主题图谱 / hardware architecture

hardware architecture

GeneTech 知识引擎共收录 122 篇相关科研实体，横跨 14 个垂直领域。数据来自 OpenAlex、arXiv、Crossref、PubMed、Europe PMC 等公开学术源，全部可溯源到原文。

年度产出趋势

代表性文献（按质量分排序，前 60 条）

• Aethon: A Reference-Based Replication Primitive for Constant-Time Instantiation of Stateful AI Agents
  2026 · AI Agent 生态 · The transition from stateless model inference to stateful agentic execution is reshaping the systems assumptions underlying modern AI infrastructure. While large language models have made persistent, tool-using, and coll…
• Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception
  2024 · 半导体与先进封装 · We study the application of emerging chiplet-based Neural Processing Units to accelerate vehicular AI perception workloads in constrained automotive settings. The motivation stems from how chiplets technology is becoming…
• Leveraging Residue Number System for Designing High-Precision Analog Deep Neural Network Accelerators
  2023 · 智慧农业 · Achieving high accuracy, while maintaining good energy efficiency, in analog DNN accelerators is challenging as high-precision data converters are expensive. In this paper, we overcome this challenge by using the residue…
• Approximate Computing Survey, Part II: Application-Specific & Architectural Approximation Techniques and Applications
  2023 · 生物计算 · The challenging deployment of compute-intensive applications from domains such as Artificial Intelligence (AI) and Digital Signal Processing (DSP), forces the community of computing systems to explore new design approach…
• Architectural Implications of Agentic AI Workflows
  2026 · AI Agent 生态 · Agentic AI is emerging in datacenters, but its architectural implications remain unexplored. We organize agentic workflows in a taxonomy and present its first architectural characterization with a production study at Mic…
• SPARQLe: Sub-Precision Activation Representation for Quantized LLM Inference
  2026 · 智慧农业 · The rapid growth in sizes of Large language models (LLMs) results in high compute and memory costs during inference. Quantization has been a significant pathway to addressing this challenge. In the quest to push the limi…
• Report for NSF Workshop on AI for Electronic Design Automation
  2026 · AI 安全与对齐 · This report distills the discussions and recommendations from the NSF Workshop on AI for Electronic Design Automation (EDA), held on December 10, 2024 in Vancouver alongside NeurIPS 2024. Bringing together experts across…
• The xPU-athalon: Quantifying the Competition of AI Acceleration
  2026 · AI 安全与对齐 · The push for greater efficiency in AI computation has given rise to an array of accelerator architectures that increasingly challenge the GPU's long-standing dominance. In this work, we provide a quantitative view of thi…
• CREATE: Cross-Layer Resilience Characterization and Optimization for Efficient yet Reliable Embodied AI Systems
  2026 · AI 安全与对齐 · Embodied Artificial Intelligence (AI) has recently attracted significant attention as it bridges AI with the physical world. Modern embodied AI systems often combine a Large Language Model (LLM)-based planner for high-le…
• Efficient, VRAM-Constrained xLM Inference on Clients
  2026 · AI 安全与对齐 · To usher in the next round of client AI innovation, there is an urgent need to enable efficient, lossless inference of high-accuracy large language models (LLMs) and vision language models (VLMs), jointly referred to as …
• SwarmIO: Towards 100 Million IOPS SSD Emulation for Next-generation GPU-centric Storage Systems
  2026 · 碳中和与 CCUS · GPU-initiated I/O has emerged as a key mechanism for achieving high-throughput storage access by leveraging massive GPU thread-level parallelism, while recent industry trends point toward SSDs optimized for ultra-high ra…
• AtomFlow: An End-to-End FPGA-Based Control Architecture for Neutral Atom Quantum Computers
  2026 · 量子计算 · Neutral Atom Quantum Computing (NAQC) is an emerging modality for scalable quantum computation, valued for its long coherence times and the naturally identical atomic qubits. However, one of the main drawbacks is its slo…
• Vectorizing Quantum Control: A RISC-V Vector Extension Architecture for Scalable Qubit Systems
  2026 · 量子材料 · The Quantum Control Processor (QCP) bridges the gap between compiler toolchains and control electronics, and is responsible for translating compiled quantum circuits into executable instructions that directly manipulate …
• Hardware Design and Security in the Era of Chiplets and LLMs
  2026 · 半导体与先进封装 · The semiconductor industry is undergoing a dual revolution: the shift toward heterogeneous 2.5D chiplet systems and the integration of Large Language Models (LLMs) into Electronic Design Automation (EDA) flows. While the…
• DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation
  2026 · 半导体与先进封装 · Scaling monolithic multicores is increasingly constrained by power/thermal limits, yield, and rising manufacturing and testing costs. Chiplet designs address these challenges by partitioning large dies into smaller parts…
• ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
  2026 · 半导体与先进封装 · In large-scale distributed LLM training, communication between devices becomes the key performance bottleneck. Chiplet technology can integrate multiple dies into a package to scale-up node performance with higher bandwi…
• Link Quality Aware Pathfinding for Chiplet Interconnects
  2026 · 半导体与先进封装 · As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate…
• Making Locality-aware GEMM Compatible with Page-Granularity Placement on Chiplet GPUs
  2026 · 半导体与先进封装 · Multi-chiplet GPUs scale compute throughput and high-bandwidth memory (HBM) capacity, but their non-uniform memory system makes locality between chiplets and their data critical to the GPU's performance and energy effici…
• Mozart: Modularized and Efficient MoE Training on 3.5D Wafer-Scale Chiplet Architectures
  2026 · 半导体与先进封装 · Mixture-of-Experts (MoE) architecture offers enhanced efficiency for Large Language Models (LLMs) with modularized computation, yet its inherent sparsity poses significant hardware deployment challenges, including memory…
• CarbonPATH: Carbon-aware pathfinding and architecture optimization for chiplet-based AI systems
  2026 · 半导体与先进封装 · The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry trans…
• 2.5D Root of Trust: Securing the Chiplet Ecosystem
  2026 · 半导体与先进封装 · The semiconductor industry is rapidly transitioning from monolithic systems-on-chip toward heterogeneous, multi-vendor 2.5D chiplet ecosystems integrated via silicon interposers. While this paradigm shift offers immense …
• Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging
  2026 · 半导体与先进封装 · As hardware security threats escalate across semiconductor manufacturing and advanced packaging, there is a growing need for novel physical mechanisms to counter sophisticated attacks such as tampering, counterfeiting, a…
• CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems
  2026 · 半导体与先进封装 · The rapid growth of large language models (LLMs) and AI workloads has pushed monolithic silicon to its reticle and economic limits, accelerating the adoption of 2.5D/3D chiplet systems. However, these systems increase de…
• ThermoDSE: A Thermal-Aware and Comprehensive Design Space Exploration for Chiplet-Based DNN Accelerators
  2026 · 半导体与先进封装 · Chiplet-based DNN accelerators provide a scalable path to balance performance and yield for modern AI workloads. However, such systems face critical challenges in area and thermal constraints. Design space optimization s…
• DS2SC-Agent: A Multi-Agent Automated Pipeline for Rapid Chiplet Model Generation
  2026 · 半导体与先进封装 · Constructing behavioral-level chiplet models (e.g., SystemC) is crucial for early-stage heterogeneous architecture exploration. Traditional manual modeling is notoriously time-consuming and error-prone. Recently, Large L…
• LEXI: Lossless Exponent Coding for Efficient Inter-Chiplet Communication in Hybrid LLMs
  2026 · 半导体与先进封装 · Data movement overheads increase the inference latency of state-of-the-art large language models (LLMs). These models commonly use the bfloat16 (BF16) format for stable training. Floating-point standards allocate eight b…
• RISCBench: Benchmarking RISC-V Orchestration Efficiency in FPGA and FPGA-Like Computing Engines
  2025 · AI Agent 生态 · Heterogeneous systems increasingly rely on RISC-V cores as orchestration engines to manage data movement, synchronization, and scheduling across accelerators and reconfigurable fabrics. Conventional performance metrics, …
• THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures
  2025 · AI 安全与对齐 · Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerge…
• AnaFlow: Agentic LLM-based Workflow for Reasoning-Driven Explainable and Sample-Efficient Analog Circuit Sizing
  2025 · AI 安全与对齐 · Analog/mixed-signal circuits are key for interfacing electronics with the physical world. Their design, however, remains a largely handcrafted process, resulting in long and error-prone design cycles. While the recent ri…
• AI-Powered Agile Analog Circuit Design and Optimization
  2025 · AI 安全与对齐 · Artificial intelligence (AI) techniques are transforming analog circuit design by automating device-level tuning and enabling system-level co-optimization. This paper integrates two approaches: (1) AI-assisted transistor…
• Scheduling Techniques of AI Models on Modern Heterogeneous Edge GPU -- A Critical Review
  2025 · AI 安全与对齐 · In recent years, the development of specialized edge computing devices has significantly increased, driven by the growing demand for AI models. These devices, such as the NVIDIA Jetson series, must efficiently handle inc…
• A Multi-Agent Generative AI Framework for IC Module-Level Verification Automation
  2025 · AI 安全与对齐 · As large language models demonstrate enormous potential in the field of Electronic Design Automation (EDA), generative AI-assisted chip design is attracting widespread attention from academia and industry. Although these…
• ConZone+: Practical Zoned Flash Storage Emulation for Consumer Devices
  2025 · 碳中和与 CCUS · To facilitate the understanding and efficient enhancement of software and hardware design for consumer-grade zoned flash storage, ConZone is proposed as the first emulator designed to model the resource constraints and a…
• A Cost-Effective Near-Storage Processing Solution for Offline Inference of Long-Context LLMs
  2025 · 碳中和与 CCUS · The computational and memory demands of large language models for generative inference present significant challenges for practical deployment. One promising solution targeting offline inference is offloading-based batch…
• Processing-in-memory for genomics workloads
  2025 · 生命科学 · Low-cost, high-throughput DNA and RNA sequencing (HTS) data is the backbone of the life sciences. Genome sequencing is now becoming a part of Predictive, Preventive, Personalized, and Participatory (termed 'P4') medicine…
• Distributed quantum computing with black-box subroutines
  2025 · 量子计算 · In this work, we propose a general protocol for distributed quantum computing that accommodates arbitrary unknown subroutines. It can be applied to scale up quantum computing through multi-chip interconnection, as well a…
• Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
  2025 · 半导体与先进封装 · The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy eff…
• Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim
  2025 · 半导体与先进封装 · This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternativ…
• Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism
  2025 · 半导体与先进封装 · Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computationa…
• MAHL: Multi-Agent LLM-Guided Hierarchical Chiplet Design with Adaptive Debugging
  2025 · 半导体与先进封装 · As program workloads (e.g., AI) increase in size and algorithmic complexity, the primary challenge lies in their high dimensionality, encompassing computing cores, array sizes, and memory hierarchies. To overcome these o…
• ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification
  2025 · 半导体与先进封装 · The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller and modular chiplets are integrated onto a single interposer. While …
• PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
  2025 · 半导体与先进封装 · 2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chipl…
• CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems
  2025 · 半导体与先进封装 · Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) model…
• FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
  2025 · 半导体与先进封装 · Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substrates are used to implement th…
• CATCH: a Cost Analysis Tool for Co-optimization of chiplet-based Heterogeneous systems
  2025 · 半导体与先进封装 · With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are opt…
• Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
  2025 · 半导体与先进封装 · Modern AI acceleration faces a fundamental challenge: conventional assumptions about memory requirements, batching effectiveness, and latency-throughput tradeoffs are systemwide generalizations that ignore the heterogene…
• Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer
  2025 · 半导体与先进封装 · Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silico…
• PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration
  2025 · 半导体与先进封装 · This paper presents a 3D-stacked chiplets based large language model (LLM) inference accelerator, consisting of non-volatile in-memory-computing processing elements (PEs) and Inter-PE Computational Network (IPCN), interc…
• Accelerating OTA Circuit Design: Transistor Sizing Based on a Transformer Model and Precomputed Lookup Tables
  2025 · 半导体与先进封装 · Device sizing is crucial for meeting performance specifications in operational transconductance amplifiers (OTAs), and this work proposes an automated sizing framework based on a transformer model. The approach first lev…
• Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture
  2024 · AI 安全与对齐 · The remarkable advancements in artificial intelligence (AI), primarily driven by deep neural networks, are facing challenges surrounding unsustainable computational trajectories, limited robustness, and a lack of explain…
• SambaNova SN40L: Scaling the AI Memory Wall with Dataflow and Composition of Experts
  2024 · AI 安全与对齐 · Monolithic large language models (LLMs) like GPT-4 have paved the way for modern generative AI applications. Training, serving, and maintaining monolithic LLMs at scale, however, remains prohibitively expensive and chall…
• Understanding the Security Benefits and Overheads of Emerging Industry Solutions to DRAM Read Disturbance
  2024 · AI 安全与对齐 · We present the first rigorous security, performance, energy, and cost analyses of the state-of-the-art on-DRAM-die read disturbance mitigation method, Per Row Activation Counting (PRAC), described in JEDEC DDR5 specifica…
• Debunking the CUDA Myth Towards GPU-based AI Systems
  2024 · AI 安全与对齐 · This paper presents a comprehensive evaluation of Intel Gaudi NPUs as an alternative to NVIDIA GPUs, which is currently the de facto standard in AI system design. First, we create a suite of microbenchmarks to compare In…
• Towards Forever Access for Implanted Brain-Computer Interfaces
  2024 · 仿生智能 · Designs for implanted brain-computer interfaces (BCIs) have increased significantly in recent years. Each device promises better clinical outcomes and quality-of-life improvements, yet due to severe and inflexible safety…
• Wet TinyML: Chemical Neural Network Using Gene Regulation and Cell Plasticity
  2024 · 脑科学 · In our earlier work, we introduced the concept of Gene Regulatory Neural Network (GRNN), which utilizes natural neural network-like structures inherent in biological cells to perform computing tasks using chemical inputs…
• The maximum storage capacity of open-loop written RRAM is around 4 bits
  2024 · 碳中和与 CCUS · There have been a plethora of research on multi-level memory devices, where the resistive random-access memory (RRAM) is a prominent example. Although it is easy to write an RRAM device into multiple (even quasi-continuo…
• Salient Store: Enabling Smart Storage for Continuous Learning Edge Servers
  2024 · 碳中和与 CCUS · As continuous learning based video analytics continue to evolve, the role of efficient edge servers in efficiently managing vast and dynamic datasets is becoming increasingly crucial. Unlike their compute architecture, s…
• An Analog and Digital Hybrid Attention Accelerator for Transformers with Charge-based In-memory Computing
  2024 · 数字孪生 · The attention mechanism is a key computing kernel of Transformers, calculating pairwise correlations across the entire input sequence. The computing complexity and frequent memory access in computing self-attention put a…
• Intelligent OPC Engineer Assistant for Semiconductor Manufacturing
  2024 · 边缘智能 · Advancements in chip design and manufacturing have enabled the processing of complex tasks such as deep learning and natural language processing, paving the way for the development of artificial general intelligence (AGI…
• The Survey of Chiplet-based Integrated Architecture: An EDA perspective
  2024 · 半导体与先进封装 · Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising so…

以 API 获取该主题全量数据

# 主题词表（含本主题的站点分布与年度分布）
curl http://data.swarmlabs.tools/api/topics.json

# 主题共现知识图谱
curl http://data.swarmlabs.tools/api/graph.json

需要按主题批量拉取、导出 BibTeX 或接入 AI Agent？查看 数据下载与格式 或 MCP 接入。