps Pitch Scaling for Chiplet Applications
  crossref Jaber Derakhshandeh, Eric Beyne, Tom Cochet, Vladimir Cherman 等 2025-11-04T18:36:37Z 置信度 0.70
• Testing of Chiplet-Based Packages Based on Advanced Heterogeneous Integration
  crossref Partho Bhoumik, Dhruv Thapar, Christopher Bailey, Krishnendu Chakrabarty 2026-06-23T19:46:06Z 置信度 0.70
• Advanced Photonic Debonding Using Solution-Processed Ag Nanoparticle/Cu-Precursor Hybrid Light-Absorbing Layers for Wafer-Level Packaging
  crossref Soomin Song 2026-07-30T19:07:12Z 置信度 0.70
• A hybrid greedy strategy for feature selection and classification in chiplet library construction
  The rapid expansion of radio frequency (RF) chiplets for heterogeneous integration currently faces a significant challenge: the automated construction of standardized, reusable component libraries. Unlike digital modules, RF chiplets are defined by a high-dime…
  crossref Guangbao Shan, Baoping Meng, Guoliang Li, Wenbin Wei 等 2026-02-13T14:37:29Z 置信度 0.70
• Die-Shift of Sub-20 μm Thickness Embedded Chiplet in Glass-Core Package Redistribution Layers
  crossref Hyunggyu Park, Jaewon Lee, Muhannad S. Bakir 2026-06-17T19:37:15Z 置信度 0.70
• Design Space Exploration of Chiplet and Interposer PDNs for 2.5D AI Systems
  crossref Seungmin Woo, Taehoon Kim, Madison Manley, Muhannad S. Bakir 2026-06-17T19:37:15Z 置信度 0.70
• Power Integrity in 3-D Chiplet Systems with Intermediate Layers
  crossref Andres Ayes, Eby G. Friedman 2026-07-09T19:41:48Z 置信度 0.70
• Integrating AI with Design-on-Simulation for Advanced Packaging
  crossref John Lau, Kuo-Ning Chiang 2026-05-31T18:46:31Z 置信度 0.70
• Spine 2026 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
  crossref 2026-06-23T19:43:34Z 置信度 0.70
• Advanced Electronic Packaging Fundamentals, Materials and Processing
  This book offers a comprehensive insight into electronic packaging development through Advanced Electronic Packaging: Fundamentals, Materials and Processing. It covers essential principles, materials, processing techniques, as well as current trends and future…
  crossref Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Nur Izzati Muhammad Nadzri, Norainiza Saud 等 2026-04-01T07:05:26Z 置信度 0.70
• Topology-Driven Organic Interposer Design for RDL Layer Reduction in Automotive UCIe-A 2.5D Chiplet Packages
  crossref Shuuichi Kariyazaki, Hiroki Shibuya, Tatsuaki Tsukuda 2026-06-17T19:37:15Z 置信度 0.70
• On-product overlay for advanced packaging
  crossref Chi-Ming Tsai, Tom Laidig, Jang Fung Chen 2026-04-09T22:03:03Z 置信度 0.70
• Adhesives and Sealants in Packaging: Advanced Materials, Performance, and Emerging Technologies (Part II)
  This second part extends the system-level framework established in Part I by examining advanced adhesive and sealant technologies through a performance-, circularity-, and application-oriented perspective relevant to contemporary packaging systems. While Part …
  crossref Calogero Volpe, Leonardo Pagnotta 2026-08-04T15:08:09Z 置信度 0.70
• Effects of Open-Time and Jetting Pressure towards the Dispensed Adhesive Weight for Advanced Semiconductor Packaging
  Abstract The security of electronic devices and in making production as efficient as possible, advanced semiconductor packaging needs accurate and consistent glue dispensing. This study explores how open-time (0.2–3.0 ms) and jetting pressure (0.10–0.25 MPa) a…
  crossref Aiman Syukri Shamsuddin, Mohd Nazri Abd Rahman 2026-06-29T07:31:59Z 置信度 0.70
• Comparing Electronic-Photonic Interconnects for Large Scale Advanced Packaging Systems
  crossref Boan Fang, Martin J. Booth, Patrick S. Salter, Dominic O'Brien 2026-08-25T19:12:20Z 置信度 0.70
• Exploring Information-Freshness v. Task-Latency Tradeoffs for Schedulers in Chiplet-based Hardware
  crossref Ege Dogan, Ali Suvizi, Egemen Erbayat, Suresh Subramaniam 等 2026-07-31T18:14:35Z 置信度 0.70
• ACES: A Chiplet Architecture with Resource Partition and Dynamic Scheduling for Agentic LLMs
  crossref Hongou Li, Mingxuan Li, Zhantong Zhu, Tianyu Jia 2026-06-04T19:53:10Z 置信度 0.70
• Packaging materials
  crossref Mohammad Tarahi, Sara Hedayati 2026-03-07T07:24:48Z 置信度 0.70
• ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
  crossref Kangbo Bai, Zhantong Zhu, Yifan Ding, Tianyu Jia 2026-06-04T19:53:10Z 置信度 0.70
• Hardware Architecture of a Universal Interconnection Chiplet
  crossref Hao Wang, Fan Zhang, Jiang Qian, Yikang Shi 等 2026-08-13T19:10:32Z 置信度 0.70
• Self-Powered Temperature Sensor Integrated with IC Transparent Packaging for Organ-on-Chip
  In this study, we present an innovative approach to developing a self-powered complementary metal-oxide semiconductor (CMOS) temperature sensor integrated with transparent packaging, specifically designed organ-on-chip (OoC). The proposed system integrates a C…
  crossref Aya Yasser, Sameh O. Abdellatif 2026-05-19T06:52:01Z 置信度 0.70
• Antimicrobial/Antioxidant agents in active food packaging
  crossref Nur Alim Bahmid 2026-05-08T08:51:15Z 置信度 0.70
• Reconfigurable and Robust Multi-Chiplet Photonic Interposer Architectures for AI Scale-Up
  crossref Mahdi Nikdast 2026-08-25T19:14:49Z 置信度 0.70
• Chiplet Interconnect Repair for Clustered Defects with Minimal Propagation Delay
  crossref Po-Yao Chuang, Erik Jan Marinissen 2026-04-23T19:57:38Z 置信度 0.70
• Biomanufacturing of early platform chemicals from industrial processing food waste using mono- and co-culture electrofermentation
  crossref Beenish Saba, Stephen A. Akinola, Ann D. Christy, Thaddeus Ezeji 等 2025-06-24T02:51:09Z 置信度 0.70
• YAP: Yield Modeling and Simulation for Advanced Packaging
  crossref Zhichao Chen, Puneet Gupta 2025-09-15T17:35:41Z 置信度 0.70
• Tool-Agnostic Pulse Reverse Electroplating for High Aspect Ratio Through Glass Vias in Advanced Packaging
  crossref Dennis Fiedler, Grigory Vazhenin, Holger Schulz, Henning Hübner 等 2025-12-16T18:30:06Z 置信度 0.70
• UV-Assisted Fluxless Bonding for Advanced Packaging: Interfacial Mechanisms and Reliability Assessment
  crossref You-Gwon Kim, Dong-Hoon Yoo, Hyeong-Bin Park, Jong-Whi Park 等 2026-02-24T20:55:10Z 置信度 0.70
• Detachable fiber connectivity solution for co-packaged optics and advanced semiconductor packaging integration (Conference Presentation)
  crossref Avi Israel, Hesham Taha, Elad Schleifer, Guy Livnat 等 2025-03-21T16:42:53Z 置信度 0.70
• A Novel Large-Area Photoresist Removal Process for Multi-wafer in Advanced Packaging by Surface Wave Plasma
  crossref Jian-Wei Xian, Hai-Ping Li, Hui-Qian Zhou, Xiao Ma 等 2025-09-17T17:29:31Z 置信度 0.70
• EFFECTIVENESS OF DANGEROUS GOODS PACKAGING IN AIR TRANSPORTATION
  crossref 2025-05-10T10:32:33Z 置信度 0.70
• Comprehensive Die Strengths Comparisions for Glass-Core Advanced Packaging Substrates using Different Singulation Methods - Dicing-Induced SeWaRe Failures Revisited Ten Years Later-
  crossref Frank Wei, Andrew Frederick 2025-06-26T17:40:11Z 置信度 0.70
• A Methodology for Modeling Capillary Underfill (CUF) in Advanced Packaging
  crossref Dariush Ghaffari Tari, Arsia Khanfekr, Rong Zhang, Jeffrey Grover 等 2025-11-10T18:45:25Z 置信度 0.70
• Research on Novel Laser Bonding Process for Advanced Packaging
  crossref Zeyu Fan, Ping He, Chenghao Ma, Fangcheng Wang 等 2025-09-17T17:29:31Z 置信度 0.70
• Novel UV-USP Laser Grooving and Plasma Dicing Separation Schemes for Next Generation Advanced Packaging
  crossref Rogier Evertsen, Simon Dawson, Peter Keukens, Roland Mumford 等 2026-02-24T20:55:10Z 置信度 0.70
• Reliability Challenges on Electromigration in Advanced Packaging
  crossref 2024-12-31T22:10:46Z 置信度 0.70
• Evolutions of Solder Materials for Memory Packaging in Handheld, Automotive and Cryogenic Applications
  crossref Chong Leong Gan, Chen Yu Huang 2025-07-21T02:30:37Z 置信度 0.70
• Test Selection and Scheduling for 3D-Stacked Chiplet-Based Designs
  crossref C.P. Ravikumar, Shiva Shankar B 2025-09-02T17:30:04Z 置信度 0.70
• Server Chiplet Networking
  crossref Seunghyun An, Joontaek Oh, Ming Liu 2025-11-17T12:02:48Z 置信度 0.70
• Enhancing X-Ray Inspection in Advanced Packaging
  ABSTRACT We are currently witnessing a surge in demand for next-generation semiconductor devices driven by the AI revolution, electrification, and automation across various industries [1]. These devices are expected to not only operate at higher speeds but als…
  crossref Chris Nicholson, Anthony Williams, Bernhard Schläppi 2026-02-10T13:50:55Z 置信度 0.70
• Bionanocomposites and Their Potential Applications in Agriculture, Food Processing, and Food Packaging
  crossref Ahmed Fathy Mostafa Ghanem 2025-10-13T16:59:01Z 置信度 0.70
• A Task Allocation Method for Chiplet-Based CNN Accelerators
  crossref Congfeng Lv, Fen Ge, Fang Zhou 2025-08-11T17:40:44Z 置信度 0.70
• Warpage evolution of TSV wafer based on a hierarchy multiscale analysis method
  crossref 2025-06-05T05:32:46Z 置信度 0.70
• A Multimodal Foundation Model Framework for Globally-Coupled Core-Native Cloud Computing Networks and Chiplet Architecture Co-Design
  Abstract The convergence of cloud-native computing, chiplet-based architectures, and multimodal foundation models presents a transformative opportunity to reimagine global-scale AI infrastructure. However, existing frameworks fail to jointly optimize across ne…
  crossref shuo sheng 2025-09-26T11:36:43Z 置信度 0.70
• Research on the Application of Advanced Packaging Technology in Parasitic Inductance Optimization
  crossref Junyan Wu 2026-02-18T21:14:48Z 置信度 0.70
• Advanced VCSEL Integration and Assembly Technologies
  crossref Luke A. Graham, James K. Guenter, Pritha Khurana, Jim A. Tatum 2025-07-18T17:42:42Z 置信度 0.70
• Multiphysics-Informed ML-Assisted Chiplet Floorplanning for Heterogeneous Integration
  crossref Vinicius C. Do Nascimento, Seunghyun Hwang, Michael Joseph Smith, Tejas Kulkarni 等 2025-03-24T14:32:21Z 置信度 0.70
• AI-Driven Non-Destructive Characterization for Advanced Packaging: Challenges, Frameworks, and Opportunities
  The scaling limits of CMOS technology and the rise of heterogeneous integration have intensified the demand for advanced packaging architectures. While these approaches enable unprecedented improvements in performance, energy efficiency, and system reliability…
  crossref Patrick Craig, Navid Asadi 2025-11-12T18:31:10Z 置信度 0.70
• Uncertainty Quantification Using Riemannian Tensor Train Completion for Polynomial Chaos
  crossref Ziyuan Wang, Roni Khazaka 2026-03-03T20:50:33Z 置信度 0.70
• Security Architecture for Heterogeneous Chiplet-Based Mobile SoC
  crossref Eunsung Lee, Keunyoung Park, Jaeyong Lee, Dong Jin Park 2025-03-27T02:16:58Z 置信度 0.70
• Correction to “Bio‐Based Strategies for Sustainable Packaging: Incorporation of Babassu Mesocarp Flour Into Poly(Lactic Acid) Films”
  crossref 2025-09-24T06:41:07Z 置信度 0.70
• Accurate Early-Stage On-Chip Decap Allocation and PDN Planning in Advanced Packaging Using Scenario-Driven Current Profiling
  crossref Kin Fei Yong, Eng Liang Tay, Chor Kiat Yu, Wei Khoon Teng 2025-12-16T18:30:06Z 置信度 0.70
• A Test Vector Retargeting Circuit for Chiplet Stacking Structure
  crossref Haofei Hong, Xiaoting Liu, Dapeng Yan, Zhikuang Cai 2025-08-12T17:51:40Z 置信度 0.70
• Key Technologies and Design Aspects for Advanced Focos Packaging
  crossref Cheng-Hsin Liu, Yi-Sheng Lin, Yu-Jen Chang, Chen-Chao Wang 等 2025-11-10T18:45:25Z 置信度 0.70
• Ni-Fe Alloy Filling of Through Glass via for Thermally Reliable Advanced Packaging
  crossref Fan Yang, Jinhyun Lee, Sanghwa Yoon, Bongyoung Yoo 2026-02-24T20:55:10Z 置信度 0.70
• Advanced optoelectronics and 3D advanced packaging for next-generation AI hardware
  crossref Volker J. Sorger 2025-09-17T20:48:18Z 置信度 0.70
• Investigation from the Lithography of the Possible of Forming Less Than 8 μm Pitch Required for Advanced Packaging
  crossref Yu Abe, Naoya Sohara, Ryotaro Takahashi, Toshimitsu Arai 等 2025-05-21T13:36:38Z 置信度 0.70
• Chiplet-Based RISC-V SoC with Modular AI Acceleration
  crossref Suhas Suresh Bharadwaj, Prerana Ramkumar 2026-03-03T20:50:45Z 置信度 0.70
• Simulation and Validation of Warpage in Ultrathin Embedded-Die Substrates for Advanced Packaging
  crossref Rui Ma, Jingyi Zhao, Zhongyao Yu, Fang Yang 等 2026-02-24T20:55:10Z 置信度 0.70
• Real-Time 3D Thermal Mapping for Advanced Packaging via Machine Learning
  crossref Zhiping Xu, Chunyuan Yang, Shijun Wang, Xiang Gao 等 2025-11-07T20:43:37Z 置信度 0.70
• Virtual Reality, Real Intentions
  crossref Generoso Branca 2025-11-03T10:27:36Z 置信度 0.70
• Chiplet Package for Automotive and Edge Processors
  crossref Trent Uehling, Eli Tiffin, Stan Cejka, Nikhita Baladari 等 2025-06-26T17:40:11Z 置信度 0.70
• Logistic aspects of the planning of packaging
  The most dynamically developing service of our time is freight transport. Millions of small and large packages are delivered every day in different parts of the world, and we can send goods, packages and consignments from practically anywhere to anywhere. As t…
  crossref Péter Telek 2026-01-14T09:16:13Z 置信度 0.70
• Smart Packaging Optimization Using Digital Twins and Industrial 5.0 With Human Robot Interaction
  Abstract This study uses Siemens Tecnomatix Process Simulate to optimize a robotic packaging line with human–robot collaboration aligned to Industry 5.0. The project modeled three configurations: human-only, robot-only, and hybrid human–robot systems. Each set…
  crossref Kay R. Morgan, David A. Guerra-Zubiaga, Gershom Richards 2026-02-23T16:19:47Z 置信度 0.70
• Electronic Materials Innovations and Reliability in Advanced Memory Packaging
  crossref Chong Leong Gan, Chen Yu Huang 2025-07-21T02:29:14Z 置信度 0.70
• UCIe Meets mmWave: Scalable, Latency-Aware and Energy-Efficient Hybrid Chiplet Integration
  crossref Sameena Khan, Sujay Deb 2025-11-17T18:39:03Z 置信度 0.70
• Introduction to Microelectronics Advanced Packaging Assurance
  crossref Navid Asadizanjani, Himanandhan Reddy Kottur, Hamed Dalir 2025-04-22T09:58:03Z 置信度 0.70
• Forum 1: Unlocking Innovation: Circuit Techniques and New Approaches for Die-to-Die Links and the Chiplet Ecosystem
  crossref 2025-03-06T18:33:12Z 置信度 0.70
• Fine-Grained Layer Scheduling and Mapping for Chiplet-Based LLM Inference
  crossref Hongyang Gu, Lei Xu, Haochen Zhao, Naifeng Jing 2026-01-19T20:51:17Z 置信度 0.70
• On the mechanic reliability of structured glasses as substrates in advanced packaging applications
  crossref Guangjun Zhang, Martin Letz, Volker Seibert, Fabian Wagner 等 2025-09-17T17:29:31Z 置信度 0.70
• Packaging Design, Sustainability and the Consumer Perspective
  crossref Generoso Branca 2025-11-03T10:27:44Z 置信度 0.70
• Invited: Streamlining and Automating Routing of Multi-Chiplet Technologies
  crossref Ksenia Roze 2025-03-13T18:22:31Z 置信度 0.70